JP6502396B2 - ハルバッハ配列によるマスクの磁気チャッキング - Google Patents
ハルバッハ配列によるマスクの磁気チャッキング Download PDFInfo
- Publication number
- JP6502396B2 JP6502396B2 JP2016574366A JP2016574366A JP6502396B2 JP 6502396 B2 JP6502396 B2 JP 6502396B2 JP 2016574366 A JP2016574366 A JP 2016574366A JP 2016574366 A JP2016574366 A JP 2016574366A JP 6502396 B2 JP6502396 B2 JP 6502396B2
- Authority
- JP
- Japan
- Prior art keywords
- magnets
- substrate
- mask
- chucking
- magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32366—Localised processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462022178P | 2014-07-08 | 2014-07-08 | |
US62/022,178 | 2014-07-08 | ||
PCT/US2015/029263 WO2016007214A1 (en) | 2014-07-08 | 2015-05-05 | Magnetic chucking of mask with halbach array |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017520122A JP2017520122A (ja) | 2017-07-20 |
JP6502396B2 true JP6502396B2 (ja) | 2019-04-17 |
Family
ID=55064650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016574366A Expired - Fee Related JP6502396B2 (ja) | 2014-07-08 | 2015-05-05 | ハルバッハ配列によるマスクの磁気チャッキング |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6502396B2 (ko) |
KR (1) | KR102279086B1 (ko) |
CN (1) | CN106575633B (ko) |
TW (1) | TW201622055A (ko) |
WO (1) | WO2016007214A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106835023B (zh) * | 2016-12-23 | 2019-10-01 | 上海天马微电子有限公司 | 蒸镀装置以及蒸镀方法 |
WO2018141366A1 (en) * | 2017-01-31 | 2018-08-09 | Applied Materials, Inc. | Substrate carrier and method of processing a substrate |
WO2018166616A1 (en) * | 2017-03-17 | 2018-09-20 | Applied Materials, Inc. | Carrier, vacuum system and method of operating a vacuum system |
CN108313154A (zh) * | 2018-02-05 | 2018-07-24 | 浙江大学 | 一种强磁性的轮式磁吸附装置 |
NL2020773B1 (en) * | 2018-04-16 | 2019-10-23 | Meyn Food Processing Tech Bv | Processing apparatus for poultry comprising one or more transfer units |
KR102421610B1 (ko) * | 2018-07-31 | 2022-07-14 | 캐논 톡키 가부시키가이샤 | 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법 |
KR102459872B1 (ko) * | 2018-07-31 | 2022-10-26 | 캐논 톡키 가부시키가이샤 | 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조방법 |
JP7249142B2 (ja) * | 2018-12-14 | 2023-03-30 | キヤノントッキ株式会社 | 搬送キャリア、蒸着装置、および電子デバイスの製造装置 |
JP2023063977A (ja) * | 2021-10-25 | 2023-05-10 | 吉林Oled日本研究所株式会社 | 蒸着装置 |
KR20240013966A (ko) * | 2022-07-22 | 2024-01-31 | 삼성디스플레이 주식회사 | 증착 장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4058149B2 (ja) * | 1997-12-01 | 2008-03-05 | キヤノンアネルバ株式会社 | 真空成膜装置のマスク位置合わせ方法 |
JP2005139493A (ja) * | 2003-11-05 | 2005-06-02 | Kansai Tlo Kk | マスク着脱装置 |
US7456935B2 (en) | 2005-04-05 | 2008-11-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table |
KR20090107435A (ko) * | 2008-04-08 | 2009-10-13 | 캐논 가부시끼가이샤 | 스테이지 장치, 노광 장치 및 디바이스 제조 방법 |
JP2009299184A (ja) * | 2008-05-12 | 2009-12-24 | Canon Anelva Corp | 磁場発生装置、磁場発生方法、スパッタ装置及びデバイスの製造方法 |
US8212934B2 (en) * | 2009-02-19 | 2012-07-03 | Sony Corporation | Method for processing an analog television signal |
KR101810683B1 (ko) * | 2011-02-14 | 2017-12-20 | 삼성디스플레이 주식회사 | 자석 수단의 교체가 가능한 마스크 고정장치 및 이를 포함하는 증착장치 |
US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
JP2013163837A (ja) * | 2012-02-09 | 2013-08-22 | Canon Tokki Corp | 蒸着装置並びに蒸着装置を用いた成膜方法 |
-
2015
- 2015-05-05 JP JP2016574366A patent/JP6502396B2/ja not_active Expired - Fee Related
- 2015-05-05 KR KR1020177003573A patent/KR102279086B1/ko active IP Right Grant
- 2015-05-05 CN CN201580037013.9A patent/CN106575633B/zh active Active
- 2015-05-05 WO PCT/US2015/029263 patent/WO2016007214A1/en active Application Filing
- 2015-06-25 TW TW104120417A patent/TW201622055A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201622055A (zh) | 2016-06-16 |
CN106575633B (zh) | 2020-12-04 |
CN106575633A (zh) | 2017-04-19 |
JP2017520122A (ja) | 2017-07-20 |
KR20170031175A (ko) | 2017-03-20 |
WO2016007214A1 (en) | 2016-01-14 |
KR102279086B1 (ko) | 2021-07-19 |
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Legal Events
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