JP2017067662A - コンタクタ - Google Patents
コンタクタ Download PDFInfo
- Publication number
- JP2017067662A JP2017067662A JP2015194768A JP2015194768A JP2017067662A JP 2017067662 A JP2017067662 A JP 2017067662A JP 2015194768 A JP2015194768 A JP 2015194768A JP 2015194768 A JP2015194768 A JP 2015194768A JP 2017067662 A JP2017067662 A JP 2017067662A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contactor
- flexible substrate
- spring
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/87—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
10 フレキシブル基板、11 ピン挿通穴、12 ストッパ用穴、13 貫通穴、
20 接点部、21 本体部、21a 鍔部、22 接触用凸部、23 位置合わせ用凸部(脚部)、
30 スプリング、31 平坦巻き部、32 斜め密着巻き部、33 連絡部、
40 ハウジング、41 貫通穴、42 ストッパ凸部、
50 ガイド、51 ガイド穴、60 位置決めピン、G 隙間
Claims (11)
- フレキシブル基板と、前記フレキシブル基板に設けられた複数の接点部と、各々の接点部を対象物側に向けて付勢する複数のスプリングと、前記複数のスプリングを収容するハウジングと、を備える、コンタクタ。
- 各々のスプリングは、少なくとも前記接点部側の端部に平坦巻き部を有する、請求項1に記載のコンタクタ。
- 各々のスプリングは、自身の長さ方向の中間部に斜め密着巻き部を有する、請求項1又は2に記載のコンタクタ。
- 各々のスプリングは、少なくとも前記接点部側の端部に平坦巻き部を有し、かつ自身の長さ方向の中間部に斜め密着巻き部を有し、開放状態において前記平坦巻き部と前記斜め密着巻き部との間に隙間が存在する、請求項1に記載のコンタクタ。
- 各々のスプリングが所定長圧縮されると、前記隙間が無くなって前記平坦巻き部と前記斜め密着巻き部とが相互に接触する、請求項4に記載のコンタクタ。
- 各々の接点部は、前記スプリングの内側に延びる位置合わせ用凸部を有する、請求項1から5のいずれか一項に記載のコンタクタ。
- 前記位置合わせ用凸部と前記スプリングとの係合により、前記スプリングからの前記接点部の抜けを防止する抜止め力が発生する、請求項6に記載のコンタクタ。
- 前記ハウジングは、前記フレキシブル基板を貫通して前記フレキシブル基板の一面側から他面側に延びるストッパ凸部を有する、請求項1から7のいずれか一項に記載のコンタクタ。
- 前記フレキシブル基板は、各々の接点部の周囲に、前記接点部の接触先の高低差による自身の撓みを防止するための貫通穴を有する、請求項1から8のいずれか一項に記載のコンタクタ。
- 前記ハウジングに設けられて前記フレキシブル基板を貫通し、前記ハウジングに対して前記フレキシブル基板を位置決めする複数の位置決めピンを有し、前記フレキシブル基板が前記複数の位置決めピンにより自身の面垂直方向に移動可能に支持されている、請求項1から9のいずれか一項に記載のコンタクタ。
- 前記フレキシブル基板は、各々の位置決めピンを挿通する複数の長穴を有し、各々の長穴は、短手方向には前記位置決めピンと略同一寸法であり、長手方向には前記位置決めピンより大きい寸法である、請求項10に記載のコンタクタ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015194768A JP6553472B2 (ja) | 2015-09-30 | 2015-09-30 | コンタクタ |
US15/762,881 US10317430B2 (en) | 2015-09-30 | 2016-09-06 | Contactor with a plurality of springs and contact point portions urged by the springs |
PCT/JP2016/076208 WO2017056879A1 (ja) | 2015-09-30 | 2016-09-06 | コンタクタ |
TW105131583A TWI677686B (zh) | 2015-09-30 | 2016-09-30 | 接觸器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015194768A JP6553472B2 (ja) | 2015-09-30 | 2015-09-30 | コンタクタ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017067662A true JP2017067662A (ja) | 2017-04-06 |
JP2017067662A5 JP2017067662A5 (ja) | 2018-10-11 |
JP6553472B2 JP6553472B2 (ja) | 2019-07-31 |
Family
ID=58423420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015194768A Active JP6553472B2 (ja) | 2015-09-30 | 2015-09-30 | コンタクタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US10317430B2 (ja) |
JP (1) | JP6553472B2 (ja) |
TW (1) | TWI677686B (ja) |
WO (1) | WO2017056879A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190001280U (ko) * | 2017-11-23 | 2019-05-31 | 팅 초우 | 전도성 프로브의 탄성중합체 구조 |
JPWO2021064788A1 (ja) * | 2019-09-30 | 2021-04-08 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10931058B2 (en) * | 2018-09-24 | 2021-02-23 | Apple Inc. | Gaskets for sealing spring-loaded contacts |
KR102080832B1 (ko) * | 2019-10-02 | 2020-02-24 | 황동원 | 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓 |
US11714105B2 (en) * | 2021-03-30 | 2023-08-01 | Enplas Corporation | Socket and inspection socket |
US11831093B2 (en) * | 2021-03-30 | 2023-11-28 | Cisco Technology, Inc. | Socket locator |
US20230180379A1 (en) * | 2021-12-03 | 2023-06-08 | Xilinx, Inc. | Micro device with adaptable thermal management device |
Citations (8)
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JPH0540131A (ja) * | 1991-08-06 | 1993-02-19 | Nec Corp | 試験用治具 |
JPH09184852A (ja) * | 1995-12-28 | 1997-07-15 | Nhk Spring Co Ltd | 導電性接触子 |
JP2004309490A (ja) * | 1998-07-10 | 2004-11-04 | Nhk Spring Co Ltd | 導電性接触子 |
JP2006165414A (ja) * | 2004-12-10 | 2006-06-22 | Alps Electric Co Ltd | 中継基板 |
JP2007078456A (ja) * | 2005-09-13 | 2007-03-29 | Yokogawa Electric Corp | Icソケット及びこれを用いたicテスタ |
JP2007178405A (ja) * | 2005-12-28 | 2007-07-12 | Nhk Spring Co Ltd | プローブカード |
JP2009094006A (ja) * | 2007-10-11 | 2009-04-30 | Enplas Corp | 電気部品用ソケットの取付構造 |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
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JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
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CN1246698C (zh) * | 1998-07-10 | 2006-03-22 | 日本发条株式会社 | 导电的接触单元 |
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US20070018666A1 (en) * | 2005-07-22 | 2007-01-25 | Nasser Barabi | Spring contact pin for an IC chip tester |
CN101109768A (zh) * | 2006-07-17 | 2008-01-23 | 范伟芳 | 改进的模块化弹性探针结构 |
JP4832213B2 (ja) * | 2006-08-18 | 2011-12-07 | 株式会社ヨコオ | プローブ |
JP5008582B2 (ja) | 2008-02-04 | 2012-08-22 | 株式会社ヨコオ | コンタクトプローブ |
US8808037B2 (en) * | 2009-10-12 | 2014-08-19 | Iwin Co., Ltd. | Slidable pogo pin |
JP5960383B2 (ja) * | 2010-06-01 | 2016-08-02 | スリーエム イノベイティブ プロパティズ カンパニー | 接触子ホルダ |
US8506307B2 (en) * | 2010-12-02 | 2013-08-13 | Interconnect Devices, Inc. | Electrical connector with embedded shell layer |
JPWO2013018809A1 (ja) * | 2011-08-02 | 2015-03-05 | 日本発條株式会社 | プローブユニット |
-
2015
- 2015-09-30 JP JP2015194768A patent/JP6553472B2/ja active Active
-
2016
- 2016-09-06 WO PCT/JP2016/076208 patent/WO2017056879A1/ja active Application Filing
- 2016-09-06 US US15/762,881 patent/US10317430B2/en not_active Expired - Fee Related
- 2016-09-30 TW TW105131583A patent/TWI677686B/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0540131A (ja) * | 1991-08-06 | 1993-02-19 | Nec Corp | 試験用治具 |
JPH09184852A (ja) * | 1995-12-28 | 1997-07-15 | Nhk Spring Co Ltd | 導電性接触子 |
JP2004309490A (ja) * | 1998-07-10 | 2004-11-04 | Nhk Spring Co Ltd | 導電性接触子 |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
JP2006165414A (ja) * | 2004-12-10 | 2006-06-22 | Alps Electric Co Ltd | 中継基板 |
JP2007078456A (ja) * | 2005-09-13 | 2007-03-29 | Yokogawa Electric Corp | Icソケット及びこれを用いたicテスタ |
JP2007178405A (ja) * | 2005-12-28 | 2007-07-12 | Nhk Spring Co Ltd | プローブカード |
JP2009094006A (ja) * | 2007-10-11 | 2009-04-30 | Enplas Corp | 電気部品用ソケットの取付構造 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190001280U (ko) * | 2017-11-23 | 2019-05-31 | 팅 초우 | 전도성 프로브의 탄성중합체 구조 |
KR200492663Y1 (ko) | 2017-11-23 | 2020-11-20 | 팅 초우 | 전도성 프로브의 탄성중합체 구조 |
JPWO2021064788A1 (ja) * | 2019-09-30 | 2021-04-08 | ||
US11971320B2 (en) | 2019-09-30 | 2024-04-30 | Mitsubishi Electric Corporation | Inspection jig |
Also Published As
Publication number | Publication date |
---|---|
TWI677686B (zh) | 2019-11-21 |
US10317430B2 (en) | 2019-06-11 |
WO2017056879A1 (ja) | 2017-04-06 |
US20180275167A1 (en) | 2018-09-27 |
TW201719176A (zh) | 2017-06-01 |
JP6553472B2 (ja) | 2019-07-31 |
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