CN207424024U - 电导探针的弹性体结构 - Google Patents
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- G01R1/02—General constructional details
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- G01R1/067—Measuring probes
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- H—ELECTRICITY
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0046—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00
- G01R19/0061—Measuring currents of particle-beams, currents from electron multipliers, photocurrents, ion currents; Measuring in plasmas
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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- H—ELECTRICITY
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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Abstract
本实用新型提供一种电导探针的弹性体结构,主要包含一弹性体,该弹性体具有一第一接导部及一第二接导部,其中该第一接导部或该第二接导部的任一末端面为削平面形态;如此创新独特设计,使本实用新型弹性体其与信号终端接触的第一接导部及第二接导部的线圈末端面分别为削平面,故能增加与信号起始端及信号终端等构部接触面积,进而增加电子电流及信号传输的稳定性,以及达到降低电阻、消除电感效应的效用。
Description
技术领域
本实用新型涉及一种电导探针的弹性体结构,尤其是一种利用探针作电子电流及信号传输的创新结构设计。
背景技术
目前探针已广泛应用于各种测试领域,如印刷电路板测试、晶圆测试、IC封装测试、通讯产品及液晶面板作电子电流及信号测试等,都须探针做为测试媒介。除此之外,现阶段探针也逐渐朝精细的电子元件发展,主要是因为探针尺寸规格愈来愈精细且具有导电性、低电阻的优点,因此将赋予探针高频信号传输的功,而可做为手机等无线通讯产品的收发天线及各类电子产品充电器、连接器的衔接接点。未来探针将不再只扮演测试功能的角色,也将于电子元件的领域上占领不可或缺的位置。惟就目前测试用探针的技术领域而言,其产品结构普遍存在构件组成繁杂、外形体积大,以及电阻值较大等缺失,兹例一案例说明于后:首先请参阅图1,该现有探针包括一弹性体1a,该弹性体1a的两自由端分别设有一接导端2a,令该弹性体1a二端的接导端2a分别与信号起始端21a(如探针卡的基板适处),以及信号终端22a(如IC板背面焊接的锡球)作接触。当进行电子信号传输程序时,因为该弹性体1a整体线圈的接导端2a的线圈末端面分别为圆弧面,故降低与信号起始端21a及信号终端22a等构部接触面积,不仅电阻值与接触面积呈反比,且也因电感效应大而影响信号的传输效率与品质,进而影响信号的传输效率与品质,实有进一步改善的必要。
是以,针对上述现有结构所存在的问题点,如何开发一种更具理想实用性的创新结构,实使用消费者所殷切企盼,也系相关业者须努力研发突破的目标及方向。有鉴于此,本实用新型设计人本于多年从事相关产品的制造开发与设计经验,针对上述的目标,详加设计与审慎评估后,终得一确具实用性的本实用新型。
实用新型内容
即,本实用新型的主要目的,提供一种电导探针的弹性体结构,解决的问题点是针对现有探针在进行电子信号传输程序时,因为该弹性体整体线圈的接导端的线圈末端面分别为圆弧面,故降低与信号起始端及信号终端等构部接触面积,不仅电阻值与接触面积呈反比,且也因电感效应大而影响信号的传输效率与品质,进而影响信号的传输效率与品质,实有进一步改善的问题点加以改良突破。
为实现上述目的,本实用新型采用的技术方案是:
一种电导探针的弹性体结构,所述弹性体应用于传输电子的电流及信号用的探针;其特征在于:该弹性体具有的两自由端分别界定为一第一接导部及一第二接导部,该第一接导部及该第二接导部之间圈绕着一具有弹性回复力的弹性段,该弹性段能够经压缩后产生一弹性回复力;其中该第一接导部与该第二接导部的至少一个末端面为削平面形态。
所述的电导探针的弹性体结构,其中:该第一接导部及该第二接导部是密集接触的线圈,或是呈弹松状的线圈。
所述的电导探针的弹性体结构,其中:仅该第一接导部的末端面为削平面形态。
所述的电导探针的弹性体结构,其中:仅该第二接导部的末端面为削平面形态。
所述的电导探针的弹性体结构,其中:该第一接导部及该第二接导部的末端面都为削平面形态。
如此创新独特设计,使本实用新型弹性体其与信号终端接触的第一接导部及第二接导部的线圈末端面分别为削平面,故能增加与信号起始端及信号终端等构部接触面积,进而增加传输的稳定性,以及达到降低电阻、消除电感效应的效用。
附图说明
图1是现有探针传输电子信号时弹簧呈现的状态示意图。
图2是本实用新型电导探针的弹性体结构的立体图。
图3是本实用新型电导探针的弹性体结构的侧视图。
图4是本实用新型电导探针的弹性体结构的探针传输电子信号时弹簧呈现的状态示意图。
附图标记说明:〔现有部份〕1a弹性体;2a接导端;21a信号起始端;22a信号终端;〔本实用新型〕10弹性体;11第一接导部;11'第二接导部;12削平面;13弹性段;21信号起始端;22信号终端。
具体实施方式
请参阅图2~图4所示,系本实用新型电导探针的弹性体结构的较佳实施例,惟此等实施例仅供说明之用,在专利申请上并不受此结构的限制;其包含:
一弹性体10,所述弹性体10应用于传输电子电流及信号用的探针,其中该弹性体10具有两自由端分别界定为一第一接导部11及一第二接导部11',该第一接导部11及该第二接导部11'之间圈绕一具有弹性回复力的弹性段13,该弹性段13可经压缩后产生一弹性回复力;其中该第一接导部11或该第二接导部11'的任一末端面为削平面12形态,所述削平面12是在该第一接导部11或该第二接导部11'的任一末端面经由平面研磨加工,由原来的圆弧线径断面转变成具有水平切削面的线径断面,即为所述削平面12。
较佳地,该第一接导部11及该第二接导部11'的线圈构造可呈密集接触的形态,或呈弹松状的结构变化。
较佳地,其中仅该第一接导部11的末端面为削平面12形态。
较佳地,其中仅该第二接导部11'的末端面为削平面12形态。
较佳地,其中该第一接导部11及该第二接导部11'的末端面都为削平面12形态。
当利用上述的探针结构应用于电子信号的传输作业时,系如图4所示,将探针置于需传输电子信号的介面机构中,例如晶圆测试用探针卡等装置内,令该弹性体10二端的第一接导部11及该第二接导部11'分别与信号起始端21(如探针卡的基板适处)作面接触,以及信号终端22(如IC板背面焊接的锡球)作环周线接触。当进行电子信号传输程序时,因为该弹性体10整体线圈结构经压缩后系呈现完全密集的一体式型态,故可供电子信号迅速通过,且因为其与信号终端接触的第一接导部11及第二接导部11'的线圈末端面分别为削平面12,故能增加与信号起始端21及信号终端22等构部接触面积,进而增加传输的稳定性,以及达到降低电阻、消除电感效应的效用。
归纳上述的说明,凭借本实用新型上述结构的设计,可有效克服现有技术所面临的缺失,进一步具有上述众多的优点及实用价值,因此本实用新型为一创意极佳的创作。
Claims (5)
1.一种电导探针的弹性体结构,所述弹性体应用于传输电子的电流及信号用的探针;其特征在于:该弹性体具有的两自由端分别界定为一第一接导部及一第二接导部,该第一接导部及该第二接导部之间圈绕着一具有弹性回复力的弹性段,该弹性段能够经压缩后产生一弹性回复力;其中该第一接导部与该第二接导部的至少一个末端面为削平面形态。
2.如权利要求1所述的电导探针的弹性体结构,其特征在于:该第一接导部及该第二接导部是密集接触的线圈,或是呈弹松状的线圈。
3.如权利要求1所述的电导探针的弹性体结构,其特征在于:仅该第一接导部的末端面为削平面形态。
4.如权利要求1所述的电导探针的弹性体结构,其特征在于:仅该第二接导部的末端面为削平面形态。
5.如权利要求1所述的电导探针的弹性体结构,其特征在于:该第一接导部及该第二接导部的末端面都为削平面形态。
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Application Number | Priority Date | Filing Date | Title |
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CN201721586494.1U CN207424024U (zh) | 2017-11-23 | 2017-11-23 | 电导探针的弹性体结构 |
US16/181,323 US10637174B2 (en) | 2017-11-23 | 2018-11-05 | Elastomer structure of conductivity probe |
KR2020180005030U KR200492663Y1 (ko) | 2017-11-23 | 2018-11-06 | 전도성 프로브의 탄성중합체 구조 |
JP2018004313U JP3219791U (ja) | 2017-11-23 | 2018-11-07 | 伝導プローブの弾性体構造 |
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CN201721586494.1U CN207424024U (zh) | 2017-11-23 | 2017-11-23 | 电导探针的弹性体结构 |
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JP3342789B2 (ja) * | 1995-10-25 | 2002-11-11 | 日本発条株式会社 | 導電性接触子 |
JP3414593B2 (ja) * | 1996-06-28 | 2003-06-09 | 日本発条株式会社 | 導電性接触子 |
