JP6566625B2 - 電子部品、電子モジュール及びこれらの製造方法、電子機器 - Google Patents

電子部品、電子モジュール及びこれらの製造方法、電子機器 Download PDF

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Publication number
JP6566625B2
JP6566625B2 JP2014226086A JP2014226086A JP6566625B2 JP 6566625 B2 JP6566625 B2 JP 6566625B2 JP 2014226086 A JP2014226086 A JP 2014226086A JP 2014226086 A JP2014226086 A JP 2014226086A JP 6566625 B2 JP6566625 B2 JP 6566625B2
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Japan
Prior art keywords
mounting
conductive pattern
electronic device
conductive
electronic
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Application number
JP2014226086A
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English (en)
Japanese (ja)
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JP2016092259A (ja
JP2016092259A5 (enExample
Inventor
高史 三宅
高史 三宅
正道 増田
正道 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014226086A priority Critical patent/JP6566625B2/ja
Priority to US14/931,148 priority patent/US10236243B2/en
Priority to CN201510746623.8A priority patent/CN105590926B/zh
Publication of JP2016092259A publication Critical patent/JP2016092259A/ja
Publication of JP2016092259A5 publication Critical patent/JP2016092259A5/ja
Application granted granted Critical
Publication of JP6566625B2 publication Critical patent/JP6566625B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2014226086A 2014-11-06 2014-11-06 電子部品、電子モジュール及びこれらの製造方法、電子機器 Active JP6566625B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014226086A JP6566625B2 (ja) 2014-11-06 2014-11-06 電子部品、電子モジュール及びこれらの製造方法、電子機器
US14/931,148 US10236243B2 (en) 2014-11-06 2015-11-03 Electronic component, electronic module, manufacturing method therefor, and electronic apparatus
CN201510746623.8A CN105590926B (zh) 2014-11-06 2015-11-05 电子组件、电子模块、其制造方法以及电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014226086A JP6566625B2 (ja) 2014-11-06 2014-11-06 電子部品、電子モジュール及びこれらの製造方法、電子機器

Publications (3)

Publication Number Publication Date
JP2016092259A JP2016092259A (ja) 2016-05-23
JP2016092259A5 JP2016092259A5 (enExample) 2017-12-14
JP6566625B2 true JP6566625B2 (ja) 2019-08-28

Family

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Family Applications (1)

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JP2014226086A Active JP6566625B2 (ja) 2014-11-06 2014-11-06 電子部品、電子モジュール及びこれらの製造方法、電子機器

Country Status (3)

Country Link
US (1) US10236243B2 (enExample)
JP (1) JP6566625B2 (enExample)
CN (1) CN105590926B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102435127B1 (ko) * 2015-07-06 2022-08-24 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 카메라 모듈
JP2018014462A (ja) 2016-07-22 2018-01-25 キヤノン株式会社 光学センサー及びスキャナユニット、画像形成装置
JP2020167366A (ja) * 2019-02-26 2020-10-08 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
JP2020167422A (ja) * 2020-06-03 2020-10-08 キヤノン株式会社 光学センサー及びスキャナユニット、画像形成装置
TWI742720B (zh) * 2020-06-12 2021-10-11 友達光電股份有限公司 顯示裝置及其製造方法
JP7512785B2 (ja) 2020-09-15 2024-07-09 株式会社デンソー 電子装置
CN112491116B (zh) * 2020-12-08 2023-04-18 歌尔科技有限公司 一种可穿戴设备及其可拆卸密封充电结构
CN113745394B (zh) * 2021-09-08 2023-10-13 Tcl华星光电技术有限公司 发光基板及其制备方法

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JPH11297876A (ja) * 1998-04-06 1999-10-29 Nec Corp ボール・グリッド・アレイの実装構造
JP2000059013A (ja) * 1998-08-05 2000-02-25 Tdk Corp 電子部品のモールド構造
JP3531573B2 (ja) 2000-03-17 2004-05-31 株式会社村田製作所 積層型セラミック電子部品およびその製造方法ならびに電子装置
JP2002164479A (ja) * 2000-11-22 2002-06-07 Niigata Seimitsu Kk 半導体装置およびその製造方法
JP2005294343A (ja) 2004-03-31 2005-10-20 Citizen Electronics Co Ltd 受光集積回路装置
US7365371B2 (en) * 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
JP2007199049A (ja) 2005-12-27 2007-08-09 Yamaha Corp 半導体装置
US7655957B2 (en) 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
JP2008277325A (ja) * 2007-04-25 2008-11-13 Canon Inc 半導体装置及び半導体装置の製造方法
US8129226B2 (en) 2007-05-10 2012-03-06 Freescale Semiconductor, Inc. Power lead-on-chip ball grid array package
US7847387B2 (en) 2007-11-16 2010-12-07 Infineon Technologies Ag Electrical device and method
JP2009188086A (ja) * 2008-02-05 2009-08-20 Seiko Instruments Inc 回路基板、これを用いた電子機器及び回路基板の製造方法
JP5625340B2 (ja) * 2009-12-07 2014-11-19 富士通セミコンダクター株式会社 半導体装置とその製造方法
KR101831692B1 (ko) 2011-08-17 2018-02-26 삼성전자주식회사 기능적으로 비대칭인 전도성 구성 요소들을 갖는 반도체 소자, 패키지 기판, 반도체 패키지, 패키지 적층 구조물 및 전자 시스템
CN103140066B (zh) * 2011-12-02 2018-01-16 深圳富泰宏精密工业有限公司 装饰性外壳制造方法
JP2015171109A (ja) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP2015176906A (ja) 2014-03-13 2015-10-05 株式会社東芝 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
CN105590926B (zh) 2018-10-02
US20160135301A1 (en) 2016-05-12
JP2016092259A (ja) 2016-05-23
US10236243B2 (en) 2019-03-19
CN105590926A (zh) 2016-05-18

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