JP6445753B2 - 変位センサ - Google Patents
変位センサ Download PDFInfo
- Publication number
- JP6445753B2 JP6445753B2 JP2013140084A JP2013140084A JP6445753B2 JP 6445753 B2 JP6445753 B2 JP 6445753B2 JP 2013140084 A JP2013140084 A JP 2013140084A JP 2013140084 A JP2013140084 A JP 2013140084A JP 6445753 B2 JP6445753 B2 JP 6445753B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- case
- sensor unit
- displacement
- movable body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006073 displacement reaction Methods 0.000 title claims description 34
- 239000011810 insulating material Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 13
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Description
4 シリンダヘッド(支持体)
6 センサホルダ(ケース)
7 連通孔(収容部)
10 変位センサ
14 ケース
17 基端部(絶縁部材)
18 センサ部
19 スプリング(付勢部材)
20 ベアリング(隙間形成部材)
23 絶縁リング(絶縁部材)
Claims (3)
- 可動体の変位量を検出する変位センサであって、
前記可動体の変位に伴って変化する磁界に応じた信号を出力するセンサ部と、
前記センサ部を前記可動体に向けて付勢する付勢部材と、
前記センサ部の先端側に装着されて前記可動体に摺接し、前記可動体と前記センサ部との間に隙間を形成する隙間形成部材と、
前記可動体を変位可能に支持する支持体と、
前記支持体に連結され、前記センサ部を進退可能に収容する収容部を有するケースと、
前記センサ部と前記ケースとの間に介装され、前記センサ部と前記ケースとを電気的に絶縁する絶縁部材と、
を備え、
前記隙間形成部材は絶縁材料によって形成される、
ことを特徴とする変位センサ。 - 前記絶縁部材は、前記センサ部の側面に装着され前記収容部に摺接する、
ことを特徴とする請求項1に記載の変位センサ。 - 前記絶縁部材は、前記ケースに支持されて前記付勢部材の基端を支持する、
ことを特徴とする請求項1又は請求項2に記載の変位センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013140084A JP6445753B2 (ja) | 2013-07-03 | 2013-07-03 | 変位センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013140084A JP6445753B2 (ja) | 2013-07-03 | 2013-07-03 | 変位センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015014481A JP2015014481A (ja) | 2015-01-22 |
JP6445753B2 true JP6445753B2 (ja) | 2018-12-26 |
Family
ID=52436301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013140084A Active JP6445753B2 (ja) | 2013-07-03 | 2013-07-03 | 変位センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6445753B2 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07208905A (ja) * | 1994-01-25 | 1995-08-11 | Nhk Spring Co Ltd | 接触式変位センサおよびこのセンサを用いたワーク測定装置 |
JPH0942907A (ja) * | 1995-08-02 | 1997-02-14 | Kayaba Ind Co Ltd | 位置検出装置 |
JPH09257515A (ja) * | 1996-03-19 | 1997-10-03 | Kayaba Ind Co Ltd | 位置検出装置 |
-
2013
- 2013-07-03 JP JP2013140084A patent/JP6445753B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015014481A (ja) | 2015-01-22 |
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