TWI654063B - Breaking device - Google Patents
Breaking deviceInfo
- Publication number
- TWI654063B TWI654063B TW104116538A TW104116538A TWI654063B TW I654063 B TWI654063 B TW I654063B TW 104116538 A TW104116538 A TW 104116538A TW 104116538 A TW104116538 A TW 104116538A TW I654063 B TWI654063 B TW I654063B
- Authority
- TW
- Taiwan
- Prior art keywords
- brittle material
- material substrate
- auxiliary support
- stages
- horizontal plane
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 77
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 239000002313 adhesive film Substances 0.000 claims abstract description 19
- 238000000926 separation method Methods 0.000 claims description 3
- 230000036544 posture Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-171059 | 2014-08-26 | ||
| JP2014171059A JP6446912B2 (ja) | 2014-08-26 | 2014-08-26 | ブレーク装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201607717A TW201607717A (zh) | 2016-03-01 |
| TWI654063B true TWI654063B (zh) | 2019-03-21 |
Family
ID=55540184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104116538A TWI654063B (zh) | 2014-08-26 | 2015-05-22 | Breaking device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6446912B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102351929B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN106142369B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI654063B (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI797154B (zh) * | 2018-01-31 | 2023-04-01 | 日商三星鑽石工業股份有限公司 | 膜剝離機構及基板裂斷系統 |
| TW202041343A (zh) * | 2018-12-18 | 2020-11-16 | 日商三星鑽石工業股份有限公司 | 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004026539A (ja) * | 2002-06-24 | 2004-01-29 | Nakamura Tome Precision Ind Co Ltd | ガラス基板の割断加工方法及びその装置 |
| JP4589201B2 (ja) * | 2005-08-23 | 2010-12-01 | 株式会社ディスコ | 基板の切削装置 |
| KR100748305B1 (ko) * | 2006-03-02 | 2007-08-09 | 삼성에스디아이 주식회사 | 절단된 기판의 이송방법 |
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| TWI508153B (zh) * | 2010-04-30 | 2015-11-11 | Mitsuboshi Diamond Ind Co Ltd | Disconnection device and disconnection method of brittle material substrate |
| JP5182339B2 (ja) * | 2010-08-31 | 2013-04-17 | 三星ダイヤモンド工業株式会社 | 基板ブレーク装置 |
| JP5187421B2 (ja) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
| KR101217398B1 (ko) * | 2011-02-25 | 2013-01-02 | 앰코 테크놀로지 코리아 주식회사 | 웨이퍼 다이싱 장치 및 이를 이용한 웨이퍼 다이싱 방법 |
| JP5589899B2 (ja) * | 2011-03-03 | 2014-09-17 | 株式会社デンソー | 基板の分割方法及び分割装置 |
| JP2013071335A (ja) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | マザー基板の分断方法 |
| JP6039363B2 (ja) * | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
-
2014
- 2014-08-26 JP JP2014171059A patent/JP6446912B2/ja active Active
-
2015
- 2015-04-03 KR KR1020150047233A patent/KR102351929B1/ko active Active
- 2015-04-15 CN CN201510177779.9A patent/CN106142369B/zh active Active
- 2015-05-22 TW TW104116538A patent/TWI654063B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106142369A (zh) | 2016-11-23 |
| KR20160024734A (ko) | 2016-03-07 |
| TW201607717A (zh) | 2016-03-01 |
| JP2016043638A (ja) | 2016-04-04 |
| KR102351929B1 (ko) | 2022-01-14 |
| CN106142369B (zh) | 2019-10-15 |
| JP6446912B2 (ja) | 2019-01-09 |
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