DE102017206195B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102017206195B4
DE102017206195B4 DE102017206195.2A DE102017206195A DE102017206195B4 DE 102017206195 B4 DE102017206195 B4 DE 102017206195B4 DE 102017206195 A DE102017206195 A DE 102017206195A DE 102017206195 B4 DE102017206195 B4 DE 102017206195B4
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DE
Germany
Prior art keywords
semiconductor element
base plate
control
housing
semiconductor device
Prior art date
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Active
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DE102017206195.2A
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German (de)
English (en)
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DE102017206195A1 (de
Inventor
Haruhiko Murakami
Rei YONEYAMA
Yoshitaka Kimura
Takayuki Shirahama
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of DE102017206195A1 publication Critical patent/DE102017206195A1/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
DE102017206195.2A 2016-04-19 2017-04-11 Halbleitervorrichtung Active DE102017206195B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-083444 2016-04-19
JP2016083444A JP6552450B2 (ja) 2016-04-19 2016-04-19 半導体装置

Publications (2)

Publication Number Publication Date
DE102017206195A1 DE102017206195A1 (de) 2017-10-19
DE102017206195B4 true DE102017206195B4 (de) 2020-11-26

Family

ID=59980925

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017206195.2A Active DE102017206195B4 (de) 2016-04-19 2017-04-11 Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US10062632B2 (enExample)
JP (1) JP6552450B2 (enExample)
CN (1) CN107452688B (enExample)
DE (1) DE102017206195B4 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7038645B2 (ja) * 2018-12-06 2022-03-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
KR20210112719A (ko) * 2020-03-06 2021-09-15 에스케이하이닉스 주식회사 반도체 모듈, 이를 포함하는 온도 조절 시스템, 및 온도 조절 방법
US12417951B2 (en) 2020-07-14 2025-09-16 Mitsubishi Electric Corporation Semiconductor device and power conversion device
CN112467957A (zh) * 2020-10-10 2021-03-09 山东斯力微电子有限公司 一种智能型大功率igbt模块
CN112864112A (zh) * 2021-01-19 2021-05-28 安徽安晶半导体有限公司 一种绝缘型大功率半导体模块
CN116888727A (zh) * 2021-01-29 2023-10-13 京瓷株式会社 半导体封装体以及半导体电子装置
JP2024075016A (ja) * 2022-11-22 2024-06-03 三菱電機株式会社 半導体装置および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229146A (ja) * 1997-02-17 1998-08-25 Seiko Epson Corp 半導体装置
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
WO2005018291A2 (en) * 2003-08-12 2005-02-24 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
EP2775524A1 (en) * 2013-03-08 2014-09-10 Fuji Electric Co., Ltd. Semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51160119U (enExample) * 1975-06-14 1976-12-20
JPS583784U (ja) * 1981-07-01 1983-01-11 株式会社日立ホームテック 自動車用変換器
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JPH04138693A (ja) * 1990-09-29 1992-05-13 Toshiba Lighting & Technol Corp 放電灯点灯装置
JPH09211266A (ja) * 1996-01-30 1997-08-15 Hitachi Ltd 半導体装置及び光通信モジュール
JP4044265B2 (ja) * 2000-05-16 2008-02-06 三菱電機株式会社 パワーモジュール
JP3764687B2 (ja) * 2002-02-18 2006-04-12 三菱電機株式会社 電力半導体装置及びその製造方法
JP2006121861A (ja) 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
CN101214918B (zh) * 2007-01-04 2012-04-18 菱生精密工业股份有限公司 用于微机电封盖制程的封装结构
US9052724B2 (en) * 2012-08-07 2015-06-09 International Business Machines Corporation Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof
JP6120704B2 (ja) * 2013-07-03 2017-04-26 三菱電機株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10229146A (ja) * 1997-02-17 1998-08-25 Seiko Epson Corp 半導体装置
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
WO2005018291A2 (en) * 2003-08-12 2005-02-24 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
EP2775524A1 (en) * 2013-03-08 2014-09-10 Fuji Electric Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
CN107452688A (zh) 2017-12-08
US10062632B2 (en) 2018-08-28
JP6552450B2 (ja) 2019-07-31
JP2017195677A (ja) 2017-10-26
US20170301603A1 (en) 2017-10-19
CN107452688B (zh) 2020-09-25
DE102017206195A1 (de) 2017-10-19

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