WO2017119263A1 - 電子制御ユニット、および、これを用いた電動パワーステアリング装置 - Google Patents

電子制御ユニット、および、これを用いた電動パワーステアリング装置 Download PDF

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Publication number
WO2017119263A1
WO2017119263A1 PCT/JP2016/087497 JP2016087497W WO2017119263A1 WO 2017119263 A1 WO2017119263 A1 WO 2017119263A1 JP 2016087497 W JP2016087497 W JP 2016087497W WO 2017119263 A1 WO2017119263 A1 WO 2017119263A1
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WO
WIPO (PCT)
Prior art keywords
heat
component
control unit
substrate
electronic control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/087497
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English (en)
French (fr)
Japanese (ja)
Inventor
剛 田島
内田　貴之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
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Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to US16/067,972 priority Critical patent/US11084521B2/en
Priority to CN201680077889.0A priority patent/CN108476601B/zh
Publication of WO2017119263A1 publication Critical patent/WO2017119263A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0457—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by control features of the drive means as such
    • B62D5/046—Controlling the motor
    • B62D5/0463—Controlling the motor calculating assisting torque from the motor based on driver input
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Definitions

  • the present disclosure relates to an electronic control unit and an electric power steering apparatus using the electronic control unit.
  • Patent Document 1 describes an electronic control unit in which a heat generating component and a heat conducting component are provided on one surface of a substrate, and a radiator is provided on one surface side of the substrate.
  • the heat conducting component is provided in the vicinity of the inner side of the outer edge of the radiator. Further, the distance between the heat conducting component and the radiator is smaller than the distance between the heat generating component and the radiator. For this reason, when the radiator and the substrate come close to each other due to vibration or external force, the radiator may come into contact with the heat conducting component. Therefore, there is a possibility that the heat conducting component is displaced with respect to the substrate or dropped from the substrate. Thereby, there exists a possibility that the effect which thermally radiates the heat from a heat-emitting component may fall.
  • the heat conducting part is formed of an electric conductor and is electrically connected to a heat generating part or the like, there is a possibility that the heat sink and the heat conducting part may be short-circuited when the heat sink contacts the heat conducting part. is there.
  • An object of the present disclosure is to provide an electronic control unit capable of effectively dissipating heat from a heat generating component, and an electric power steering device using the same, in which the position of the heat conducting component relative to the heat generating component is stable. .
  • the electronic control unit is an electronic control unit that controls an object to be controlled, and includes a substrate, a heat generating component, a heat conducting component, a control unit, and a radiator.
  • the heat generating component is provided on one side of the board and generates heat during operation.
  • the heat conductive component is formed of a material having a thermal conductivity of a predetermined value or more, and is provided on one surface side of the substrate so that at least a part thereof is located within a predetermined distance from the heat generating component. Therefore, the heat of the heat generating component is conducted to the heat conducting component. Thereby, it can suppress that the temperature of a heat-emitting component rises excessively.
  • the control unit is provided on the substrate and can control the control target by controlling the operation of the heat generating component.
  • the heat radiator is provided on one surface side of the substrate and can dissipate heat from the heat generating component and the heat conducting component. Therefore, it can suppress more effectively that the temperature of a heat-emitting component rises excessively.
  • the distance between the heat generating component and the radiator is set to be equal to or less than the distance between the heat conducting component and the radiator. For this reason, even if the radiator and the substrate come close to each other due to vibration or external force, for example, the heat-generating component and the radiator are brought into contact with each other, thereby suppressing a large force from acting on the heat-conducting component from the radiator. can do. Thereby, it can suppress that a heat conductive component displaces with respect to a board
  • the distance between the heat generating component and the heat radiating member is set to be smaller than the distance between the heat conducting component and the heat radiating member, the position of the heat conductive component with respect to the heat generating component becomes more stable, and the above effect can be further enhanced.
  • the heat conducting part is formed of an electric conductor and is electrically connected to a heat generating part or the like
  • the heat sink contacts the heat conducting part, and the heat sink and the heat conducting part are short-circuited. Can be prevented.
  • the electronic control unit is used in, for example, an electric power steering device.
  • the electronic control unit controls a device that outputs assist torque for assisting steering by the driver as a control target.
  • FIG. 3 is a sectional view taken along line III-III in FIG. 2. Schematic which shows the state which applied the electronic control unit by 1st Embodiment of this indication to the electric power steering device. The figure which shows the electrical constitution of the electronic control unit by 1st Embodiment of this indication. The schematic diagram which shows the heat-emitting component vicinity of the electronic control unit by 2nd Embodiment of this indication.
  • FIGS. An electronic control unit according to a first embodiment of the present disclosure is shown in FIGS.
