JP6552450B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6552450B2
JP6552450B2 JP2016083444A JP2016083444A JP6552450B2 JP 6552450 B2 JP6552450 B2 JP 6552450B2 JP 2016083444 A JP2016083444 A JP 2016083444A JP 2016083444 A JP2016083444 A JP 2016083444A JP 6552450 B2 JP6552450 B2 JP 6552450B2
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JP
Japan
Prior art keywords
semiconductor element
base plate
case
semiconductor device
control
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JP2016083444A
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English (en)
Japanese (ja)
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JP2017195677A (ja
JP2017195677A5 (enExample
Inventor
晴彦 村上
晴彦 村上
玲 米山
玲 米山
義孝 木村
義孝 木村
孝之 白濱
孝之 白濱
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2016083444A priority Critical patent/JP6552450B2/ja
Priority to US15/386,764 priority patent/US10062632B2/en
Priority to DE102017206195.2A priority patent/DE102017206195B4/de
Priority to CN201710258116.9A priority patent/CN107452688B/zh
Publication of JP2017195677A publication Critical patent/JP2017195677A/ja
Publication of JP2017195677A5 publication Critical patent/JP2017195677A5/ja
Application granted granted Critical
Publication of JP6552450B2 publication Critical patent/JP6552450B2/ja
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    • H10W76/12—
    • H10W40/22—
    • H10W40/251—
    • H10W72/50—
    • H10W76/15—
    • H10W90/00—
    • H10W40/255—
    • H10W40/28—
    • H10W72/5524—
    • H10W76/47—
    • H10W90/754—

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
JP2016083444A 2016-04-19 2016-04-19 半導体装置 Active JP6552450B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016083444A JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置
US15/386,764 US10062632B2 (en) 2016-04-19 2016-12-21 Semiconductor device having improved heat dissipation efficiency
DE102017206195.2A DE102017206195B4 (de) 2016-04-19 2017-04-11 Halbleitervorrichtung
CN201710258116.9A CN107452688B (zh) 2016-04-19 2017-04-19 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016083444A JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2017195677A JP2017195677A (ja) 2017-10-26
JP2017195677A5 JP2017195677A5 (enExample) 2018-07-05
JP6552450B2 true JP6552450B2 (ja) 2019-07-31

Family

ID=59980925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016083444A Active JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置

Country Status (4)

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US (1) US10062632B2 (enExample)
JP (1) JP6552450B2 (enExample)
CN (1) CN107452688B (enExample)
DE (1) DE102017206195B4 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7038645B2 (ja) * 2018-12-06 2022-03-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
KR20210112719A (ko) * 2020-03-06 2021-09-15 에스케이하이닉스 주식회사 반도체 모듈, 이를 포함하는 온도 조절 시스템, 및 온도 조절 방법
DE112020007426T5 (de) 2020-07-14 2023-04-27 Mitsubishi Electric Corporation Halbleitereinrichtung und stromrichtereinrichtung
CN112467957A (zh) * 2020-10-10 2021-03-09 山东斯力微电子有限公司 一种智能型大功率igbt模块
CN112864112A (zh) * 2021-01-19 2021-05-28 安徽安晶半导体有限公司 一种绝缘型大功率半导体模块
US20240105528A1 (en) * 2021-01-29 2024-03-28 Kyocera Corporation Semiconductor package and semiconductor electronic device
JP2024075016A (ja) * 2022-11-22 2024-06-03 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51160119U (enExample) * 1975-06-14 1976-12-20
JPS583784U (ja) * 1981-07-01 1983-01-11 株式会社日立ホームテック 自動車用変換器
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH04138693A (ja) * 1990-09-29 1992-05-13 Toshiba Lighting & Technol Corp 放電灯点灯装置
JPH09211266A (ja) * 1996-01-30 1997-08-15 Hitachi Ltd 半導体装置及び光通信モジュール
JPH10229146A (ja) * 1997-02-17 1998-08-25 Seiko Epson Corp 半導体装置
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
JP4044265B2 (ja) * 2000-05-16 2008-02-06 三菱電機株式会社 パワーモジュール
JP3764687B2 (ja) * 2002-02-18 2006-04-12 三菱電機株式会社 電力半導体装置及びその製造方法
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
JP2006121861A (ja) 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
CN101214918B (zh) * 2007-01-04 2012-04-18 菱生精密工业股份有限公司 用于微机电封盖制程的封装结构
US9052724B2 (en) * 2012-08-07 2015-06-09 International Business Machines Corporation Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
JP6119313B2 (ja) * 2013-03-08 2017-04-26 富士電機株式会社 半導体装置
JP6120704B2 (ja) * 2013-07-03 2017-04-26 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN107452688B (zh) 2020-09-25
JP2017195677A (ja) 2017-10-26
DE102017206195B4 (de) 2020-11-26
DE102017206195A1 (de) 2017-10-19
US20170301603A1 (en) 2017-10-19
CN107452688A (zh) 2017-12-08
US10062632B2 (en) 2018-08-28

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