JP6494991B2 - ウエーハの加工方法 - Google Patents

ウエーハの加工方法 Download PDF

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Publication number
JP6494991B2
JP6494991B2 JP2014250133A JP2014250133A JP6494991B2 JP 6494991 B2 JP6494991 B2 JP 6494991B2 JP 2014250133 A JP2014250133 A JP 2014250133A JP 2014250133 A JP2014250133 A JP 2014250133A JP 6494991 B2 JP6494991 B2 JP 6494991B2
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Japan
Prior art keywords
laser beam
wafer
spot
workpiece
holding
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Active
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JP2014250133A
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English (en)
Japanese (ja)
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JP2016107330A (ja
Inventor
健次 古田
健次 古田
泰吉 湯平
泰吉 湯平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Priority to JP2014250133A priority Critical patent/JP6494991B2/ja
Priority to CN201510891092.1A priority patent/CN105689888B/zh
Publication of JP2016107330A publication Critical patent/JP2016107330A/ja
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Publication of JP6494991B2 publication Critical patent/JP6494991B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2014250133A 2014-12-10 2014-12-10 ウエーハの加工方法 Active JP6494991B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014250133A JP6494991B2 (ja) 2014-12-10 2014-12-10 ウエーハの加工方法
CN201510891092.1A CN105689888B (zh) 2014-12-10 2015-12-07 激光加工装置以及晶片的加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014250133A JP6494991B2 (ja) 2014-12-10 2014-12-10 ウエーハの加工方法

Publications (2)

Publication Number Publication Date
JP2016107330A JP2016107330A (ja) 2016-06-20
JP6494991B2 true JP6494991B2 (ja) 2019-04-03

Family

ID=56122854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014250133A Active JP6494991B2 (ja) 2014-12-10 2014-12-10 ウエーハの加工方法

Country Status (2)

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JP (1) JP6494991B2 (zh)
CN (1) CN105689888B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107456629A (zh) * 2016-10-20 2017-12-12 广州市健之堂医疗器械有限公司 一种调速凹槽部件
CN106911107B (zh) * 2017-04-18 2018-06-19 深圳市赛迪菲科自动化科技有限公司 电缆定位系统及电缆定位方法
JP6860429B2 (ja) * 2017-06-07 2021-04-14 株式会社ディスコ レーザ加工方法及びレーザ加工装置
JP6907093B2 (ja) * 2017-10-24 2021-07-21 株式会社ディスコ レーザー加工装置
JP7123652B2 (ja) * 2018-06-20 2022-08-23 株式会社ディスコ レーザー加工装置
WO2020090894A1 (ja) 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7285067B2 (ja) * 2018-10-30 2023-06-01 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3745918B2 (ja) * 1999-04-05 2006-02-15 松下電器産業株式会社 レーザトリミング装置及び方法
JP2003338468A (ja) * 2002-03-12 2003-11-28 Hamamatsu Photonics Kk 発光素子の製造方法、発光ダイオード、及び半導体レーザ素子
JP2005014050A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd レーザ加工装置
JP4440036B2 (ja) * 2004-08-11 2010-03-24 株式会社ディスコ レーザー加工方法
JP2007136477A (ja) * 2005-11-16 2007-06-07 Disco Abrasive Syst Ltd レーザー加工装置
US8835802B2 (en) * 2006-01-24 2014-09-16 Stephen C. Baer Cleaving wafers from silicon crystals
JP4938339B2 (ja) * 2006-04-04 2012-05-23 株式会社ディスコ レーザー加工装置
KR100984727B1 (ko) * 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치
JP5917862B2 (ja) * 2011-08-30 2016-05-18 浜松ホトニクス株式会社 加工対象物切断方法

Also Published As

Publication number Publication date
CN105689888B (zh) 2019-05-31
CN105689888A (zh) 2016-06-22
JP2016107330A (ja) 2016-06-20

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