JP6495368B2 - 電子モジュール - Google Patents

電子モジュール Download PDF

Info

Publication number
JP6495368B2
JP6495368B2 JP2017082569A JP2017082569A JP6495368B2 JP 6495368 B2 JP6495368 B2 JP 6495368B2 JP 2017082569 A JP2017082569 A JP 2017082569A JP 2017082569 A JP2017082569 A JP 2017082569A JP 6495368 B2 JP6495368 B2 JP 6495368B2
Authority
JP
Japan
Prior art keywords
resin
metal foil
electronic module
wiring pattern
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017082569A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018182180A5 (https=
JP2018182180A (ja
Inventor
摂 綿貫
摂 綿貫
憲市 本田
憲市 本田
石川　章
章 石川
勤 石川
勤 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tateyama Kagaku Kogyo Co Ltd
Original Assignee
Tateyama Kagaku Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017082569A priority Critical patent/JP6495368B2/ja
Application filed by Tateyama Kagaku Kogyo Co Ltd filed Critical Tateyama Kagaku Kogyo Co Ltd
Priority to EP18788521.5A priority patent/EP3564991B1/en
Priority to US16/606,738 priority patent/US11049780B2/en
Priority to PCT/JP2018/015881 priority patent/WO2018194062A1/ja
Priority to CN201880024003.5A priority patent/CN110494974B/zh
Publication of JP2018182180A publication Critical patent/JP2018182180A/ja
Publication of JP2018182180A5 publication Critical patent/JP2018182180A5/ja
Priority to TW108109037A priority patent/TWI686121B/zh
Application granted granted Critical
Publication of JP6495368B2 publication Critical patent/JP6495368B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2017082569A 2017-04-19 2017-04-19 電子モジュール Active JP6495368B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017082569A JP6495368B2 (ja) 2017-04-19 2017-04-19 電子モジュール
US16/606,738 US11049780B2 (en) 2017-04-19 2018-04-17 Electronic module and method for manufacturing same
PCT/JP2018/015881 WO2018194062A1 (ja) 2017-04-19 2018-04-17 電子モジュールとその製造方法
CN201880024003.5A CN110494974B (zh) 2017-04-19 2018-04-17 电子模块及其制造方法
EP18788521.5A EP3564991B1 (en) 2017-04-19 2018-04-17 Method for manufacturing an electronic module
TW108109037A TWI686121B (zh) 2017-04-19 2019-03-18 電子模組及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017082569A JP6495368B2 (ja) 2017-04-19 2017-04-19 電子モジュール

Publications (3)

Publication Number Publication Date
JP2018182180A JP2018182180A (ja) 2018-11-15
JP2018182180A5 JP2018182180A5 (https=) 2018-12-27
JP6495368B2 true JP6495368B2 (ja) 2019-04-03

Family

ID=63856607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017082569A Active JP6495368B2 (ja) 2017-04-19 2017-04-19 電子モジュール

Country Status (6)

