JP6467594B2 - 基板挿入装置 - Google Patents
基板挿入装置 Download PDFInfo
- Publication number
- JP6467594B2 JP6467594B2 JP2016151645A JP2016151645A JP6467594B2 JP 6467594 B2 JP6467594 B2 JP 6467594B2 JP 2016151645 A JP2016151645 A JP 2016151645A JP 2016151645 A JP2016151645 A JP 2016151645A JP 6467594 B2 JP6467594 B2 JP 6467594B2
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- JP
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- Prior art keywords
- substrate
- connector
- board
- holding
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
3 電子基板
4 コネクタ
4b 挿入溝
4d イジェクタ
6 基板供給部
7 基板
7c 端子
7d 第1の端面
7e 第2の端面
7f 側端面
8 作業ロボット
10 基板挿入ツール
12 保持部
12h 押圧部
13A,13B 挿入ガイド部
16 シリンダ
19A,19B レバー部材
20 支点
21 連結部材
22 ローラ部材
23 位置決め部材
23a,23b テーパ面
24 バネ部材
[P1] 閉鎖位置
[P2] 開放位置
Claims (6)
- 端面に端子を備える基板を、前記基板が挿入される挿入溝と、前記挿入溝への前記基板の挿入を許容する開放位置と前記挿入溝への前記基板の挿入を禁止する閉鎖位置との間で移動可能なイジェクタと、を備えるコネクタに挿入する基板挿入装置であって、
前記端子が設けられた第1の端面とその反対側の第2の端面とを有する基板を、前記第1の端面を露出させた状態で保持する保持部と、
前記保持部に対して、前記コネクタへの前記基板の挿入方向に摺動可能に設けられるとともに、前記保持部に保持される前記基板の前記第1の端面よりも前記挿入方向に突出し前記コネクタへの前記基板の挿入時に前記コネクタと当接する先端部を備える挿入ガイド部と、
前記コネクタへの前記基板の挿入時に前記イジェクタと当接する当接部と、
前記保持部または前記挿入ガイド部のいずれか一方に設けられ、前記保持部または前記挿入ガイド部のいずれか他方と係合しており、前記保持部と前記挿入ガイド部との相対位置の変化を、前記当接部が前記イジェクタの位置を前記閉鎖位置から前記開放位置に変化させる動きに変換する変換機構とを備えた、基板挿入装置。 - 前記変換機構は、前記挿入ガイド部に設けられた支点によって一方の端部と他方の端部との中間部を軸支されたレバー部材を有し、
前記当接部は前記レバー部材の前記一方の端部に設けられ、前記レバー部材の他方の端部は前記保持部に係合する、請求項1に記載の基板挿入装置。 - 前記保持部に設けられ、前記挿入ガイド部を前記保持部に対して前記挿入方向へ相対移動させる駆動部を備えた、請求項1または2のいずれかに記載の基板挿入装置。
- 前記先端部は前記コネクタを挟むように複数配置され、前記コネクタとの接触面には位置補正用のテーパ面が形成されており、複数の前記先端部を前記コネクタに当接させることにより前記基板と前記コネクタとの位置ずれが補正される、請求項1乃至3のいずれかに記載の基板挿入装置。
- 前記保持部が、前記第2の端面に当接する押圧部と、前記基板が備える前記第1の端面と前記第2の端面以外の互いに対向する2つの端面に当接して前記基板を把持する把持手段を備える、請求項1乃至4のいずれかに記載の基板挿入装置。
- 前記把持手段が、前記2つの端面の少なくとも一方を押圧するバネ部材を備える、請求項5に記載の基板挿入装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016151645A JP6467594B2 (ja) | 2016-08-02 | 2016-08-02 | 基板挿入装置 |
US15/644,936 US10707636B2 (en) | 2016-08-02 | 2017-07-10 | Board insertion device |
CN201710637131.4A CN107683030B (zh) | 2016-08-02 | 2017-07-28 | 基板插入装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016151645A JP6467594B2 (ja) | 2016-08-02 | 2016-08-02 | 基板挿入装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018022578A JP2018022578A (ja) | 2018-02-08 |
JP6467594B2 true JP6467594B2 (ja) | 2019-02-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016151645A Active JP6467594B2 (ja) | 2016-08-02 | 2016-08-02 | 基板挿入装置 |
Country Status (3)
Country | Link |
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US (1) | US10707636B2 (ja) |
JP (1) | JP6467594B2 (ja) |
CN (1) | CN107683030B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6467594B2 (ja) * | 2016-08-02 | 2019-02-13 | パナソニックIpマネジメント株式会社 | 基板挿入装置 |
CN109310473B (zh) * | 2016-09-19 | 2023-02-17 | 直观外科手术操作公司 | 用于可控臂的基部定位系统以及相关方法 |
