JP6424839B2 - 電子制御ユニット、および、これを用いた電動パワーステアリング装置 - Google Patents

電子制御ユニット、および、これを用いた電動パワーステアリング装置 Download PDF

Info

Publication number
JP6424839B2
JP6424839B2 JP2016002868A JP2016002868A JP6424839B2 JP 6424839 B2 JP6424839 B2 JP 6424839B2 JP 2016002868 A JP2016002868 A JP 2016002868A JP 2016002868 A JP2016002868 A JP 2016002868A JP 6424839 B2 JP6424839 B2 JP 6424839B2
Authority
JP
Japan
Prior art keywords
heat
component
substrate
control unit
electronic control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016002868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017123439A5 (enExample
JP2017123439A (ja
Inventor
剛 田島
剛 田島
内田　貴之
貴之 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2016002868A priority Critical patent/JP6424839B2/ja
Priority to PCT/JP2016/087497 priority patent/WO2017119263A1/ja
Priority to US16/067,972 priority patent/US11084521B2/en
Priority to CN201680077889.0A priority patent/CN108476601B/zh
Publication of JP2017123439A publication Critical patent/JP2017123439A/ja
Publication of JP2017123439A5 publication Critical patent/JP2017123439A5/ja
Application granted granted Critical
Publication of JP6424839B2 publication Critical patent/JP6424839B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0457—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by control features of the drive means as such
    • B62D5/046—Controlling the motor
    • B62D5/0463—Controlling the motor calculating assisting torque from the motor based on driver input
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Steering Mechanism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Materials Engineering (AREA)
JP2016002868A 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置 Active JP6424839B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016002868A JP6424839B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置
PCT/JP2016/087497 WO2017119263A1 (ja) 2016-01-08 2016-12-16 電子制御ユニット、および、これを用いた電動パワーステアリング装置
US16/067,972 US11084521B2 (en) 2016-01-08 2016-12-16 Electronic control unit and electric power steering device using the same
CN201680077889.0A CN108476601B (zh) 2016-01-08 2016-12-16 电子控制单元及使用该电子控制单元的电动助力转向装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016002868A JP6424839B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置

Publications (3)

Publication Number Publication Date
JP2017123439A JP2017123439A (ja) 2017-07-13
JP2017123439A5 JP2017123439A5 (enExample) 2018-04-19
JP6424839B2 true JP6424839B2 (ja) 2018-11-21

Family

ID=59273550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016002868A Active JP6424839B2 (ja) 2016-01-08 2016-01-08 電子制御ユニット、および、これを用いた電動パワーステアリング装置

Country Status (4)

Country Link
US (1) US11084521B2 (enExample)
JP (1) JP6424839B2 (enExample)
CN (1) CN108476601B (enExample)
WO (1) WO2017119263A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6683020B2 (ja) * 2016-06-01 2020-04-15 株式会社デンソー 電力変換装置、及び、これを用いた電動パワーステアリング装置
JP6737221B2 (ja) * 2017-04-11 2020-08-05 株式会社デンソー 電動パワーステアリング制御装置および電子ユニット。
JP6838501B2 (ja) * 2017-06-14 2021-03-03 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093960A (ja) * 2000-09-12 2002-03-29 Nec Corp マルチチップモジュールの冷却構造およびその製造方法
JP2004022983A (ja) * 2002-06-19 2004-01-22 Mitsubishi Electric Corp 半導体装置
JP2006041199A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 電子装置
JP2010245174A (ja) 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
JP5110049B2 (ja) 2009-07-16 2012-12-26 株式会社デンソー 電子制御装置
JP2013004953A (ja) 2011-06-22 2013-01-07 Denso Corp 電子制御装置
JP3193907U (ja) * 2011-12-26 2014-10-30 オートリブ ディベロップメント エービー 乗員拘束装置制御装置
JP6002473B2 (ja) * 2012-06-29 2016-10-05 日立アプライアンス株式会社 電子機器、および、パワーコンディショナ
JP5803856B2 (ja) * 2012-09-06 2015-11-04 株式会社デンソー 電子制御ユニット
JP2014063930A (ja) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd 電子制御装置
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6115465B2 (ja) * 2013-12-26 2017-04-19 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
CN108028238B (zh) * 2015-10-05 2021-03-02 三菱电机株式会社 电子控制装置

Also Published As

Publication number Publication date
US20190023308A1 (en) 2019-01-24
WO2017119263A1 (ja) 2017-07-13
JP2017123439A (ja) 2017-07-13
CN108476601A (zh) 2018-08-31
CN108476601B (zh) 2020-04-07
US11084521B2 (en) 2021-08-10

Similar Documents

Publication Publication Date Title
JP6278695B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP5408502B2 (ja) 電子制御ユニット
JP6555134B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6115465B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP2015126097A (ja) 電子制御装置、および、これを用いた電動パワーステアリング装置
JP6780792B2 (ja) 回路構成体及び電気接続箱
JP6468036B2 (ja) 電子制御装置
JP2017123440A5 (enExample)
CN108476601B (zh) 电子控制单元及使用该电子控制单元的电动助力转向装置
JP6520325B2 (ja) 電子制御装置
JP2008130684A (ja) 電子回路装置
JP6131879B2 (ja) 電子制御ユニット、および、これを用いた電動パワーステアリング装置。
JP2017123439A5 (enExample)
KR20180060572A (ko) 방열 구조를 갖는 소자 패키지 및 그 제조방법
WO2020080248A1 (ja) 回路構造体及び電気接続箱
JP2009012631A (ja) 電動パワーステアリング装置
JP6737221B2 (ja) 電動パワーステアリング制御装置および電子ユニット。
US20210358852A1 (en) Circuit substrate
CN102420199B (zh) 半导体模块
JP2019216160A (ja) 電子制御装置
JP2004228159A (ja) Ｐｗｍモジュール
JP2005057034A (ja) 電子部品装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180308

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180308

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180925

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181008

R151 Written notification of patent or utility model registration

Ref document number: 6424839

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250