JP6568822B2 - エッチング方法 - Google Patents

エッチング方法 Download PDF

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Publication number
JP6568822B2
JP6568822B2 JP2016098205A JP2016098205A JP6568822B2 JP 6568822 B2 JP6568822 B2 JP 6568822B2 JP 2016098205 A JP2016098205 A JP 2016098205A JP 2016098205 A JP2016098205 A JP 2016098205A JP 6568822 B2 JP6568822 B2 JP 6568822B2
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JP
Japan
Prior art keywords
gas
etching
frequency power
plasma
period
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Active
Application number
JP2016098205A
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English (en)
Japanese (ja)
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JP2017208387A (ja
JP2017208387A5 (enExample
Inventor
拓 後平
拓 後平
隆一 ▲高▼島
隆一 ▲高▼島
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
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Priority to JP2016098205A priority Critical patent/JP6568822B2/ja
Priority to TW106114719A priority patent/TWI753906B/zh
Priority to KR1020170058620A priority patent/KR102180406B1/ko
Priority to US15/594,747 priority patent/US20170330759A1/en
Publication of JP2017208387A publication Critical patent/JP2017208387A/ja
Publication of JP2017208387A5 publication Critical patent/JP2017208387A5/ja
Application granted granted Critical
Publication of JP6568822B2 publication Critical patent/JP6568822B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32146—Amplitude modulation, includes pulsing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2016098205A 2016-05-16 2016-05-16 エッチング方法 Active JP6568822B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016098205A JP6568822B2 (ja) 2016-05-16 2016-05-16 エッチング方法
TW106114719A TWI753906B (zh) 2016-05-16 2017-05-04 蝕刻方法
KR1020170058620A KR102180406B1 (ko) 2016-05-16 2017-05-11 에칭 방법
US15/594,747 US20170330759A1 (en) 2016-05-16 2017-05-15 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016098205A JP6568822B2 (ja) 2016-05-16 2016-05-16 エッチング方法

Publications (3)

Publication Number Publication Date
JP2017208387A JP2017208387A (ja) 2017-11-24
JP2017208387A5 JP2017208387A5 (enExample) 2019-02-14
JP6568822B2 true JP6568822B2 (ja) 2019-08-28

Family

ID=60295352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016098205A Active JP6568822B2 (ja) 2016-05-16 2016-05-16 エッチング方法

Country Status (4)

Country Link
US (1) US20170330759A1 (enExample)
JP (1) JP6568822B2 (enExample)
KR (1) KR102180406B1 (enExample)
TW (1) TWI753906B (enExample)

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US9997374B2 (en) * 2015-12-18 2018-06-12 Tokyo Electron Limited Etching method
JP6832171B2 (ja) * 2017-01-24 2021-02-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法
WO2019035830A1 (en) * 2017-08-16 2019-02-21 Ecosense Lighting Inc MULTI-CHANNEL WHITE LIGHT DEVICE FOR HIGH-COLOR RENDERABLE WHITE LED ACCORDING LIGHT DELIVERY
CN111033701B (zh) * 2017-09-13 2023-08-04 株式会社国际电气 基板处理装置、半导体器件的制造方法以及记录介质
US12224156B2 (en) * 2018-03-01 2025-02-11 Applied Materials, Inc. Microwave plasma source for spatial plasma enhanced atomic layer deposition (PE-ALD) processing tool
US11158517B2 (en) * 2019-01-18 2021-10-26 Tokyo Electron Limited Selective plasma etching of silicon oxide relative to silicon nitride by gas pulsing
KR20200100555A (ko) * 2019-02-18 2020-08-26 도쿄엘렉트론가부시키가이샤 에칭 방법
JP7462383B2 (ja) * 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置
US11651969B2 (en) 2019-07-18 2023-05-16 Kioxia Corporation Etching method, semiconductor manufacturing apparatus, and method of manufacturing semiconductor device
US10950428B1 (en) * 2019-08-30 2021-03-16 Mattson Technology, Inc. Method for processing a workpiece
WO2021090798A1 (ja) * 2019-11-08 2021-05-14 東京エレクトロン株式会社 エッチング方法
WO2021090516A1 (ja) 2019-11-08 2021-05-14 東京エレクトロン株式会社 エッチング方法
CN114787972A (zh) * 2019-12-13 2022-07-22 朗姆研究公司 用于在弓形控制和掩模选择之间取得平衡的多态脉冲化
JP7403314B2 (ja) * 2019-12-26 2023-12-22 東京エレクトロン株式会社 エッチング方法及びエッチング装置
KR102821639B1 (ko) * 2020-12-23 2025-06-18 주식회사 원익아이피에스 반도체 소자 제조 방법
JP7312160B2 (ja) * 2020-12-28 2023-07-20 株式会社アルバック エッチング装置及びエッチング方法
CN116034455A (zh) * 2021-04-08 2023-04-28 东京毅力科创株式会社 蚀刻方法和等离子体处理系统
CN115885369A (zh) * 2021-05-07 2023-03-31 东京毅力科创株式会社 蚀刻方法以及蚀刻装置
CN115943481A (zh) * 2021-05-07 2023-04-07 东京毅力科创株式会社 基板处理方法以及基板处理装置
CN115692190A (zh) * 2021-07-28 2023-02-03 东京毅力科创株式会社 等离子体处理方法、等离子体处理装置以及系统
JP2023181081A (ja) * 2022-06-10 2023-12-21 東京エレクトロン株式会社 エッチング方法及びプラズマ処理システム
TW202401563A (zh) * 2022-06-10 2024-01-01 日商東京威力科創股份有限公司 蝕刻方法及電漿處理系統

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US9922806B2 (en) * 2015-06-23 2018-03-20 Tokyo Electron Limited Etching method and plasma processing apparatus

Also Published As

Publication number Publication date
TW201742142A (zh) 2017-12-01
KR102180406B1 (ko) 2020-11-18
JP2017208387A (ja) 2017-11-24
TWI753906B (zh) 2022-02-01
KR20170129054A (ko) 2017-11-24
US20170330759A1 (en) 2017-11-16

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