CN112105371A (zh) | 2018-02-09 | 2020-12-18 | 内斯托尔株式会社 | 脂多糖控制性肠道细菌及其用途 |
JP6923504B2 (ja) * | 2018-11-29 | 2021-08-18 | Necプラットフォームズ株式会社 | 基板ソケットおよび基板固定方法 |
US11378608B2 (en) | 2019-07-19 | 2022-07-05 | Dell Products L.P. | System and method for device state determination |
US11644425B2 (en) | 2019-07-19 | 2023-05-09 | Dell Products L.P. | System and method for optical state determination |
US11399450B2 (en) | 2019-07-19 | 2022-07-26 | Dell Products L.P. | System and method for managing electromagnetic interference |
US11129307B2 (en) | 2019-07-19 | 2021-09-21 | Dell Products L.P. | System and method for managing thermal states of devices |
US11122718B2 (en) | 2019-07-19 | 2021-09-14 | Dell Products L.P. | System and method for device level electromagnetic interference management |
US10917996B1 (en) | 2019-07-19 | 2021-02-09 | Dell Products L.P. | System and method for device level thermal management and electromagnetic interference management |
US10980159B2 (en) | 2019-07-19 | 2021-04-13 | Dell Products L.P. | System and method for managing multiple connections |
US11234347B2 (en) * | 2019-07-19 | 2022-01-25 | Dell Products L.P. | System and method for physical management of devices |
US11132038B2 (en) | 2019-07-19 | 2021-09-28 | Dell Products L.P. | System and method for thermal management of shadowed devices |
US11143682B2 (en) | 2019-07-19 | 2021-10-12 | Dell Products L.P. | System and method for communicating externally from an electromagnetic interference suppressed volume |
DE102019211603B4 (de) * | 2019-08-01 | 2021-05-20 | Asys Automatisierungssysteme Gmbh | Substratmagazin, Substratmagazinsystem und Substratbestückungsanlage |
US11147194B2 (en) | 2019-08-21 | 2021-10-12 | Dell Products L.P. | System and method for managing electromagnetic interference |
US11234350B2 (en) | 2019-08-21 | 2022-01-25 | Dell Products L.P. | System and method for isolated device access |
US11914345B2 (en) * | 2020-05-12 | 2024-02-27 | Google Llc | DIMM insertion electronic cam insertion profile |
JP7231287B1 (ja) * | 2022-01-27 | 2023-03-01 | Necプラットフォームズ株式会社 | メモリ挿抜装置及び挿抜方法 |
TWI831566B (zh) * | 2022-07-24 | 2024-02-01 | 緯穎科技服務股份有限公司 | 組立系統、相關的夾爪裝置以及相關的方法 |
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JP6467594B2 (ja) * | 2016-08-02 | 2019-02-13 | パナソニックIpマネジメント株式会社 | 基板挿入装置 |
-
2016
- 2016-08-02 JP JP2016151645A patent/JP6467594B2/ja active Active
-
2017
- 2017-07-10 US US15/644,936 patent/US10707636B2/en active Active
- 2017-07-28 CN CN201710637131.4A patent/CN107683030B/zh active Active
Also Published As
Publication number | Publication date |
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US20180040999A1 (en) | 2018-02-08 |
CN107683030A (zh) | 2018-02-09 |
JP2018022578A (ja) | 2018-02-08 |
CN107683030B (zh) | 2021-05-07 |
US10707636B2 (en) | 2020-07-07 |
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