JP6552450B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6552450B2
JP6552450B2 JP2016083444A JP2016083444A JP6552450B2 JP 6552450 B2 JP6552450 B2 JP 6552450B2 JP 2016083444 A JP2016083444 A JP 2016083444A JP 2016083444 A JP2016083444 A JP 2016083444A JP 6552450 B2 JP6552450 B2 JP 6552450B2
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JP
Japan
Prior art keywords
semiconductor element
base plate
case
semiconductor device
control
Prior art date
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Application number
JP2016083444A
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English (en)
Japanese (ja)
Other versions
JP2017195677A (ja
JP2017195677A5 (enExample
Inventor
晴彦 村上
晴彦 村上
玲 米山
玲 米山
義孝 木村
義孝 木村
孝之 白濱
孝之 白濱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2016083444A priority Critical patent/JP6552450B2/ja
Priority to US15/386,764 priority patent/US10062632B2/en
Priority to DE102017206195.2A priority patent/DE102017206195B4/de
Priority to CN201710258116.9A priority patent/CN107452688B/zh
Publication of JP2017195677A publication Critical patent/JP2017195677A/ja
Publication of JP2017195677A5 publication Critical patent/JP2017195677A5/ja
Application granted granted Critical
Publication of JP6552450B2 publication Critical patent/JP6552450B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
JP2016083444A 2016-04-19 2016-04-19 半導体装置 Active JP6552450B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016083444A JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置
US15/386,764 US10062632B2 (en) 2016-04-19 2016-12-21 Semiconductor device having improved heat dissipation efficiency
DE102017206195.2A DE102017206195B4 (de) 2016-04-19 2017-04-11 Halbleitervorrichtung
CN201710258116.9A CN107452688B (zh) 2016-04-19 2017-04-19 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016083444A JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2017195677A JP2017195677A (ja) 2017-10-26
JP2017195677A5 JP2017195677A5 (enExample) 2018-07-05
JP6552450B2 true JP6552450B2 (ja) 2019-07-31

Family

ID=59980925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016083444A Active JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置

Country Status (4)

Country Link
US (1) US10062632B2 (enExample)
JP (1) JP6552450B2 (enExample)
CN (1) CN107452688B (enExample)
DE (1) DE102017206195B4 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7038645B2 (ja) * 2018-12-06 2022-03-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
KR20210112719A (ko) * 2020-03-06 2021-09-15 에스케이하이닉스 주식회사 반도체 모듈, 이를 포함하는 온도 조절 시스템, 및 온도 조절 방법
US12417951B2 (en) 2020-07-14 2025-09-16 Mitsubishi Electric Corporation Semiconductor device and power conversion device
CN112467957A (zh) * 2020-10-10 2021-03-09 山东斯力微电子有限公司 一种智能型大功率igbt模块
CN112864112A (zh) * 2021-01-19 2021-05-28 安徽安晶半导体有限公司 一种绝缘型大功率半导体模块
CN116888727A (zh) * 2021-01-29 2023-10-13 京瓷株式会社 半导体封装体以及半导体电子装置
JP2024075016A (ja) * 2022-11-22 2024-06-03 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51160119U (enExample) * 1975-06-14 1976-12-20
JPS583784U (ja) * 1981-07-01 1983-01-11 株式会社日立ホームテック 自動車用変換器
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH04138693A (ja) * 1990-09-29 1992-05-13 Toshiba Lighting & Technol Corp 放電灯点灯装置
JPH09211266A (ja) * 1996-01-30 1997-08-15 Hitachi Ltd 半導体装置及び光通信モジュール
JPH10229146A (ja) * 1997-02-17 1998-08-25 Seiko Epson Corp 半導体装置
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
JP4044265B2 (ja) * 2000-05-16 2008-02-06 三菱電機株式会社 パワーモジュール
JP3764687B2 (ja) * 2002-02-18 2006-04-12 三菱電機株式会社 電力半導体装置及びその製造方法
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
JP2006121861A (ja) 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
CN101214918B (zh) * 2007-01-04 2012-04-18 菱生精密工业股份有限公司 用于微机电封盖制程的封装结构
US9052724B2 (en) * 2012-08-07 2015-06-09 International Business Machines Corporation Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
JP6119313B2 (ja) * 2013-03-08 2017-04-26 富士電機株式会社 半導体装置
JP6120704B2 (ja) * 2013-07-03 2017-04-26 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN107452688A (zh) 2017-12-08
US10062632B2 (en) 2018-08-28
JP2017195677A (ja) 2017-10-26
US20170301603A1 (en) 2017-10-19
CN107452688B (zh) 2020-09-25
DE102017206195B4 (de) 2020-11-26
DE102017206195A1 (de) 2017-10-19

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