JP6446912B2 - ブレーク装置 - Google Patents

ブレーク装置 Download PDF

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Publication number
JP6446912B2
JP6446912B2 JP2014171059A JP2014171059A JP6446912B2 JP 6446912 B2 JP6446912 B2 JP 6446912B2 JP 2014171059 A JP2014171059 A JP 2014171059A JP 2014171059 A JP2014171059 A JP 2014171059A JP 6446912 B2 JP6446912 B2 JP 6446912B2
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JP
Japan
Prior art keywords
brittle material
material substrate
support bar
auxiliary support
stages
Prior art date
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Active
Application number
JP2014171059A
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English (en)
Japanese (ja)
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JP2016043638A (ja
JP2016043638A5 (cg-RX-API-DMAC7.html
Inventor
卓朗 三谷
卓朗 三谷
雄一 金平
雄一 金平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2014171059A priority Critical patent/JP6446912B2/ja
Priority to KR1020150047233A priority patent/KR102351929B1/ko
Priority to CN201510177779.9A priority patent/CN106142369B/zh
Priority to TW104116538A priority patent/TWI654063B/zh
Publication of JP2016043638A publication Critical patent/JP2016043638A/ja
Publication of JP2016043638A5 publication Critical patent/JP2016043638A5/ja
Application granted granted Critical
Publication of JP6446912B2 publication Critical patent/JP6446912B2/ja
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  • Engineering & Computer Science (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2014171059A 2014-08-26 2014-08-26 ブレーク装置 Active JP6446912B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014171059A JP6446912B2 (ja) 2014-08-26 2014-08-26 ブレーク装置
KR1020150047233A KR102351929B1 (ko) 2014-08-26 2015-04-03 브레이크 장치
CN201510177779.9A CN106142369B (zh) 2014-08-26 2015-04-15 切断装置
TW104116538A TWI654063B (zh) 2014-08-26 2015-05-22 Breaking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014171059A JP6446912B2 (ja) 2014-08-26 2014-08-26 ブレーク装置

Publications (3)

Publication Number Publication Date
JP2016043638A JP2016043638A (ja) 2016-04-04
JP2016043638A5 JP2016043638A5 (cg-RX-API-DMAC7.html) 2017-08-17
JP6446912B2 true JP6446912B2 (ja) 2019-01-09

Family

ID=55540184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014171059A Active JP6446912B2 (ja) 2014-08-26 2014-08-26 ブレーク装置

Country Status (4)

Country Link
JP (1) JP6446912B2 (cg-RX-API-DMAC7.html)
KR (1) KR102351929B1 (cg-RX-API-DMAC7.html)
CN (1) CN106142369B (cg-RX-API-DMAC7.html)
TW (1) TWI654063B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI797154B (zh) * 2018-01-31 2023-04-01 日商三星鑽石工業股份有限公司 膜剝離機構及基板裂斷系統
TW202041343A (zh) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
JP4589201B2 (ja) * 2005-08-23 2010-12-01 株式会社ディスコ 基板の切削装置
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
US20100175834A1 (en) * 2009-01-13 2010-07-15 Shin-Kan Liu Wafer splitting laminate mechanism
TWI508153B (zh) * 2010-04-30 2015-11-11 Mitsuboshi Diamond Ind Co Ltd Disconnection device and disconnection method of brittle material substrate
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
KR101217398B1 (ko) * 2011-02-25 2013-01-02 앰코 테크놀로지 코리아 주식회사 웨이퍼 다이싱 장치 및 이를 이용한 웨이퍼 다이싱 방법
JP5589899B2 (ja) * 2011-03-03 2014-09-17 株式会社デンソー 基板の分割方法及び分割装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Also Published As

Publication number Publication date
CN106142369A (zh) 2016-11-23
KR20160024734A (ko) 2016-03-07
TW201607717A (zh) 2016-03-01
JP2016043638A (ja) 2016-04-04
TWI654063B (zh) 2019-03-21
KR102351929B1 (ko) 2022-01-14
CN106142369B (zh) 2019-10-15

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