JP6530234B2 - 電子部品搭載装置及び電子部品の搭載方法 - Google Patents

電子部品搭載装置及び電子部品の搭載方法 Download PDF

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Publication number
JP6530234B2
JP6530234B2 JP2015101394A JP2015101394A JP6530234B2 JP 6530234 B2 JP6530234 B2 JP 6530234B2 JP 2015101394 A JP2015101394 A JP 2015101394A JP 2015101394 A JP2015101394 A JP 2015101394A JP 6530234 B2 JP6530234 B2 JP 6530234B2
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JP
Japan
Prior art keywords
electronic component
holding
semiconductor chip
tool
holding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015101394A
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English (en)
Japanese (ja)
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JP2016219552A (ja
JP2016219552A5 (enExample
Inventor
村山　啓
啓 村山
大井　淳
淳 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015101394A priority Critical patent/JP6530234B2/ja
Publication of JP2016219552A publication Critical patent/JP2016219552A/ja
Publication of JP2016219552A5 publication Critical patent/JP2016219552A5/ja
Application granted granted Critical
Publication of JP6530234B2 publication Critical patent/JP6530234B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Wire Bonding (AREA)
JP2015101394A 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法 Active JP6530234B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015101394A JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015101394A JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

Publications (3)

Publication Number Publication Date
JP2016219552A JP2016219552A (ja) 2016-12-22
JP2016219552A5 JP2016219552A5 (enExample) 2018-01-18
JP6530234B2 true JP6530234B2 (ja) 2019-06-12

Family

ID=57581499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015101394A Active JP6530234B2 (ja) 2015-05-18 2015-05-18 電子部品搭載装置及び電子部品の搭載方法

Country Status (1)

Country Link
JP (1) JP6530234B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6323746B2 (ja) * 2014-02-19 2018-05-16 パナソニックＩｐマネジメント株式会社 加圧ツール及び電子部品搭載装置
WO2020031244A1 (ja) * 2018-08-06 2020-02-13 株式会社島津製作所 搬送装置
TWI765762B (zh) * 2020-12-25 2022-05-21 梭特科技股份有限公司 角落或側邊接觸的無衝擊力固晶方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204327A (ja) * 1995-01-20 1996-08-09 Sony Corp 実装装置
JP3561089B2 (ja) * 1996-07-15 2004-09-02 株式会社東芝 半導体チップの実装方法およびその装置
JP3399324B2 (ja) * 1997-11-10 2003-04-21 松下電器産業株式会社 半田バンプ付電子部品の熱圧着方法
CN101894774B (zh) * 2005-03-17 2012-02-15 松下电器产业株式会社 电子部件安装方法和电子部件安装装置
JP4974982B2 (ja) * 2008-09-09 2012-07-11 パナソニック株式会社 実装装置
JP2010064172A (ja) * 2008-09-10 2010-03-25 Seiko Epson Corp 吸引保持ハンド、搬送装置の制御方法、搬送装置および検査装置
JP2010153672A (ja) * 2008-12-26 2010-07-08 Nec Corp 半導体装置の製造装置およびその製造方法

Also Published As

Publication number Publication date
JP2016219552A (ja) 2016-12-22

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