Country Link
US (1) US11049780B2 (https=)
EP (1) EP3564991B1 (https=)
JP (1) JP6495368B2 (https=)
CN (1) CN110494974B (https=)
TW (1) TWI686121B (https=)
WO (1) WO2018194062A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12156356B2 (en) * 2020-04-13 2024-11-26 Flex Ltd. Electronic encapsulation through stencil printing
CN114126207B (zh) * 2020-08-27 2024-03-26 致伸科技股份有限公司 薄膜线路板及其制作方法
CN116529734A (zh) * 2021-01-14 2023-08-01 凸版印刷株式会社 卡型介质以及卡型介质的制造方法
US12154860B2 (en) * 2021-06-16 2024-11-26 SanDisk Technologies, Inc. Method of forming a semiconductor device including vertical contact fingers
CN115457880B (zh) * 2022-09-14 2024-10-15 深圳市美亚迪光电有限公司 Led软模组的成型方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09121090A (ja) 1995-10-26 1997-05-06 Fujitsu Ten Ltd 電子部品の封止構造
JP3281859B2 (ja) * 1997-12-22 2002-05-13 三洋電機株式会社 混成集積回路装置の製造方法
JP4555436B2 (ja) 2000-06-29 2010-09-29 富士通株式会社 薄膜樹脂基板への樹脂モールド方法及び高周波モジュール
JP2006066486A (ja) * 2004-08-25 2006-03-09 Towa Corp 樹脂封止型
JP4473141B2 (ja) 2005-01-04 2010-06-02 日立オートモティブシステムズ株式会社 電子制御装置
EP2700867B1 (en) * 2007-12-21 2016-08-31 3M Innovative Properties Company Low profile flexible cable lighting assemblies and methods of making same
EP2405727A1 (en) * 2009-04-02 2012-01-11 Panasonic Corporation Manufacturing method for circuit board, and circuit board
KR101622438B1 (ko) * 2010-01-29 2016-05-18 스미또모 베이크라이트 가부시키가이샤 도전 접속 시트, 단자간의 접속 방법, 접속 단자의 형성 방법, 반도체 장치 및 전자 기기
JP2011171539A (ja) * 2010-02-19 2011-09-01 Panasonic Corp モジュールの製造方法
JPWO2012049898A1 (ja) * 2010-10-15 2014-02-24 日本電気株式会社 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法
WO2014132973A1 (ja) * 2013-02-27 2014-09-04 ユニチカ株式会社 電子部品装置の製造方法および電子部品装置
JP6391430B2 (ja) * 2014-11-06 2018-09-19 三菱電機株式会社 電子制御装置およびその製造方法
JP6540098B2 (ja) * 2015-02-27 2019-07-10 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
US20200135598A1 (en) 2020-04-30
EP3564991A1 (en) 2019-11-06
JP2018182180A (ja) 2018-11-15
WO2018194062A1 (ja) 2018-10-25
TW201944873A (zh) 2019-11-16
EP3564991A4 (en) 2020-08-05
US11049780B2 (en) 2021-06-29
TWI686121B (zh) 2020-02-21
CN110494974B (zh) 2023-02-28
EP3564991B1 (en) 2023-02-15
CN110494974A (zh) 2019-11-22

Similar Documents

Publication Publication Date Title
JP6495368B2 (ja) 電子モジュール
KR100273780B1 (ko) 표시장치 및 그 제조방법
JP2021052194A5 (https=)
US9293683B2 (en) Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate
CN102800659B (zh) 树脂密封型电子控制装置及其制造方法
JP2009088352A (ja) 電子回路装置の製造方法および電子回路装置
CN105643855A (zh) 电子部件、其制造方法及制造装置
JP2009088351A (ja) 電子回路装置の製造方法および電子回路装置
JP6303597B2 (ja) 電子部品モジュールの製造方法
TW201347629A (zh) 柔性電路板的製作方法
JP2018049854A (ja) 配線構造体とその製造方法
JP2015136902A (ja) 繊維強化複合材の成形方法および成形装置
JPS5835367B2 (ja) 回路素子基板及びその製造方法
JP2018182180A5 (https=)
JP2019169703A (ja) バスバー積層体及びそれを備える電子部品実装モジュール、バスバー積層体の製造方法
US7845074B2 (en) Method for manufacturing electronic parts module
CN110933840B (zh) 一种转接板、电路板和电子设备
JP2000048162A (ja) Ｉｃカード用モジュール、ｉｃカード用モジュールの製造方法、混成集積回路モジュールおよびその製造方法
JP5931784B2 (ja) 構造体および無線通信装置
US20240399663A1 (en) Hybrid manufacturing and electronic devices made thereby
JP5359344B2 (ja) インサート樹脂成形部品の製造方法とそれに用いられる樹脂成形金型および圧力センサ
CN219999665U (zh) 具有支撑体的柔性电路板
TWI637836B (zh) 模內射出物品的製法及其製品及電子裝置的殼件
TWI880499B (zh) 模內電子裝置及其製造方法
CN110933841A (zh) 一种转接板、电路板和电子设备

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20181017

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181018

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181018

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20181018

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20181018

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20181026

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20181017

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20190201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190306

R150 Certificate of patent or registration of utility model

Ref document number: 6495368

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250