JP6477328B2 - パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置 - Google Patents

パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置 Download PDF

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JP6477328B2
JP6477328B2 JP2015147971A JP2015147971A JP6477328B2 JP 6477328 B2 JP6477328 B2 JP 6477328B2 JP 2015147971 A JP2015147971 A JP 2015147971A JP 2015147971 A JP2015147971 A JP 2015147971A JP 6477328 B2 JP6477328 B2 JP 6477328B2
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Japan
Prior art keywords
electrode
package
resin
manufacturing
lead frame
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JP2015147971A
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English (en)
Japanese (ja)
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JP2016072607A (ja
Inventor
真弓 福田
真弓 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to KR1020150136099A priority Critical patent/KR101760574B1/ko
Priority to EP19155466.6A priority patent/EP3511147B1/en
Priority to US14/867,096 priority patent/US9640743B2/en
Priority to EP15187159.7A priority patent/EP3000579B1/en
Priority to CN201510631823.9A priority patent/CN105470206B/zh
Priority to CN201811463999.8A priority patent/CN110076953B/zh
Priority to TW104132273A priority patent/TWI593133B/zh
Publication of JP2016072607A publication Critical patent/JP2016072607A/ja
Priority to US15/471,324 priority patent/US10505090B2/en
Application granted granted Critical
Publication of JP6477328B2 publication Critical patent/JP6477328B2/ja
Priority to US16/679,982 priority patent/US11043623B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2015147971A 2014-09-29 2015-07-27 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置 Active JP6477328B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020150136099A KR101760574B1 (ko) 2014-09-29 2015-09-25 패키지의 제조 방법 및 발광 장치의 제조 방법 및 패키지 및 발광 장치
US14/867,096 US9640743B2 (en) 2014-09-29 2015-09-28 Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
EP15187159.7A EP3000579B1 (en) 2014-09-29 2015-09-28 Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
EP19155466.6A EP3511147B1 (en) 2014-09-29 2015-09-28 Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device
CN201510631823.9A CN105470206B (zh) 2014-09-29 2015-09-29 封装的制造方法、发光装置的制造方法及封装、发光装置
CN201811463999.8A CN110076953B (zh) 2014-09-29 2015-09-29 封装的制造方法、发光装置的制造方法及封装、发光装置
TW104132273A TWI593133B (zh) 2014-09-29 2015-09-30 封裝之製造方法及發光裝置之製造方法、與封裝及發光裝置
US15/471,324 US10505090B2 (en) 2014-09-29 2017-03-28 Package including lead component having recess
US16/679,982 US11043623B2 (en) 2014-09-29 2019-11-11 Package including lead component having recess

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014198743 2014-09-29
JP2014198743 2014-09-29

Related Child Applications (1)

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JP2019006916A Division JP6642746B2 (ja) 2014-09-29 2019-01-18 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置

Publications (2)

Publication Number Publication Date
JP2016072607A JP2016072607A (ja) 2016-05-09
JP6477328B2 true JP6477328B2 (ja) 2019-03-06

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JP2015147971A Active JP6477328B2 (ja) 2014-09-29 2015-07-27 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP2019006916A Active JP6642746B2 (ja) 2014-09-29 2019-01-18 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置

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Country Status (3)

Country Link
JP (2) JP6477328B2 (ko)
KR (1) KR101760574B1 (ko)
TW (1) TWI593133B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6337873B2 (ja) 2015-11-30 2018-06-06 日亜化学工業株式会社 パッケージ、パッケージ中間体、発光装置及びそれらの製造方法
JP6332253B2 (ja) * 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP6332251B2 (ja) 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP7355998B2 (ja) * 2019-06-03 2023-10-04 日亜化学工業株式会社 リードフレーム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04729A (ja) * 1990-04-10 1992-01-06 Sanken Electric Co Ltd 樹脂封止形電子部品の製造方法
JPH08195467A (ja) * 1995-01-17 1996-07-30 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置の製造方法
JP4654670B2 (ja) * 2003-12-16 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP4830768B2 (ja) * 2006-05-10 2011-12-07 日亜化学工業株式会社 半導体発光装置及び半導体発光装置の製造方法
JP5122172B2 (ja) * 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
JP2009021394A (ja) * 2007-07-12 2009-01-29 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
JP4790750B2 (ja) * 2008-04-18 2011-10-12 オンセミコンダクター・トレーディング・リミテッド 樹脂封止型半導体装置の製造方法
JP5217800B2 (ja) * 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
JP5246662B2 (ja) * 2009-02-13 2013-07-24 パナソニック株式会社 半導体装置用パッケージおよびその製造方法
JP2010251493A (ja) * 2009-04-15 2010-11-04 Panasonic Corp 半導体発光装置用リードフレーム及び半導体発光装置
TW201128812A (en) * 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
TWM394578U (en) * 2010-04-20 2010-12-11 Sdi Corp Frame substrate of illumination device and its package structure
KR101859149B1 (ko) * 2011-04-14 2018-05-17 엘지이노텍 주식회사 발광 소자 패키지
JP6205686B2 (ja) * 2011-08-23 2017-10-04 大日本印刷株式会社 光半導体装置
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
JP2015005584A (ja) * 2013-06-20 2015-01-08 日立アプライアンス株式会社 照明装置

Also Published As

Publication number Publication date
JP2019087755A (ja) 2019-06-06
TWI593133B (zh) 2017-07-21
KR20160037789A (ko) 2016-04-06
JP2016072607A (ja) 2016-05-09
JP6642746B2 (ja) 2020-02-12
KR101760574B1 (ko) 2017-07-21
TW201618325A (zh) 2016-05-16

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