  • the electronic control unit 1 is used in an electric power steering apparatus 100 for a vehicle, and generates an assist torque that assists steering by a driver based on a steering torque signal, a vehicle speed signal, and the like.
  • the motor 101 is driven and controlled.
  • the electronic control unit 1 includes a substrate 10, a semiconductor module 20 as a heat generating component, a printed wiring 30 as a wiring, a heat conducting component 40, a capacitor 51 as an electronic component, relays 55 and 56, a coil 57, a control unit 60, a heat radiator.
  • a heat sink 70 As a heat sink 70, a heat conducting member 75, a connector 80, and the like.
  • the substrate 10 is, for example, a printed wiring board such as FR-4 made of glass fiber and epoxy resin.
  • the substrate 10 is formed in a substantially rectangular shape.
  • the semiconductor module 20 is a semiconductor component including a semiconductor element such as a MOS-FET or an IGBT. As shown in FIGS. 1 to 3, the semiconductor module 20 is formed, for example, in a rectangular plate shape, and is mounted on one surface 11 side of the substrate 10 so that the surface direction is parallel to the surface of the substrate 10. . In the present embodiment, four (21 to 24) semiconductor modules 20 are provided.
  • the semiconductor module 20 includes a switching element 201, a sealing body 202, and terminals 203, 204, and 205.
  • the switching element 201 is a semiconductor element such as a MOS-FET or IGBT.
  • the switching element 201 generates heat during switching operation.
  • the switching element 201 corresponds to a heating element.
  • the sealing body 202 is formed of an insulator such as a resin and covers the switching element 201.
  • the sealing body 202 is formed in, for example, a rectangular plate shape.
  • the terminal 203 is formed in a rectangular plate shape by an electric conductor such as copper.
  • the terminal 203 is electrically connected to the drain of the switching element 201.
  • the terminal 203 is provided on the sealing body 202 such that the surface opposite to the switching element 201 is exposed from the sealing body 202.
  • the terminal 204 is formed of an electric conductor such as copper.
  • the terminal 204 is electrically connected to the source of the switching element 201.
  • the terminal 204 is provided on the sealing body 202 so that the end on the opposite side to the switching element 201 is exposed from the sealing body 202.
  • the terminal 205 is made of an electric conductor such as copper.
  • the terminal 205 is electrically connected to the gate of the switching element 201.
  • the terminal 205 is provided on the sealing body 202 such that the end opposite to the switching element 201 is exposed from the sealing body 202.
  • the printed wiring 30 is provided on one surface 11 of the substrate 10.
  • the printed wiring 30 is formed by printing a pattern made of an electric conductor such as copper on the surface of the substrate 10.
  • the printed wiring 30 has a thermal conductivity equal to or higher than a predetermined value, for example, about (300K) 401 W / (m ⁇ K).
  • a predetermined value for example, about (300K) 401 W / (m ⁇ K).
  • four (31 to 34) printed wirings 30 are provided.
  • the printed wirings 31, 32, 33, and 34 are each formed in a substantially rectangular thin film shape and are arranged adjacent to each other (see FIG. 2).
  • the printed wiring 31 and the printed wiring 32 are integrally formed.
  • the semiconductor modules 21, 22, 23, and 24 are provided so as to correspond to the printed wirings 31, 32, 33, and 34, respectively.
  • the semiconductor module 21 is provided such that the surface of the terminal 203 opposite to the switching element 201 faces or contacts the printed wiring 31.
  • the terminal 203 of the semiconductor module 21 is soldered to the printed wiring 31.
  • the terminal 204 of the semiconductor module 21 is soldered to the printed wiring 33.
  • the semiconductor module 22 is provided such that the surface of the terminal 203 opposite to the switching element 201 faces or contacts the printed wiring 32.
  • the terminal 203 of the semiconductor module 22 is soldered to the printed wiring 32.
  • the terminal 204 of the semiconductor module 22 is soldered to the printed wiring 34.
  • the semiconductor module 23 is provided such that the surface of the terminal 203 opposite to the switching element 201 faces or contacts the printed wiring 33.
  • the terminal 203 of the semiconductor module 23 is soldered to the printed wiring 33.
  • the semiconductor module 24 is provided such that the surface of the terminal 203 opposite to the switching element 201 faces or contacts the printed wiring 34.
  • the terminal 203 of the semiconductor module 24 is soldered to the printed wiring 34.
  • the heat conducting component 40 is provided on the one surface 11 side of the substrate 10.
  • the heat conductive component 40 is formed in a rectangular plate shape by an electric conductor such as copper.
  • the thermal conductivity component 40 has a thermal conductivity equal to or higher than a predetermined value, for example, about (300K) 401 W / (m ⁇ K).
