JP6480691B2 - ケイ素含有熱または光硬化性組成物 - Google Patents

ケイ素含有熱または光硬化性組成物 Download PDF

Info

Publication number
JP6480691B2
JP6480691B2 JP2014189852A JP2014189852A JP6480691B2 JP 6480691 B2 JP6480691 B2 JP 6480691B2 JP 2014189852 A JP2014189852 A JP 2014189852A JP 2014189852 A JP2014189852 A JP 2014189852A JP 6480691 B2 JP6480691 B2 JP 6480691B2
Authority
JP
Japan
Prior art keywords
group
film
heat
acid
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014189852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015108116A (ja
JP2015108116A5 (enExample
Inventor
吉田　尚史
尚史 吉田
裕治 田代
裕治 田代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AZ Electronic Materials Luxembourg SARL
Original Assignee
AZ Electronic Materials Luxembourg SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials Luxembourg SARL filed Critical AZ Electronic Materials Luxembourg SARL
Priority to JP2014189852A priority Critical patent/JP6480691B2/ja
Priority to EP14855914.9A priority patent/EP3061792A4/en
Priority to US15/031,668 priority patent/US9817312B2/en
Priority to CN201480057606.7A priority patent/CN105764993B/zh
Priority to PCT/JP2014/077299 priority patent/WO2015060155A1/ja
Priority to KR1020167013434A priority patent/KR101896232B1/ko
Priority to TW103136094A priority patent/TWI622623B/zh
Publication of JP2015108116A publication Critical patent/JP2015108116A/ja
Priority to IL244820A priority patent/IL244820B/en
Priority to PH12016500639A priority patent/PH12016500639B1/en
Publication of JP2015108116A5 publication Critical patent/JP2015108116A5/ja
Application granted granted Critical
Publication of JP6480691B2 publication Critical patent/JP6480691B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2014189852A 2013-10-21 2014-09-18 ケイ素含有熱または光硬化性組成物 Expired - Fee Related JP6480691B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2014189852A JP6480691B2 (ja) 2013-10-21 2014-09-18 ケイ素含有熱または光硬化性組成物
US15/031,668 US9817312B2 (en) 2013-10-21 2014-10-14 Silicon-containing heat- or photo-curable composition
CN201480057606.7A CN105764993B (zh) 2013-10-21 2014-10-14 含硅的热或光固化性组合物
PCT/JP2014/077299 WO2015060155A1 (ja) 2013-10-21 2014-10-14 ケイ素含有熱または光硬化性組成物
KR1020167013434A KR101896232B1 (ko) 2013-10-21 2014-10-14 규소 함유 열 또는 광경화성 조성물
EP14855914.9A EP3061792A4 (en) 2013-10-21 2014-10-14 Silicon-containing heat- or photo-curable composition
TW103136094A TWI622623B (zh) 2013-10-21 2014-10-20 含矽之熱或光硬化性組成物
IL244820A IL244820B (en) 2013-10-21 2016-03-29 A preparation that can be fused with the help of heat or light that contains sorghum
PH12016500639A PH12016500639B1 (en) 2013-10-21 2016-04-07 Silicon-containing heat- or photo-curable composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013218485 2013-10-21
JP2013218485 2013-10-21
JP2014189852A JP6480691B2 (ja) 2013-10-21 2014-09-18 ケイ素含有熱または光硬化性組成物

Publications (3)

Publication Number Publication Date
JP2015108116A JP2015108116A (ja) 2015-06-11
JP2015108116A5 JP2015108116A5 (enExample) 2017-06-01
JP6480691B2 true JP6480691B2 (ja) 2019-03-13

Family

ID=52992755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014189852A Expired - Fee Related JP6480691B2 (ja) 2013-10-21 2014-09-18 ケイ素含有熱または光硬化性組成物

Country Status (9)

Country Link
US (1) US9817312B2 (enExample)
EP (1) EP3061792A4 (enExample)
JP (1) JP6480691B2 (enExample)
KR (1) KR101896232B1 (enExample)
CN (1) CN105764993B (enExample)
IL (1) IL244820B (enExample)
PH (1) PH12016500639B1 (enExample)
TW (1) TWI622623B (enExample)
WO (1) WO2015060155A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840219B1 (ko) * 2015-08-31 2018-03-20 삼성에스디아이 주식회사 저온 경화 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치
JP6603115B2 (ja) * 2015-11-27 2019-11-06 信越化学工業株式会社 ケイ素含有縮合物、ケイ素含有レジスト下層膜形成用組成物、及びパターン形成方法
CN108885997B (zh) * 2016-02-24 2023-06-02 日产化学株式会社 使用了含硅组合物的半导体基板的平坦化方法
JP6672991B2 (ja) * 2016-04-25 2020-03-25 信越化学工業株式会社 縮合硬化性樹脂組成物及び半導体装置
WO2018097284A1 (ja) * 2016-11-28 2018-05-31 国立大学法人 奈良先端科学技術大学院大学 保護膜を具備する薄膜トランジスタ基板およびその製造方法
JP2018189738A (ja) * 2017-04-28 2018-11-29 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ ポジ型感光性シロキサン組成物、およびそれを用いて形成した硬化膜
JP2019061166A (ja) 2017-09-27 2019-04-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ ポジ型感光性シロキサン組成物およびこれを用いた硬化膜
KR102654731B1 (ko) * 2017-09-28 2024-04-03 제이에스알 가부시끼가이샤 감방사선성 수지 조성물 및 그의 용도
JP2019099673A (ja) * 2017-12-01 2019-06-24 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ ポリシロキサン、これを含んでなる組成物、およびこれを用いた硬化膜
JP2019120750A (ja) 2017-12-28 2019-07-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 感光性シロキサン組成物およびこれを用いたパターン形成方法
JP7362665B2 (ja) * 2018-05-14 2023-10-17 エヌビーディー ナノテクノロジーズ， インコーポレイテッド オルガノシランコーティング組成物
KR102638142B1 (ko) * 2018-08-22 2024-02-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 제조 방법
JP2020084105A (ja) * 2018-11-29 2020-06-04 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ アクリル重合化ポリシロキサン、これを含んでなる組成物、およびこれを用いた硬化膜
CN110862690A (zh) * 2019-10-12 2020-03-06 温州新意特种纸业有限公司 石墨烯压延膜的配方