JP3017180B1 (ja) | 1998-10-09 | 2000-03-06 | 九州日本電気株式会社 | コンタクトピン及びソケット |
JP2001296312A (ja) | 2000-04-17 | 2001-10-26 | Yamaichi Electronics Co Ltd | 接触子および接触子の製造方法 |
JP2003014779A (ja) * | 2001-07-02 | 2003-01-15 | Nhk Spring Co Ltd | 導電性接触子 |
CN1284283C (zh) * | 2001-07-13 | 2006-11-08 | 日本发条株式会社 | 接触器 |
US7019222B2 (en) * | 2002-01-17 | 2006-03-28 | Ardent Concepts, Inc. | Compliant electrical contact assembly |
US6720511B2 (en) * | 2002-09-05 | 2004-04-13 | Litton Systems, Inc. | One-piece semi-rigid electrical contact |
US6846184B2 (en) * | 2003-01-24 | 2005-01-25 | High Connection Density Inc. | Low inductance electrical contacts and LGA connector system |
TW573844U (en) * | 2003-06-13 | 2004-01-21 | Hon Hai Prec Ind Co Ltd | Electrical connector contact |
KR100679663B1 (ko) * | 2005-10-31 | 2007-02-06 | (주)티에스이 | 반도체 디바이스 테스트 소켓 |
US9225095B2 (en) * | 2006-12-19 | 2015-12-29 | Gordon Van Ekstrom | Ball plunger-style connector assembly for electrical connections |
KR100947281B1 (ko) * | 2007-11-16 | 2010-03-16 | 주식회사 오킨스전자 | 테스트 소켓용 프로브 접촉자 및 이를 포함하는 테스트소켓 |
WO2010008257A2 (ko) * | 2008-07-18 | 2010-01-21 | Lee Jae Hak | 스프링 조립체 및 그를 이용한 테스트 소켓 |
KR101106506B1 (ko) * | 2008-08-07 | 2012-01-20 | 박상량 | 평판 접이식 코일스프링, 이를 이용한 포고핀 및 그 제조방법 |
US8118604B2 (en) * | 2010-05-06 | 2012-02-21 | Hon Hai Precision Ind. Co., Ltd. | Socket connector having electrical element supported by insulated elastomer |
JP5567523B2 (ja) | 2010-05-14 | 2014-08-06 | 日本電子材料株式会社 | 接続ピン |
EP2874233B1 (en) * | 2013-11-14 | 2017-01-25 | Joinset Co., Ltd | Surface-mount type electric connecting terminal, and electronic module unit and circuit board using the same |
JP6527762B2 (ja) * | 2015-06-19 | 2019-06-05 | 日本電子材料株式会社 | プローブ |
KR101793717B1 (ko) | 2015-08-07 | 2017-11-03 | 조인셋 주식회사 | 전기접속단자 |
JP6553472B2 (ja) | 2015-09-30 | 2019-07-31 | 株式会社ヨコオ | コンタクタ |
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- 2018-11-05 US US16/181,323 patent/US10637174B2/en active Active
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US20190157789A1 (en) | 2019-05-23 |
KR200492663Y1 (ko) | 2020-11-20 |
KR20190001280U (ko) | 2019-05-31 |
JP3219791U (ja) | 2019-01-24 |
US10637174B2 (en) | 2020-04-28 |
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