  • the heat conduction component 40 has a specific heat capacity of, for example, about 385 ⁇ 10 2 J / (kg ⁇ K).
  • the heat conductive component 40 is subjected to tin nickel plating. Thereby, the heat-conductive component 40 improves corrosion resistance and solderability.
  • seven (41 to 47) heat conducting components 40 are provided.
  • the heat conducting component 41 is provided between the semiconductor module 21 and the semiconductor module 22.
  • the heat conducting component 41 is provided so that one surface thereof faces or is in contact with the printed wiring 31 and the printed wiring 32.
  • the heat conductive component 41 is soldered between the printed wiring 31 and the printed wiring 32.
  • the heat conducting component 41 is provided such that its longitudinal direction is substantially parallel to the side of the sealing body 202 of the semiconductor modules 21 and 22.
  • the heat conducting component 42 is provided between the semiconductor module 21 and the semiconductor module 23.
  • the heat conducting component 42 is provided so that one surface thereof faces or contacts the printed wiring 33.
  • the heat conductive component 42 is soldered to the printed wiring 33.
  • the heat conducting component 42 is provided such that the longitudinal direction thereof is substantially parallel to the side of the sealing body 202 of the semiconductor modules 21 and 23.
  • the heat conducting component 43 is provided between the semiconductor module 22 and the semiconductor module 24.
  • the heat conducting component 43 is provided so that one surface thereof faces or contacts the printed wiring 34.
  • the heat conductive component 43 is soldered to the printed wiring 34.
  • the heat conducting component 43 is provided so that the longitudinal direction is substantially parallel to the side of the sealing body 202 of the semiconductor modules 22 and 24.
  • the heat conducting component 44 is provided on the opposite side of the semiconductor module 21 from the heat conducting component 41.
  • the heat conducting component 44 is provided so that one surface thereof faces or contacts the printed wiring 31.
  • the heat conductive component 44 is soldered to the printed wiring 31.
  • the heat conducting component 44 is provided such that its longitudinal direction is substantially parallel to the side of the semiconductor module 21.
  • the heat conducting component 45 is provided on the opposite side of the semiconductor module 21 from the heat conducting component 42.
  • the heat conducting component 45 is provided so that one surface thereof faces or contacts the printed wiring 31.
  • the heat conductive component 45 is soldered to the printed wiring 31.
  • the heat conducting component 45 is provided such that the longitudinal direction is substantially parallel to the side of the semiconductor module 21.
  • the heat conducting component 46 is provided on the opposite side of the semiconductor module 22 from the heat conducting component 41.
  • the heat conductive component 46 is provided so that one surface thereof faces or contacts the printed wiring 32.
  • the heat conductive component 46 is soldered to the printed wiring 32.
  • the heat conducting component 46 is provided such that the longitudinal direction is substantially parallel to the side of the semiconductor module 22.
  • the heat conducting component 47 is provided on the opposite side of the semiconductor module 22 from the heat conducting component 43.
  • the heat conductive component 47 is provided so that one surface thereof faces or contacts the printed wiring 32.
  • the heat conductive component 47 is soldered to the printed wiring 32.
  • the heat conducting component 47 is provided so that the longitudinal direction is substantially parallel to the side of the semiconductor module 22.
  • the heat conducting components 41, 42, and 43 are provided between the semiconductor module 21 and the semiconductor module 22, between the semiconductor module 21 and the semiconductor module 23, and between the semiconductor module 22 and the semiconductor module 24, respectively. It has been. That is, the heat conducting component 40 is provided so that at least a part thereof is positioned between the plurality of semiconductor modules 20.
  • the heat conducting parts 41, 44 and 45 are provided so as to surround the semiconductor module 21. Further, the heat conducting components 41, 46, and 47 are provided so as to surround the semiconductor module 22. That is, the heat conducting component 40 is provided so that at least a part thereof surrounds the semiconductor module 20.
  • the heat conducting components 41, 44, 45 are predetermined from the outer edge of the sealing body 202 of the semiconductor module 21. It is provided so as to be located within the range R1 of the distance L. Similarly, the heat conducting components 41, 46, and 47 are provided so as to be located within a range R ⁇ b> 1 that is a predetermined distance L from the outer edge of the sealing body 202 of the semiconductor module 22. Similarly, the heat conducting component 42 is provided so as to be located within a range R1 of a predetermined distance L from the outer edge of the sealing body 202 of the semiconductor module 23. Similarly, the heat conducting component 43 is provided so as to be located within a range R1 of a predetermined distance L from the outer edge of the sealing body 202 of the semiconductor module 24.
  • the heat conducting components 41 to 47 are all formed such that the length in the longitudinal direction is longer than the length L of the side in the longitudinal direction of the sealing body 202 of the semiconductor module 20.
