JP6491974B2 - 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法 - Google Patents

露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法 Download PDF

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JP6491974B2
JP6491974B2 JP2015143080A JP2015143080A JP6491974B2 JP 6491974 B2 JP6491974 B2 JP 6491974B2 JP 2015143080 A JP2015143080 A JP 2015143080A JP 2015143080 A JP2015143080 A JP 2015143080A JP 6491974 B2 JP6491974 B2 JP 6491974B2
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Japan
Prior art keywords
data
pattern
value
actual pattern
finish
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JP2015143080A
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Japanese (ja)
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JP2017026710A (ja
Inventor
哲平 山本
哲平 山本
中山　肇
肇 中山
荻野　晴夫
晴夫 荻野
聡 磯田
聡 磯田
前田　晃
晃 前田
山田　亮
亮 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Showa Denko Materials Co Ltd
Original Assignee
Screen Holdings Co Ltd
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2015143080A priority Critical patent/JP6491974B2/ja
Priority to PCT/JP2016/071013 priority patent/WO2017014190A1/ja
Priority to CN201680042016.6A priority patent/CN107850855B/zh
Priority to TW105122459A priority patent/TWI624200B/zh
Priority to KR1020177037572A priority patent/KR102086497B1/ko
Publication of JP2017026710A publication Critical patent/JP2017026710A/ja
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Publication of JP6491974B2 publication Critical patent/JP6491974B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G03F7/706837—Data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2015143080A 2015-07-17 2015-07-17 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法 Active JP6491974B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015143080A JP6491974B2 (ja) 2015-07-17 2015-07-17 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法
PCT/JP2016/071013 WO2017014190A1 (ja) 2015-07-17 2016-07-15 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法
CN201680042016.6A CN107850855B (zh) 2015-07-17 2016-07-15 曝光数据修正装置、布线图案形成系统及布线基板的制造方法
TW105122459A TWI624200B (zh) 2015-07-17 2016-07-15 曝光資料校正裝置、配線圖案形成系統、用於校正曝光資料的電腦程式產品、曝光資料校正方法及配線基板的製造方法
KR1020177037572A KR102086497B1 (ko) 2015-07-17 2016-07-15 노광 데이터 보정 장치, 배선 패턴 형성 시스템 및 배선 기판의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015143080A JP6491974B2 (ja) 2015-07-17 2015-07-17 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2017026710A JP2017026710A (ja) 2017-02-02
JP6491974B2 true JP6491974B2 (ja) 2019-03-27

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JP2015143080A Active JP6491974B2 (ja) 2015-07-17 2015-07-17 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法

Country Status (5)

Country Link
JP (1) JP6491974B2 (zh)
KR (1) KR102086497B1 (zh)
CN (1) CN107850855B (zh)
TW (1) TWI624200B (zh)
WO (1) WO2017014190A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063131A (ja) * 2015-09-25 2017-03-30 株式会社Ｓｃｒｅｅｎホールディングス データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252202A (ja) * 1999-03-03 2000-09-14 Hitachi Ltd 半導体装置の製造方法
JP3913924B2 (ja) * 1999-03-19 2007-05-09 株式会社東芝 パターン描画方法及び描画装置
JP4018309B2 (ja) * 2000-02-14 2007-12-05 松下電器産業株式会社 回路パラメータ抽出方法、半導体集積回路の設計方法および装置
JP2003017830A (ja) * 2001-06-28 2003-01-17 Nitto Denko Corp 配線回路基板の製造方法および検査方法
WO2004104699A1 (ja) * 2003-05-26 2004-12-02 Fujitsu Limited パターン寸法補正
JP2005115232A (ja) * 2003-10-10 2005-04-28 Fuji Photo Film Co Ltd 製造支援システムおよびプログラム
JP2005116929A (ja) * 2003-10-10 2005-04-28 Fuji Photo Film Co Ltd パターン製造システム
JP2006303229A (ja) * 2005-04-21 2006-11-02 Toray Eng Co Ltd 回路形成システム
JP2007033764A (ja) * 2005-07-26 2007-02-08 Fujifilm Holdings Corp パターン製造システム、露光装置、及び露光方法
TW200721260A (en) * 2005-11-16 2007-06-01 Nikon Corp Substrate processing method, photomask manufacturing method, photomask and device manufacturing method
US7842442B2 (en) * 2006-08-31 2010-11-30 Advanced Micro Devices, Inc. Method and system for reducing overlay errors within exposure fields by APC control strategies
CN101192009B (zh) * 2006-11-28 2011-07-06 中芯国际集成电路制造(上海)有限公司 建立光学近接修正模型的方法
TW201224678A (en) * 2010-11-04 2012-06-16 Orc Mfg Co Ltd Exposure device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063131A (ja) * 2015-09-25 2017-03-30 株式会社Ｓｃｒｅｅｎホールディングス データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法

Also Published As

Publication number Publication date
JP2017026710A (ja) 2017-02-02
TWI624200B (zh) 2018-05-11
CN107850855B (zh) 2020-05-26
KR20180014057A (ko) 2018-02-07
KR102086497B1 (ko) 2020-03-09
WO2017014190A1 (ja) 2017-01-26
CN107850855A (zh) 2018-03-27
TW201714503A (zh) 2017-04-16

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