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1058816A (en) * 1963-08-01 1967-02-15 Gen Electric Improvements in silphenylene-containing polymers
GB1119666A (en) * 1965-08-06 1968-07-10 Ici Ltd Organosilicon polymers
JP2002076203A (ja) 2000-08-31 2002-03-15 Hitachi Chem Co Ltd ウエハレベルチップサイズパッケージ用の封止用成形材料及びウエハレベルチップサイズパッケージ
CN100510961C (zh) * 2003-10-07 2009-07-08 日立化成工业株式会社 放射线固化性组合物、其保存方法、固化膜形成方法、图案形成方法、图案使用方法、电子元件及光波导
JP4540961B2 (ja) 2003-10-10 2010-09-08 Ａｚエレクトロニックマテリアルズ株式会社 エッチングストッパー層形成用組成物
JP4860953B2 (ja) * 2005-07-08 2012-01-25 富士通株式会社 シリカ系被膜形成用材料、シリカ系被膜及びその製造方法、多層配線及びその製造方法、並びに、半導体装置及びその製造方法
EP2034364A4 (en) * 2006-06-27 2010-12-01 Jsr Corp METHOD FOR FORMING A STRUCTURE AND COMPOSITION FOR FORMING AN ORGANIC THIN FILM FOR USE THEREOF
US8026035B2 (en) * 2007-03-30 2011-09-27 Cheil Industries, Inc. Etch-resistant disilane and saturated hydrocarbon bridged silicon-containing polymers, method of making the same, and method of using the same
US20100178620A1 (en) * 2007-05-21 2010-07-15 Jsr Corporation Inverted pattern forming method and resin composition
JP5003279B2 (ja) * 2007-05-21 2012-08-15 Ｊｓｒ株式会社 反転パターン形成方法
JP5568892B2 (ja) * 2009-05-01 2014-08-13 Ｊｓｒ株式会社 ネガ型感放射線性組成物、硬化パターン形成方法及び硬化パターン
KR101674703B1 (ko) * 2009-10-30 2016-11-09 제이에스알 가부시끼가이샤 반전 패턴 형성 방법 및 폴리실록산 수지 조성물
US20120237873A1 (en) * 2009-12-20 2012-09-20 Toray Industries Inc. Positive photosensitive resin composition, cured film formed from the same, and device having cured film
JP5518772B2 (ja) 2011-03-15 2014-06-11 信越化学工業株式会社 パターン形成方法
CN103959168B (zh) * 2011-11-29 2017-07-04 默克专利有限公司 负型感光性硅氧烷组合物

Also Published As

Publication number Publication date
US9817312B2 (en) 2017-11-14
KR101896232B1 (ko) 2018-09-10
CN105764993A (zh) 2016-07-13
US20160266490A1 (en) 2016-09-15
TWI622623B (zh) 2018-05-01
IL244820B (en) 2019-06-30
PH12016500639A1 (en) 2016-05-30
JP2015108116A (ja) 2015-06-11
TW201527433A (zh) 2015-07-16
EP3061792A1 (en) 2016-08-31
EP3061792A4 (en) 2017-08-02
WO2015060155A1 (ja) 2015-04-30
CN105764993B (zh) 2019-04-09
KR20160076538A (ko) 2016-06-30
IL244820A0 (en) 2016-05-31
PH12016500639B1 (en) 2018-11-23

Similar Documents

Publication Publication Date Title
JP6480691B2 (ja) ケイ素含有熱または光硬化性組成物
US8883397B2 (en) Positive photosensitive siloxane composition
JP6513399B2 (ja) ネガ型感光性シロキサン組成物
JP6466087B2 (ja) 低温硬化可能なネガ型感光性組成物
JP6137862B2 (ja) ネガ型感光性シロキサン組成物
JP6272753B2 (ja) ネガ型感光性シロキサン組成物
CN104797978A (zh) 正型感光性硅氧烷组合物
JP6173918B2 (ja) ネガ型感光性シロキサン組成物
CN111148805B (zh) 正型感光性硅氧烷组合物以及使用了其的固化膜
CN104238271B (zh) 能低温固化的负型感光性组合物
JP2019099673A (ja) ポリシロキサン、これを含んでなる組成物、およびこれを用いた硬化膜
JP6639724B1 (ja) ポジ型感光性ポリシロキサン組成物

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20161125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170403

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170612

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20171128

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20180105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180123

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180424

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181101

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20181108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20181101

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190208

R150 Certificate of patent or registration of utility model

Ref document number: 6480691

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees