JP6502396B2 - ハルバッハ配列によるマスクの磁気チャッキング - Google Patents

ハルバッハ配列によるマスクの磁気チャッキング Download PDF

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Publication number
JP6502396B2
JP6502396B2 JP2016574366A JP2016574366A JP6502396B2 JP 6502396 B2 JP6502396 B2 JP 6502396B2 JP 2016574366 A JP2016574366 A JP 2016574366A JP 2016574366 A JP2016574366 A JP 2016574366A JP 6502396 B2 JP6502396 B2 JP 6502396B2
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JP
Japan
Prior art keywords
magnets
substrate
mask
chucking
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016574366A
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English (en)
Japanese (ja)
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JP2017520122A (ja
Inventor
トマソ ベルセシ
トマソ ベルセシ
ズオキャン ワン
ズオキャン ワン
ジョン エム ホワイト
ジョン エム ホワイト
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2017520122A publication Critical patent/JP2017520122A/ja
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Publication of JP6502396B2 publication Critical patent/JP6502396B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2016574366A 2014-07-08 2015-05-05 ハルバッハ配列によるマスクの磁気チャッキング Expired - Fee Related JP6502396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462022178P 2014-07-08 2014-07-08
US62/022,178 2014-07-08
PCT/US2015/029263 WO2016007214A1 (en) 2014-07-08 2015-05-05 Magnetic chucking of mask with halbach array

Publications (2)

Publication Number Publication Date
JP2017520122A JP2017520122A (ja) 2017-07-20
JP6502396B2 true JP6502396B2 (ja) 2019-04-17

Family

ID=55064650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016574366A Expired - Fee Related JP6502396B2 (ja) 2014-07-08 2015-05-05 ハルバッハ配列によるマスクの磁気チャッキング

Country Status (5)

Country Link
JP (1) JP6502396B2 (zh)
KR (1) KR102279086B1 (zh)
CN (1) CN106575633B (zh)
TW (1) TW201622055A (zh)
WO (1) WO2016007214A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106835023B (zh) * 2016-12-23 2019-10-01 上海天马微电子有限公司 蒸镀装置以及蒸镀方法
WO2018141366A1 (en) * 2017-01-31 2018-08-09 Applied Materials, Inc. Substrate carrier and method of processing a substrate
KR102140569B1 (ko) * 2017-03-17 2020-08-03 어플라이드 머티어리얼스, 인코포레이티드 캐리어, 진공 시스템 및 진공 시스템을 동작시키는 방법
CN108313154A (zh) * 2018-02-05 2018-07-24 浙江大学 一种强磁性的轮式磁吸附装置
NL2020773B1 (en) * 2018-04-16 2019-10-23 Meyn Food Processing Tech Bv Processing apparatus for poultry comprising one or more transfer units
KR102421610B1 (ko) * 2018-07-31 2022-07-14 캐논 톡키 가부시키가이샤 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법
KR102459872B1 (ko) * 2018-07-31 2022-10-26 캐논 톡키 가부시키가이샤 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법
JP7249142B2 (ja) * 2018-12-14 2023-03-30 キヤノントッキ株式会社 搬送キャリア、蒸着装置、および電子デバイスの製造装置
JP2023063977A (ja) * 2021-10-25 2023-05-10 吉林Ｏｌｅｄ日本研究所株式会社 蒸着装置
KR20240013966A (ko) * 2022-07-22 2024-01-31 삼성디스플레이 주식회사 증착 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4058149B2 (ja) * 1997-12-01 2008-03-05 キヤノンアネルバ株式会社 真空成膜装置のマスク位置合わせ方法
JP2005139493A (ja) * 2003-11-05 2005-06-02 Kansai Tlo Kk マスク着脱装置
US7456935B2 (en) * 2005-04-05 2008-11-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table
KR20090107435A (ko) * 2008-04-08 2009-10-13 캐논 가부시끼가이샤 스테이지 장치, 노광 장치 및 디바이스 제조 방법
JP2009299184A (ja) * 2008-05-12 2009-12-24 Canon Anelva Corp 磁場発生装置、磁場発生方法、スパッタ装置及びデバイスの製造方法
US8212934B2 (en) * 2009-02-19 2012-07-03 Sony Corporation Method for processing an analog television signal
KR101810683B1 (ko) * 2011-02-14 2017-12-20 삼성디스플레이 주식회사 자석 수단의 교체가 가능한 마스크 고정장치 및 이를 포함하는 증착장치
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法

Also Published As

Publication number Publication date
CN106575633A (zh) 2017-04-19
JP2017520122A (ja) 2017-07-20
KR102279086B1 (ko) 2021-07-19
CN106575633B (zh) 2020-12-04
WO2016007214A1 (en) 2016-01-14
TW201622055A (zh) 2016-06-16
KR20170031175A (ko) 2017-03-20

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