JP6444269B2 - 電子部品装置及びその製造方法 - Google Patents

電子部品装置及びその製造方法 Download PDF

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Publication number
JP6444269B2
JP6444269B2 JP2015124110A JP2015124110A JP6444269B2 JP 6444269 B2 JP6444269 B2 JP 6444269B2 JP 2015124110 A JP2015124110 A JP 2015124110A JP 2015124110 A JP2015124110 A JP 2015124110A JP 6444269 B2 JP6444269 B2 JP 6444269B2
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JP
Japan
Prior art keywords
electronic component
insulating layer
wiring board
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015124110A
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English (en)
Japanese (ja)
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JP2017011075A (ja
JP2017011075A5 (enExample
Inventor
翔太 三木
翔太 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015124110A priority Critical patent/JP6444269B2/ja
Priority to US15/184,380 priority patent/US10485098B2/en
Publication of JP2017011075A publication Critical patent/JP2017011075A/ja
Publication of JP2017011075A5 publication Critical patent/JP2017011075A5/ja
Application granted granted Critical
Publication of JP6444269B2 publication Critical patent/JP6444269B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H10P72/74—
    • H10W70/614—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H10P72/7424—
    • H10P72/743—
    • H10W70/611—
    • H10W70/635—
    • H10W70/685—
    • H10W72/01235—
    • H10W72/01238—
    • H10W72/01255—
    • H10W72/01323—
    • H10W72/01325—
    • H10W72/019—
    • H10W72/01931—
    • H10W72/01953—
    • H10W72/0198—
    • H10W72/07141—
    • H10W72/07178—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/07352—
    • H10W72/20—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W72/321—
    • H10W72/354—
    • H10W72/90—
    • H10W72/952—
    • H10W74/00—
    • H10W74/019—
    • H10W74/15—
    • H10W90/00—
    • H10W90/724—
    • H10W90/734—
    • H10W99/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015124110A 2015-06-19 2015-06-19 電子部品装置及びその製造方法 Active JP6444269B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015124110A JP6444269B2 (ja) 2015-06-19 2015-06-19 電子部品装置及びその製造方法
US15/184,380 US10485098B2 (en) 2015-06-19 2016-06-16 Electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015124110A JP6444269B2 (ja) 2015-06-19 2015-06-19 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2017011075A JP2017011075A (ja) 2017-01-12
JP2017011075A5 JP2017011075A5 (enExample) 2018-01-25
JP6444269B2 true JP6444269B2 (ja) 2018-12-26

Family

ID=57588787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015124110A Active JP6444269B2 (ja) 2015-06-19 2015-06-19 電子部品装置及びその製造方法

Country Status (2)

Country Link
US (1) US10485098B2 (enExample)
JP (1) JP6444269B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US10643936B2 (en) * 2017-05-31 2020-05-05 Dyi-chung Hu Package substrate and package structure
US10957672B2 (en) * 2017-11-13 2021-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
US10903169B2 (en) 2019-04-30 2021-01-26 Advanced Semiconductor Engineering, Inc. Conductive structure and wiring structure including the same
US11069605B2 (en) * 2019-04-30 2021-07-20 Advanced Semiconductor Engineering, Inc. Wiring structure having low and high density stacked structures
KR102669257B1 (ko) * 2019-07-12 2024-05-28 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지

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CN101303984B (zh) * 2001-06-07 2012-02-15 瑞萨电子株式会社 半导体装置的制造方法
US6660560B2 (en) * 2001-09-10 2003-12-09 Delphi Technologies, Inc. No-flow underfill material and underfill method for flip chip devices
JP3910045B2 (ja) * 2001-11-05 2007-04-25 シャープ株式会社 電子部品内装配線板の製造方法
DE10360708B4 (de) * 2003-12-19 2008-04-10 Infineon Technologies Ag Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
JP2006324568A (ja) 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 多層モジュールとその製造方法
JP4870501B2 (ja) * 2005-09-13 2012-02-08 新光電気工業株式会社 電子部品内蔵基板の製造方法
US7640655B2 (en) * 2005-09-13 2010-01-05 Shinko Electric Industries Co., Ltd. Electronic component embedded board and its manufacturing method
JPWO2007069606A1 (ja) 2005-12-14 2009-05-21 新光電気工業株式会社 チップ内蔵基板の製造方法
JP4182140B2 (ja) * 2005-12-14 2008-11-19 新光電気工業株式会社 チップ内蔵基板
JP5003260B2 (ja) * 2007-04-13 2012-08-15 日本電気株式会社 半導体装置およびその製造方法
KR101501739B1 (ko) * 2008-03-21 2015-03-11 삼성전자주식회사 반도체 패키지 제조 방법
KR101479506B1 (ko) * 2008-06-30 2015-01-07 삼성전자주식회사 임베디드 배선 기판, 이를 포함하는 반도체 패키지 및 그제조 방법
JP2010147153A (ja) 2008-12-17 2010-07-01 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
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JP5951414B2 (ja) * 2012-08-29 2016-07-13 新光電気工業株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
JP6076653B2 (ja) * 2012-08-29 2017-02-08 新光電気工業株式会社 電子部品内蔵基板及び電子部品内蔵基板の製造方法
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JP2015195263A (ja) * 2014-03-31 2015-11-05 マイクロン テクノロジー， インク． 半導体装置及びその製造方法
KR102198858B1 (ko) * 2014-07-24 2021-01-05 삼성전자 주식회사 인터포저 기판을 갖는 반도체 패키지 적층 구조체
JP6358431B2 (ja) * 2014-08-25 2018-07-18 新光電気工業株式会社 電子部品装置及びその製造方法
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法

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Publication number Publication date
JP2017011075A (ja) 2017-01-12
US10485098B2 (en) 2019-11-19
US20160374194A1 (en) 2016-12-22

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