  • the heat conducting component 40 is provided between the semiconductor modules 20 or in the vicinity of the semiconductor module 20 such as around the semiconductor module 20. Therefore, the heat of the semiconductor module 20 is conducted to the heat conducting component 40.
  • the capacitor 51 is, for example, an aluminum electrolytic capacitor.
  • the capacitor 51 is formed, for example, in a substantially cylindrical shape, and is mounted on one surface 11 side of the substrate 10 so that the axial direction is perpendicular to the surface of the substrate 10 (see FIG. 1). In this embodiment, three capacitors 51 are provided.
  • the relays 55 and 56 are mechanical relays configured mechanically, for example.
  • the relays 55 and 56 are mounted on the other surface 12 side of the substrate 10, for example.
  • the coil 57 is, for example, a choke coil in the present embodiment.
  • the coil 57 is formed to have a rectangular column shape, for example, and is mounted on one surface 11 side of the substrate 10 so that the height direction is perpendicular to the surface of the substrate 10 (see FIG. 1).
  • the control unit 60 includes, for example, a microcomputer 61 (MC in FIG. 5) and a custom IC 62 (IC in FIG. 5).
  • the microcomputer 61 and the custom IC 62 are semiconductor packages having, for example, a CPU, ROM, RAM, and I / O.
  • the control unit 60 controls the operation of the relays 55 and 56 and the semiconductor module 20 (21 to 24).
  • the control unit 60 controls the rotation drive of the motor 101 (M in FIG. 5) by controlling the operation of the semiconductor module 20 based on signals from sensors provided in each part of the vehicle.
  • the microcomputer 61 and the custom IC 62 are mounted on the other surface 12 side of the substrate 10 as shown in FIG.
  • the positive side of the battery 102 that is the power source of the vehicle is connected to the relay 55.
  • the relay 55 is controlled by the control unit 60, and is allowed to turn on or off to allow or interrupt the supply of power from the battery 102 to the electronic control unit 1. That is, the relay 55 is a power supply relay in this embodiment.
  • the electric power from the battery 102 is supplied to the semiconductor module 20 (21 to 24) via the coil 57.
  • the coil 57 removes noise of power supplied from the battery 102 to the motor 101 via the electronic control unit 1.
  • the ignition power source 106 of the vehicle is connected between the relay 55 and the coil 57 and to the control unit 60.
  • the control unit 60 (the microcomputer 61 and the custom IC 62) is operated by electric power from the ignition power source 106.
  • the semiconductor module 21 and the semiconductor module 23 are connected in series, and the semiconductor module 22 and the semiconductor module 24 are connected in series. Then, the two semiconductor modules 21 and 23 and the two semiconductor modules 22 and 24 are connected in parallel.
  • the relay 56 and the motor 101 are arranged between the connection point of the two semiconductor modules 21 and 23 and the connection point of the two semiconductor modules 22 and 24.
  • the capacitor 51 is connected in parallel between the power supply line and the ground. The capacitor 51 suppresses a surge voltage generated by the on / off operation (switching operation) of the semiconductor module 20 (21 to 24).
  • the semiconductor modules 21 and 24 when the semiconductor modules 21 and 24 are turned on and the semiconductor modules 22 and 23 are turned off, current flows in the order of the semiconductor module 21, the relay 56, the motor 101, and the semiconductor module 24.
  • the semiconductor modules 22 and 23 are turned on and the semiconductor modules 21 and 24 are turned off, current flows in the order of the semiconductor module 22, the motor 101, the relay 56, and the semiconductor module 23.
  • the motor 101 is a direct current motor, the motor 101 is rotationally driven by controlling the semiconductor modules 20 (21 to 24) on / off in this manner.
  • a signal line from the control unit 60 custom IC 62
  • the control unit 60 controls the rotation operation of the motor 101 by controlling the switching operation of the semiconductor module 20.
  • the relay 56 is controlled by the control unit 60, and is allowed to turn on or off to allow or interrupt the supply of power from the battery 102 to the motor 101. That is, the relay 56 is a motor relay in this embodiment.
  • the semiconductor module 20 is a component having a calorific value during operation of a predetermined value or more, and corresponds to a heat generating component.
  • the heat sink 70 is formed of a metal such as aluminum.
  • the heat sink 70 includes a main body 71, a columnar portion 72, a screw 73, and the like.
  • the main body 71 is formed in a rectangular plate shape, for example.
  • the heat sink 70 is provided so that one surface 701 of the main body 71 faces one surface 11 of the substrate 10 (see FIG. 3).
  • the heat sink 70 has a specific heat capacity of, for example, about 900 ⁇ 10 2 J / (kg ⁇ K).
  • the heat sink 70 has a thermal conductivity of, for example, about (300K) 237 W / (m ⁇ K).
  • a predetermined gap is formed between one surface 701 of the main body 71 of the heat sink 70 and one surface 11 of the substrate 10.
  • a specific recess (first recess) 711 that is a recess recessed toward the other surface 702, that is, the side opposite to the substrate 10, is formed.
  • the specific recess 711 is formed at a position corresponding to the semiconductor module 20.
  • the specific recess 711 is formed in a rectangular shape so as to correspond to the shape of the sealing body 202 of the semiconductor module 20.
  • the specific recess 711 is formed larger than the sealing body 202.
  • Four specific recesses 711 are formed so as to correspond to the semiconductor modules 21 to 24, respectively.
  • the distance d1 between the sealing body 202 of the semiconductor module 20 and the specific recess 711 of the heat sink 70 is equal to or less than the distance d2 between the heat conducting component 40 and one surface 701 of the heat sink 70.
  • d1 is set smaller than d2. Therefore, even if the heat sink 70 and the substrate 10 approach each other due to vibration or external force, for example, the sealing body 202 of the semiconductor module 20 and the heat sink 70 come into contact with each other, so Contact can be reliably suppressed. As a result, it is possible to reliably prevent the heat conducting component 40 from being displaced from the substrate 10 or falling off the substrate 10.
  • the heat conducting component 40 is formed of an electric conductor and is electrically connected to the semiconductor module 20 by the printed wiring 30 as in the present embodiment
  • the heat sink 70 contacts the heat conducting component 40
  • the heat sink There is a risk of short circuit between 70 and the heat conducting component 40.
  • the contact between the heat sink 70 and the heat conductive component 40 can be suppressed by the above setting, a short circuit between the heat sink 70 and the heat conductive component 40 can also be suppressed.
  • the columnar portion 72 is formed to extend in a substantially cylindrical shape from the main body 71 toward the substrate 10.
  • the columnar portion 72 is formed so as to correspond to a predetermined portion including the four corner portions of the substrate 10 (see FIG. 1).
  • the substrate 10 has screw holes 13 at predetermined locations including four corners.
  • the screw 73 is passed through the screw hole 13 and screwed into the columnar portion 72 of the heat sink 70. Thereby, the position of the substrate 10 with respect to the heat sink 70 is stabilized.
  • the heat conducting components 46 and 47 are provided so that a part thereof is located within a range R2 of a predetermined distance M from the outer wall of the columnar portion 72. .
  • the heat conducting member 75 is, for example, heat radiation grease.
  • the heat dissipating grease is a gel-like member having a small thermal resistance, for example, based on silicon.
  • the heat conduction member 75 is provided between the one surface 11 of the substrate 10 and the one surface 701 of the heat sink 70 so as to contact the substrate 10, the semiconductor module 20, the printed wiring 30, the heat conduction component 40, and the heat sink 70. Yes. Thereby, the heat conducting member 75 can conduct the heat from the semiconductor module 20 and the heat conducting component 40 to the heat sink 70. Therefore, the heat from the semiconductor module 20 and the heat conducting component 40 can be radiated via the heat conducting member 75 and the heat sink 70.
  • the terminals 203 and 204 of the semiconductor module 20 and the heat conducting component 40 are connected by the printed wiring 30, heat from the switching element 201 of the semiconductor module 20 is transferred to the terminals 203 and 204 and The heat conduction component 40 is quickly conducted through the printed wiring 30. Therefore, the heat from the semiconductor module 20 can be quickly dissipated through the printed wiring 30, the heat conducting component 40, the heat conducting member 75, and the heat sink 70.
  • the connector 80 has a connector body 800, power supply terminals 81 to 84, and a signal terminal 85.
  • the connector main body 800 is formed in a rectangular cylindrical shape with resin, for example.
  • the connector main body 800 is provided on the outer edge portion of the substrate 10.
  • the power supply terminals 81 to 84 and the signal terminal 85 are formed of an electric conductor such as copper, for example.
  • the power supply terminals 81 to 84 and the signal terminal 85 are insert-molded in the connector main body 800.
  • the power supply terminal 81 is soldered to a printed wiring (not shown) on the substrate 10 and is electrically connected to the terminals 203 of the semiconductor modules 21 and 22, that is, the printed wirings 31 and 32 via the relay 55 and the coil 57. Connected.
  • the power supply terminal 82 is soldered to the printed wiring on the substrate 10 and is electrically connected to the terminals 204 of the semiconductor modules 23 and 24.
  • the power supply terminal 83 is soldered to the printed wiring on the substrate 10 and is electrically connected to the terminal 204 of the semiconductor module 21 and the terminal 203 of the semiconductor module 23, that is, the printed wiring 33.
  • the power supply terminal 84 is soldered to the printed wiring on the substrate 10 and is electrically connected to the terminal 204 of the semiconductor module 22 and the terminal 203 of the semiconductor module 24, that is, the printed wiring 34.
  • the signal terminal 85 is soldered to the printed wiring on the substrate 10 and is electrically connected to the control unit 60 (the microcomputer 61 and the custom IC 62).
  • the heat conducting component 44 is provided between the semiconductor module 21 and the power supply terminals 81 and 82 of the connector 80.
  • the semiconductor module 20 and the power supply terminals 81 to 84 are provided on one region T1 side.
  • the control unit 60 the microcomputer 61, the custom IC 62
  • the signal terminal 85 are provided on the other region T2 side.
  • the harness 103 is connected to the connector 80 (see FIG. 4).
  • the conductive wire 104 of the harness 103 electrically connects the positive side of the battery 102 and the power supply terminal 81 of the connector 80.
  • the conductive wire 105 of the harness 103 electrically connects the winding terminal of the motor 101 and the power supply terminals 83 and 84 of the connector 80. That is, the power supply terminals 83 and 84 are motor terminals.
  • the control unit 60 controls the rotational drive of the motor 101 by controlling the switching operation of the semiconductor module 20 (21 to 24) based on the steering torque signal, the vehicle speed signal, and the like while the ignition switch is on. As a result, assist torque is output from the motor 101, and steering by the driver is assisted.
  • the controller 60 controls the rotation of the motor 101 by controlling the switching operation of the semiconductor module 20 (21 to 24), the semiconductor module 20, the capacitor 51, the relays 55 and 56, and the coil 57 are controlled. Since a relatively large current flows, the semiconductor module 20, the capacitor 51, the relays 55 and 56, and the coil 57 generate heat and reach a relatively high temperature. A part of the heat of the semiconductor module 20 is guided to the heat conducting component 40 via the printed wiring 30 or the heat conducting member 75.
  • the heat of the semiconductor module 20 (21 to 24) and the heat conducting component 40 is guided to the heat sink 70 via the heat conducting member 75.
  • the heat of the semiconductor module 20 (21 to 24) and the heat conducting component 40 can be effectively guided to the heat sink 70. Therefore, it is possible to effectively dissipate heat from the semiconductor module 20 (21 to 24), which are heat generating components, and the heat conducting component 40.
  • the electronic control unit 1 is an electronic control unit that controls the motor 101, and includes the substrate 10, the semiconductor module 20, the heat conduction component 40, the control unit 60, and the heat sink 70. ing.
  • the semiconductor module 20 is provided on one surface 11 side of the substrate 10 and generates heat during operation.
  • the heat conduction component 40 is formed of a material having a heat conductivity of a predetermined value or more, and is provided on the one surface 11 side of the substrate 10 so that at least a part thereof is located within the range R1 of the predetermined distance L from the semiconductor module 20. Yes.
  • the predetermined distance L is the same as the length of the side in the longitudinal direction of the sealing body 202 of the semiconductor module 20. Therefore, the heat of the semiconductor module 20 is conducted to the heat conducting component 40. Thereby, it can suppress that the temperature of the semiconductor module 20 rises excessively.
  • the control unit 60 is provided on the substrate 10 and can control the motor 101 by controlling the operation of the semiconductor module 20.
  • the heat sink 70 is provided on the one surface 11 side of the substrate 10 and can dissipate heat from the semiconductor module 20 and the heat conducting component 40. Therefore, it is possible to more effectively suppress the temperature of the semiconductor module 20 from rising excessively.
  • the distance d1 between the semiconductor module 20 and the heat sink 70 is set to be equal to or less than the distance d2 between the heat conducting component 40 and the heat sink 70. Therefore, even if the heat sink 70 and the substrate 10 come close to each other due to vibration or external force, for example, the semiconductor module 20 and the heat sink 70 come into contact with each other, so that a large force acts on the heat conducting component 40 from the heat sink 70. Can be suppressed. Thereby, it can suppress that the heat conductive component 40 shifts
  • the distance d1 between the semiconductor module 20 and the heat sink 70 is set to be smaller than the distance d2 between the heat conducting component 40 and the heat sink 70.
  • the heat sink 70 and the heat conducting component 40 are brought into contact with each other by the sealing body 202 of the semiconductor module 20 and the heat sink 70 coming into contact with each other. Can be reliably suppressed. As a result, it is possible to reliably prevent the heat conducting component 40 from being displaced from the substrate 10 or falling off the substrate 10.
  • a heat conducting member 75 provided between the one surface 11 of the substrate 10 and the heat sink 70 and capable of conducting heat from the semiconductor module 20 and the heat conducting component 40 to the heat sink 70 is further provided.
