JP6530234B2 - 電子部品搭載装置及び電子部品の搭載方法 - Google Patents

電子部品搭載装置及び電子部品の搭載方法 Download PDF

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Publication number
JP6530234B2
JP6530234B2 JP2015101394A JP2015101394A JP6530234B2 JP 6530234 B2 JP6530234 B2 JP 6530234B2 JP 2015101394 A JP2015101394 A JP 2015101394A JP 2015101394 A JP2015101394 A JP 2015101394A JP 6530234 B2 JP6530234 B2 JP 6530234B2
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JP
Japan
Prior art keywords
electronic component
holding
semiconductor chip
tool
holding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2015101394A
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English (en)
Japanese (ja)
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JP2016219552A (ja
JP2016219552A5 (enExample
Inventor
村山　啓
啓 村山
大井　淳
淳 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2015101394A priority Critical patent/JP6530234B2/ja
Publication of JP2016219552A publication Critical patent/JP2016219552A/ja
Publication of JP2016219552A5 publication Critical patent/JP2016219552A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2015101394A 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法 Active JP6530234B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015101394A JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015101394A JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

Publications (3)

Publication Number Publication Date
JP2016219552A JP2016219552A (ja) 2016-12-22
JP2016219552A5 JP2016219552A5 (enExample) 2018-01-18
JP6530234B2 true JP6530234B2 (ja) 2019-06-12

Family

ID=57581499

Family Applications (1)

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JP2015101394A Active JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

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JP (1) JP6530234B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6323746B2 (ja) * 2014-02-19 2018-05-16 パナソニックＩｐマネジメント株式会社 加圧ツール及び電子部品搭載装置
JP7173148B2 (ja) * 2018-08-06 2022-11-16 株式会社島津製作所 クロマトグラフ用の試料容器搬送装置
TWI765762B (zh) * 2020-12-25 2022-05-21 梭特科技股份有限公司 角落或側邊接觸的無衝擊力固晶方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204327A (ja) * 1995-01-20 1996-08-09 Sony Corp 実装装置
JP3561089B2 (ja) * 1996-07-15 2004-09-02 株式会社東芝 半導体チップの実装方法およびその装置
JP3399324B2 (ja) * 1997-11-10 2003-04-21 松下電器産業株式会社 半田バンプ付電子部品の熱圧着方法
CN101894774B (zh) * 2005-03-17 2012-02-15 松下电器产业株式会社 电子部件安装方法和电子部件安装装置
JP4974982B2 (ja) * 2008-09-09 2012-07-11 パナソニック株式会社 実装装置
JP2010064172A (ja) * 2008-09-10 2010-03-25 Seiko Epson Corp 吸引保持ハンド、搬送装置の制御方法、搬送装置および検査装置
JP2010153672A (ja) * 2008-12-26 2010-07-08 Nec Corp 半導体装置の製造装置およびその製造方法

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Publication number Publication date
JP2016219552A (ja) 2016-12-22

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