JP6553472B2 - コンタクタ - Google Patents

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Publication number
JP6553472B2
JP6553472B2 JP2015194768A JP2015194768A JP6553472B2 JP 6553472 B2 JP6553472 B2 JP 6553472B2 JP 2015194768 A JP2015194768 A JP 2015194768A JP 2015194768 A JP2015194768 A JP 2015194768A JP 6553472 B2 JP6553472 B2 JP 6553472B2
Authority
JP
Japan
Prior art keywords
flexible substrate
contact
springs
contact portions
contactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015194768A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017067662A (ja
JP2017067662A5 (enExample
Inventor
孝弘 永田
孝弘 永田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Priority to JP2015194768A priority Critical patent/JP6553472B2/ja
Priority to US15/762,881 priority patent/US10317430B2/en
Priority to PCT/JP2016/076208 priority patent/WO2017056879A1/ja
Priority to TW105131583A priority patent/TWI677686B/zh
Publication of JP2017067662A publication Critical patent/JP2017067662A/ja
Publication of JP2017067662A5 publication Critical patent/JP2017067662A5/ja
Application granted granted Critical
Publication of JP6553472B2 publication Critical patent/JP6553472B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
    • H01R12/87—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
JP2015194768A 2015-09-30 2015-09-30 コンタクタ Active JP6553472B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015194768A JP6553472B2 (ja) 2015-09-30 2015-09-30 コンタクタ
US15/762,881 US10317430B2 (en) 2015-09-30 2016-09-06 Contactor with a plurality of springs and contact point portions urged by the springs
PCT/JP2016/076208 WO2017056879A1 (ja) 2015-09-30 2016-09-06 コンタクタ
TW105131583A TWI677686B (zh) 2015-09-30 2016-09-30 接觸器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015194768A JP6553472B2 (ja) 2015-09-30 2015-09-30 コンタクタ

Publications (3)

Publication Number Publication Date
JP2017067662A JP2017067662A (ja) 2017-04-06
JP2017067662A5 JP2017067662A5 (enExample) 2018-10-11
JP6553472B2 true JP6553472B2 (ja) 2019-07-31

Family

ID=58423420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015194768A Active JP6553472B2 (ja) 2015-09-30 2015-09-30 コンタクタ

Country Status (4)

Country Link
US (1) US10317430B2 (enExample)
JP (1) JP6553472B2 (enExample)
TW (1) TWI677686B (enExample)
WO (1) WO2017056879A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207424024U (zh) * 2017-11-23 2018-05-29 周婷 电导探针的弹性体结构
US10931058B2 (en) * 2018-09-24 2021-02-23 Apple Inc. Gaskets for sealing spring-loaded contacts
WO2021064788A1 (ja) * 2019-09-30 2021-04-08 三菱電機株式会社 検査治具
KR102080832B1 (ko) * 2019-10-02 2020-02-24 황동원 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓
US11714105B2 (en) * 2021-03-30 2023-08-01 Enplas Corporation Socket and inspection socket
US11831093B2 (en) * 2021-03-30 2023-11-28 Cisco Technology, Inc. Socket locator
JP2023031691A (ja) * 2021-08-25 2023-03-09 富士通株式会社 半導体装置、ソケット及び電子機器
US12048083B2 (en) * 2021-12-03 2024-07-23 Xilinx, Inc. Micro device with adaptable thermal management device

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
JPH0540131A (ja) * 1991-08-06 1993-02-19 Nec Corp 試験用治具
JP3653131B2 (ja) * 1995-12-28 2005-05-25 日本発条株式会社 導電性接触子
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
US5955888A (en) * 1997-09-10 1999-09-21 Xilinx, Inc. Apparatus and method for testing ball grid array packaged integrated circuits
JP4167202B2 (ja) * 1998-07-10 2008-10-15 日本発条株式会社 導電性接触子
US6900651B1 (en) * 1998-07-10 2005-05-31 Nhk Spring Co., Ltd. Electroconductive contact unit assembly
JP2000180506A (ja) 1998-12-15 2000-06-30 Nec Corp 半導体装置検査用コンタクト装置
DE19983903T1 (de) * 1999-11-17 2002-02-28 Advantest Corp IC-Sockel und IC-Testgerät
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
US20100167561A1 (en) * 2003-04-11 2010-07-01 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
JP4271133B2 (ja) * 2004-12-10 2009-06-03 アルプス電気株式会社 中継基板
US20070018666A1 (en) * 2005-07-22 2007-01-25 Nasser Barabi Spring contact pin for an IC chip tester
JP2007078456A (ja) * 2005-09-13 2007-03-29 Yokogawa Electric Corp Ｉｃソケット及びこれを用いたｉｃテスタ
JP4842640B2 (ja) 2005-12-28 2011-12-21 日本発條株式会社 プローブカードおよび検査方法
CN101109768A (zh) * 2006-07-17 2008-01-23 范伟芳 改进的模块化弹性探针结构
JP4832213B2 (ja) * 2006-08-18 2011-12-07 株式会社ヨコオ プローブ
JP2009094006A (ja) * 2007-10-11 2009-04-30 Enplas Corp 電気部品用ソケットの取付構造
JP5008582B2 (ja) 2008-02-04 2012-08-22 株式会社ヨコオ コンタクトプローブ
US8808037B2 (en) * 2009-10-12 2014-08-19 Iwin Co., Ltd. Slidable pogo pin
JP5960383B2 (ja) * 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 接触子ホルダ
US8506307B2 (en) * 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
US9702905B2 (en) * 2011-08-02 2017-07-11 Nhk Spring Co., Ltd. Probe unit

Also Published As

Publication number Publication date
JP2017067662A (ja) 2017-04-06
US10317430B2 (en) 2019-06-11
TW201719176A (zh) 2017-06-01
TWI677686B (zh) 2019-11-21
US20180275167A1 (en) 2018-09-27
WO2017056879A1 (ja) 2017-04-06

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