JP6452381B2 - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP6452381B2
JP6452381B2 JP2014216615A JP2014216615A JP6452381B2 JP 6452381 B2 JP6452381 B2 JP 6452381B2 JP 2014216615 A JP2014216615 A JP 2014216615A JP 2014216615 A JP2014216615 A JP 2014216615A JP 6452381 B2 JP6452381 B2 JP 6452381B2
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Japan
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unit
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Expired - Fee Related
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JP2014216615A
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English (en)
Japanese (ja)
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JP2016086242A5 (enExample
JP2016086242A (ja
Inventor
智樹 楠崎
智樹 楠崎
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014216615A priority Critical patent/JP6452381B2/ja
Priority to US14/887,003 priority patent/US9560299B2/en
Publication of JP2016086242A publication Critical patent/JP2016086242A/ja
Publication of JP2016086242A5 publication Critical patent/JP2016086242A5/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2014216615A 2014-10-23 2014-10-23 撮像装置 Expired - Fee Related JP6452381B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014216615A JP6452381B2 (ja) 2014-10-23 2014-10-23 撮像装置
US14/887,003 US9560299B2 (en) 2014-10-23 2015-10-19 Image pickup apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014216615A JP6452381B2 (ja) 2014-10-23 2014-10-23 撮像装置

Publications (3)

Publication Number Publication Date
JP2016086242A JP2016086242A (ja) 2016-05-19
JP2016086242A5 JP2016086242A5 (enExample) 2017-11-30
JP6452381B2 true JP6452381B2 (ja) 2019-01-16

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Family Applications (1)

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JP2014216615A Expired - Fee Related JP6452381B2 (ja) 2014-10-23 2014-10-23 撮像装置

Country Status (2)

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US (1) US9560299B2 (enExample)
JP (1) JP6452381B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183563A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 撮像装置、駆動方法、および、電子機器
WO2017203839A1 (ja) * 2016-05-24 2017-11-30 ソニー株式会社 固体撮像素子および撮像装置
JP6727938B2 (ja) * 2016-06-10 2020-07-22 キヤノン株式会社 撮像装置、撮像装置の制御方法、及び撮像システム
JP6776011B2 (ja) * 2016-06-10 2020-10-28 キヤノン株式会社 撮像装置及び撮像システム
JP6746421B2 (ja) * 2016-07-29 2020-08-26 キヤノン株式会社 撮像装置
TW201817223A (zh) * 2016-10-20 2018-05-01 原相科技股份有限公司 全域快門高動態範圍像素及全域快門高動態範圍影像感測器
KR102493823B1 (ko) * 2018-03-08 2023-02-01 삼성전자주식회사 이미지 센서, 이를 포함하는 이미지 검출 시스템, 및 이미지 센서의 동작 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1868377B1 (en) * 2005-04-07 2014-10-29 Tohoku University Light sensor, solid-state image pickup device and method for operating solid-state image pickup device
JP2007329722A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd 固体撮像素子、デジタルカメラ
JP2008028678A (ja) * 2006-07-20 2008-02-07 Pentax Corp 撮像素子
JP5167677B2 (ja) * 2007-04-12 2013-03-21 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、固体撮像装置の信号処理方法および撮像装置
EP2046022A1 (en) * 2007-10-02 2009-04-08 Melexis NV Sensing element readout circuit and sensing array
CN102017150B (zh) 2008-05-02 2016-08-03 佳能株式会社 固态成像装置
US8860861B2 (en) * 2008-08-11 2014-10-14 Honda Motor Co., Ltd. Pixel, pixel forming method, imaging device and imaging forming method
JP2010194291A (ja) * 2009-01-30 2010-09-09 Fujifilm Corp 内視鏡装置及びその駆動方法
US8786745B2 (en) * 2010-02-05 2014-07-22 National University Corporation Shizuoka University Solid-state image pickup device
JP5516960B2 (ja) * 2010-04-02 2014-06-11 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、および、電子機器
US9118883B2 (en) * 2011-11-28 2015-08-25 Semiconductor Components Industries, Llc High dynamic range imaging with multi-storage pixels
US9007489B2 (en) * 2012-02-28 2015-04-14 Semiconductor Components Industries, Llc Method and apparatus for image background removal and replacement
JP6141160B2 (ja) * 2013-09-25 2017-06-07 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子およびその動作方法、並びに電子機器およびその動作方法

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Publication number Publication date
JP2016086242A (ja) 2016-05-19
US9560299B2 (en) 2017-01-31
US20160119566A1 (en) 2016-04-28

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