JP6502555B2 - 蒸着用マスクの整列方法 - Google Patents
蒸着用マスクの整列方法 Download PDFInfo
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- JP6502555B2 JP6502555B2 JP2018103161A JP2018103161A JP6502555B2 JP 6502555 B2 JP6502555 B2 JP 6502555B2 JP 2018103161 A JP2018103161 A JP 2018103161A JP 2018103161 A JP2018103161 A JP 2018103161A JP 6502555 B2 JP6502555 B2 JP 6502555B2
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- 230000008021 deposition Effects 0.000 title claims description 48
- 238000000034 method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims description 95
- 239000000463 material Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 45
- 238000007740 vapor deposition Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
- Y10T29/4978—Assisting assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Description
110:マスク整列マーク
120、121、122、123:平坦領域
130、131、132、133:凹凸領域
200:透明基板
210:透明バリア膜
220:角度整列マーク
230:基板整列マーク
Claims (7)
- 一面に基板整列マークおよび前記基板整列マークに隣接形成された角度整列マークが形成された透明基板を用意するステップと、
前記透明基板に形成される前記基板整列マークと整列できるように貫通形成されたマスク整列マークを有するマスク部材と、前記マスク部材の一面に、前記マスク整列マークに隣接して形成され、表面に凹凸が形成される凹凸領域とを含む蒸着用マスクを、前記凹凸領域が前記透明基板に対向するように透明基板上に配置するステップと、
前記基板整列マークと前記マスク整列マークとを予め設定された位置で整列する位置整列ステップと、
前記角度整列マークが前記凹凸領域と重なりながら、予め設定された位置に配置されるように、前記角度整列マークを整列する角度整列ステップと、を含むことを特徴とするマスク整列方法。 - 前記位置整列ステップまたは前記角度整列ステップは、
凹凸領域に対向するように配置された測定装置で整列状態を測定した後、透明基板または蒸着用マスクの整列位置を調整することを特徴とする請求項1に記載のマスク整列方法。 - 前記測定装置は、CCDカメラが装着された測定装置であることを特徴とする請求項2に記載のマスク整列方法。
- 前記凹凸領域は、入射する光を乱反射させることを特徴とする請求項1に記載のマスク整列方法。
- 前記凹凸領域は、乱反射物質でコーティングされることを特徴とする請求項4に記載のマスク整列方法。
- 前記凹凸領域は、蒸着用マスクの一面より低い高さに形成されることを特徴とする請求項1〜5のいずれか一項に記載のマスク整列方法。
- 前記凹凸領域は、ハーフエッチングで形成されることを特徴とする請求項6に記載のマスク整列方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120084200A KR20140017767A (ko) | 2012-07-31 | 2012-07-31 | 증착용 마스크 및 이의 정렬 방법 |
KR10-2012-0084200 | 2012-07-31 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013154483A Division JP2014031582A (ja) | 2012-07-31 | 2013-07-25 | 蒸着用マスクおよびその整列方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018138701A JP2018138701A (ja) | 2018-09-06 |
JP6502555B2 true JP6502555B2 (ja) | 2019-04-17 |
Family
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JP2013154483A Pending JP2014031582A (ja) | 2012-07-31 | 2013-07-25 | 蒸着用マスクおよびその整列方法 |
JP2018103161A Active JP6502555B2 (ja) | 2012-07-31 | 2018-05-30 | 蒸着用マスクの整列方法 |
Family Applications Before (1)
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JP2013154483A Pending JP2014031582A (ja) | 2012-07-31 | 2013-07-25 | 蒸着用マスクおよびその整列方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9757764B2 (ja) |
EP (1) | EP2692896A1 (ja) |
JP (2) | JP2014031582A (ja) |
KR (1) | KR20140017767A (ja) |
CN (2) | CN103572246B (ja) |
TW (1) | TWI611030B (ja) |
Families Citing this family (28)
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KR20140017767A (ko) * | 2012-07-31 | 2014-02-12 | 삼성디스플레이 주식회사 | 증착용 마스크 및 이의 정렬 방법 |
CN103839864A (zh) * | 2014-02-24 | 2014-06-04 | 合肥鑫晟光电科技有限公司 | 一种镀膜对位装置和镀膜系统 |
CN103966546B (zh) * | 2014-04-29 | 2016-03-16 | 京东方科技集团股份有限公司 | 一种金属掩膜板 |
KR101436014B1 (ko) * | 2014-04-29 | 2014-11-04 | 주식회사 미래솔루텍 | 증착 마스크 |
US9695522B2 (en) * | 2014-11-21 | 2017-07-04 | Samsung Display Co., Ltd. | Deposition mask, method of manufacturing deposition mask, and method of manufacturing display apparatus |
CN105988303B (zh) * | 2015-02-26 | 2018-03-30 | 上海微电子装备(集团)股份有限公司 | 一种掩模版传输装置及传输方法 |
CN104900630B (zh) * | 2015-06-07 | 2018-01-26 | 上海华虹宏力半导体制造有限公司 | 提高对准标记对比度的结构及其形成方法 |
KR102323357B1 (ko) | 2015-07-21 | 2021-11-09 | 삼성디스플레이 주식회사 | 표시 장치 |
CN105097674B (zh) * | 2015-09-07 | 2018-01-12 | 深圳市华星光电技术有限公司 | 一种在玻璃基板上重新制作扫描线的方法 |
KR20170038964A (ko) | 2015-09-30 | 2017-04-10 | 삼성디스플레이 주식회사 | 표시 패널 및 그의 제조 방법 |
CN105118423A (zh) | 2015-10-09 | 2015-12-02 | 京东方科技集团股份有限公司 | 用于驱动显示面板的数据驱动模组、方法及显示装置 |
CN105549320A (zh) * | 2016-01-05 | 2016-05-04 | 京东方科技集团股份有限公司 | 一种对位标记结构、掩模板、基板以及对位方法 |
CN105572938B (zh) * | 2016-01-29 | 2018-06-08 | 京东方科技集团股份有限公司 | 一种显示基板、显示装置及定位标识的识别方法 |
KR102544244B1 (ko) * | 2016-07-19 | 2023-06-19 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체 |
CN107868931A (zh) * | 2016-09-23 | 2018-04-03 | 昆山国显光电有限公司 | 精密金属遮罩、oled基板及其对位方法 |
CN107256839A (zh) * | 2017-05-22 | 2017-10-17 | 深圳市华星光电技术有限公司 | 一种掩膜板及显示面板蒸镀用对位检测系统 |
WO2019082739A1 (ja) * | 2017-10-27 | 2019-05-02 | 大日本印刷株式会社 | 蒸着マスク及び蒸着マスクの製造方法 |
CN108342686A (zh) * | 2018-01-19 | 2018-07-31 | 昆山国显光电有限公司 | 一种掩膜板 |
CN108726474A (zh) * | 2018-06-05 | 2018-11-02 | 中国电子科技集团公司第二十六研究所 | 一种制作三维电极图形的辅助装置 |
CN113097422A (zh) * | 2019-12-23 | 2021-07-09 | 合肥欣奕华智能机器有限公司 | 基板对位装置及方法、掩膜板、晶圆基板 |
US11111176B1 (en) * | 2020-02-27 | 2021-09-07 | Applied Materials, Inc. | Methods and apparatus of processing transparent substrates |
JP2021175824A (ja) * | 2020-03-13 | 2021-11-04 | 大日本印刷株式会社 | 有機デバイスの製造装置の蒸着室の評価方法、評価方法で用いられる標準マスク装置及び標準基板、標準マスク装置の製造方法、評価方法で評価された蒸着室を備える有機デバイスの製造装置、評価方法で評価された蒸着室において形成された蒸着層を備える有機デバイス、並びに有機デバイスの製造装置の蒸着室のメンテナンス方法 |
KR20210120168A (ko) * | 2020-03-25 | 2021-10-07 | 삼성디스플레이 주식회사 | 포토 마스크, 표시 장치 및 그 제조 방법 |
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-
2012
- 2012-07-31 KR KR1020120084200A patent/KR20140017767A/ko active Search and Examination
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2013
- 2013-07-22 TW TW102126144A patent/TWI611030B/zh active
- 2013-07-25 US US13/950,595 patent/US9757764B2/en active Active
- 2013-07-25 JP JP2013154483A patent/JP2014031582A/ja active Pending
- 2013-07-29 EP EP20130178356 patent/EP2692896A1/en not_active Withdrawn
- 2013-07-31 CN CN201310328944.7A patent/CN103572246B/zh active Active
- 2013-07-31 CN CN201320464581.5U patent/CN203440443U/zh not_active Expired - Lifetime
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Publication number | Publication date |
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TWI611030B (zh) | 2018-01-11 |
JP2014031582A (ja) | 2014-02-20 |
JP2018138701A (ja) | 2018-09-06 |
KR20140017767A (ko) | 2014-02-12 |
US20140033974A1 (en) | 2014-02-06 |
US9757764B2 (en) | 2017-09-12 |
EP2692896A1 (en) | 2014-02-05 |
TW201410891A (zh) | 2014-03-16 |
CN103572246B (zh) | 2017-12-26 |
CN103572246A (zh) | 2014-02-12 |
CN203440443U (zh) | 2014-02-19 |
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