  • the heat of the semiconductor module 20 and the heat conductive component 40 can be effectively radiated, and the temperature rise of the semiconductor module 20 and the heat conductive component 40 can be further effectively suppressed.
  • the heat sink 70 has a specific recess 711 that is a recess recessed toward the opposite side of the substrate 10 at a position corresponding to the semiconductor module 20. In this case, the distance between the outer edge of the semiconductor module 20 and the heat sink 70 can be reduced. Thereby, the heat from the semiconductor module 20 can be more effectively conducted to the heat sink 70.
  • the semiconductor module 20 has a switching element 201 that generates heat during operation, and a sealing body 202 that covers at least a part of the switching element 201.
  • the printed wiring 30 is provided on one surface 11 of the substrate 10 and is electrically connected to the switching element 201.
  • the heat conductive component 40 is formed of an electric conductor and is in contact with the printed wiring 30.
  • the heat conducting part 40 When the heat conducting part 40 is formed of an electric conductor and is electrically connected to the semiconductor module 20 by the printed wiring 30, when the heat sink 70 contacts the heat conducting part 40, the heat conducting part 40 is interposed between the heat sink 70 and the heat conducting part 40. May short circuit. As described above, when the distance d1 between the semiconductor module 20 and the heat sink 70 is set smaller than the distance d2 between the heat conductive component 40 and the heat sink 70, the contact between the heat sink 70 and the heat conductive component 40 can be suppressed. Further, a short circuit between the heat sink 70 and the heat conducting component 40 can be suppressed.
  • the sealing body 202 is formed of an insulator. In this case, even if the sealing body 202 and the heat sink 70 come into contact with each other, a short circuit between the switching element 201 and the heat sink 70 is not caused.
  • a plurality (21 to 24) of semiconductor modules 20 are provided.
  • the heat conducting component 40 is provided so that at least a part (41, 42, 43) is located between the plurality of semiconductor modules 20. Therefore, the heat of the semiconductor module 20 is conducted to the heat conducting component 40. Thereby, it can suppress that the temperature of the semiconductor module 20 rises excessively. Further, since at least a part of the heat conducting component 40 is located between the plurality of semiconductor modules 20, it is possible to suppress thermal interference between the semiconductor modules 20.
  • the heat conduction component 40 is provided so that at least a part (41 to 47) surrounds the semiconductor module 20. In this case, the heat of the semiconductor module 20 can be effectively conducted by the heat conducting component 40.
  • the heat sink 70 has a columnar portion 72 formed to extend toward the substrate 10.
  • the heat conductive component 40 is provided so that at least a part (a part of 46 and 47) is located within a range R2 of a predetermined distance M from the columnar part 72.
  • the predetermined distance M is the same as the diameter of the columnar portion 72.
  • the electric power steering apparatus 100 includes the electronic control unit 1 and a motor 101 controlled by the electronic control unit 1 and capable of outputting an assist torque that assists steering by the driver.
  • the electronic control unit 1 of the present embodiment even if the heat sink 70 and the substrate 10 approach each other due to, for example, vibration or external force, the heat conduction component 40 is displaced from the substrate 10 or dropped from the substrate 10. The heat from the semiconductor module 20 can be effectively dissipated. Therefore, the electronic control unit 1 of the present embodiment is suitable for use as an electronic control unit of an electric power steering apparatus that is mounted on a vehicle that generates vibrations and generates a large amount of heat when a large current flows.
  • FIG. 1 A part of the electronic control unit according to the second embodiment of the present disclosure is shown in FIG.
  • the second embodiment is different from the first embodiment in the shapes of the heat conducting component 40 and the heat sink 70.
  • the heat conductive component 40 is formed such that the length (height) of the substrate 10 in the plate thickness direction is larger than the plate thickness of the sealing body 202 of the semiconductor module 20. Further, the end surface of the heat conducting component 40 on the heat sink 70 side is located on the other surface 702 side of the one surface 701 of the heat sink 70.
  • a special recess (second recess) 712 that is a recess recessed toward the other surface 702, that is, the side opposite to the substrate 10, is formed.
  • the special recess 712 is formed at a position corresponding to the heat conducting component 40.
  • the special recess 712 is formed in a rectangular shape so as to correspond to the shape of the end surface of the heat conducting component 40 on the heat sink 70 side.
  • the special recess 712 is formed larger than the end surface of the heat conducting component 40 on the heat sink 70 side.
  • Seven special recesses 712 are formed so as to correspond to the respective heat conducting components 41 to 47.
  • the distance d3 between the sealing body 202 of the semiconductor module 20 and the special recess 712 of the heat sink 70 is equal to or less than the distance d4 between the heat conducting component 40 and one surface 701 of the heat sink 70.
  • d3 is set smaller than d4. Therefore, even if the heat sink 70 and the substrate 10 approach each other due to vibration or external force, for example, the sealing body 202 of the semiconductor module 20 and the heat sink 70 come into contact with each other, so Contact can be reliably suppressed. As a result, it is possible to reliably prevent the heat conducting component 40 from being displaced from the substrate 10 or falling off the substrate 10.
  • the heat sink 70 has the special recessed portion 712 that is a recessed portion that is recessed toward the opposite side of the substrate 10 at a position corresponding to the heat conducting component 40. Therefore, the distance between the outer edge portion of the heat conducting component 40 and the heat sink 70 can be reduced. Thereby, the heat from the heat conducting component 40 and the semiconductor module 20 can be more effectively conducted to the heat sink 70.
  • the distance between the heat generating component and the radiator is set smaller than the distance between the heat conducting component and the radiator is shown.
  • the distance between the heat generating component and the heat radiating body may be set to be equal to or less than the distance between the heat conducting component and the heat radiating body.
  • the distance between the heat generating component and the heat radiating body is preferably set smaller than the distance between the heat conducting component and the heat radiating body.
  • the heat conducting component (41, 44, 45) is predetermined from the outer edge of the sealing body of the heat generating component (21).
  • the example provided so that it may be located in the range R1 of the distance L was shown.
  • the heat conducting component (41, 44, 45) may be provided so that a part thereof is located outside the range R1. Further, the heat conducting components (41, 44, 45) may not be provided within the range R1.
  • the sealing body of the heat generating component is not limited to a rectangular shape, and may be formed in any shape such as a polygonal shape or a circular shape.
  • the heat conductive member may be a sheet-like heat dissipation sheet having, for example, silicon as a base material and low thermal resistance. In another embodiment of the present disclosure, the heat conducting member may not be provided.
  • the heat radiator may be configured not to include any specific recess or special recess.
  • the heat dissipating body may have a flat surface facing the heat generating component and the heat conducting component.
  • the four heat generating components may be arranged on the substrate so as to be positioned on the vertex of a virtual square, a parallelogram, a rhombus, a trapezoid, or other squares, for example. Good.
  • the number of heat generating components is not limited to four, and may be one, two, three, or five or more.
  • the heat generating component may be arranged in any manner on the substrate.
  • the heat conducting component may be formed of any material such as carbon as long as the heat conductivity is equal to or higher than a predetermined value.
  • the heat conducting component is not limited to an electric conductor, and may be formed of an insulator such as aluminum nitride or silicon nitride. Further, the heat conducting component may not be in contact with the wiring on the substrate. Further, the heat conducting component may be in contact with the heat generating component.
  • the heat conducting component is not limited to a rectangular shape, and may be formed in any shape such as a polygonal shape or a circular shape. Further, the heat conductive component may not be plated.
  • the sealing body of the heat generating component is not limited to resin, and may be formed of an insulator such as aluminum nitride or silicon nitride. Further, the heating element may be partially exposed from the sealing body.
  • the heat radiator is not limited to aluminum, and may be formed of a material having a thermal conductivity of a predetermined value or more, such as iron, copper, aluminum nitride, or silicon nitride.
  • the electronic control unit according to the present disclosure is not limited to the electric power steering apparatus, and may be used to control driving of an electric device such as a motor of another apparatus.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Steering Mechanism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/JP2016/087497 2016-01-08 2016-12-16 電子制御ユニット、および、これを用いた電動パワーステアリング装置 Ceased WO2017119263A1 (ja)

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US16/067,972 US11084521B2 (en) 2016-01-08 2016-12-16 Electronic control unit and electric power steering device using the same
CN201680077889.0A CN108476601B (zh) 2016-01-08 2016-12-16 电子控制单元及使用该电子控制单元的电动助力转向装置

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JP6683020B2 (ja) * 2016-06-01 2020-04-15 株式会社デンソー 電力変換装置、及び、これを用いた電動パワーステアリング装置
JP6737221B2 (ja) * 2017-04-11 2020-08-05 株式会社デンソー 電動パワーステアリング制御装置および電子ユニット。
JP6838501B2 (ja) * 2017-06-14 2021-03-03 株式会社デンソー 電子制御装置、および、これを用いた電動パワーステアリング装置

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JP6115465B2 (ja) * 2013-12-26 2017-04-19 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
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US11084521B2 (en) 2021-08-10
US20190023308A1 (en) 2019-01-24
CN108476601B (zh) 2020-04-07
CN108476601A (zh) 2018-08-31
JP2017123439A (ja) 2017-07-13

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