JP6419089B2 - 容量性駆動に適したシンプルなｌｅｄパッケージ - Google Patents

容量性駆動に適したシンプルなｌｅｄパッケージ Download PDF

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Publication number
JP6419089B2
JP6419089B2 JP2015559577A JP2015559577A JP6419089B2 JP 6419089 B2 JP6419089 B2 JP 6419089B2 JP 2015559577 A JP2015559577 A JP 2015559577A JP 2015559577 A JP2015559577 A JP 2015559577A JP 6419089 B2 JP6419089 B2 JP 6419089B2
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Prior art keywords
led
led assembly
assembly according
leds
package
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Japanese (ja)
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JP2016510170A5 (enExample
JP2016510170A (ja
Inventor
ヨハネス ウィルヘルムス ウィーカンプ
ヨハネス ウィルヘルムス ウィーカンプ
サンベル マルク アンドレ デ
サンベル マルク アンドレ デ
エグベルトゥス レイニエル ヤコブス
エグベルトゥス レイニエル ヤコブス
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Signify Holding BV
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Signify Holding BV
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2015559577A 2013-02-28 2014-02-14 容量性駆動に適したシンプルなｌｅｄパッケージ Expired - Fee Related JP6419089B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361770413P 2013-02-28 2013-02-28
US61/770,413 2013-02-28
PCT/IB2014/058986 WO2014132164A2 (en) 2013-02-28 2014-02-14 Simple led package suitable for capacitive driving

Publications (3)

Publication Number Publication Date
JP2016510170A JP2016510170A (ja) 2016-04-04
JP2016510170A5 JP2016510170A5 (enExample) 2017-03-23
JP6419089B2 true JP6419089B2 (ja) 2018-11-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015559577A Expired - Fee Related JP6419089B2 (ja) 2013-02-28 2014-02-14 容量性駆動に適したシンプルなｌｅｄパッケージ

Country Status (6)

Country Link
US (1) US9281299B2 (enExample)
EP (1) EP2962531B1 (enExample)
JP (1) JP6419089B2 (enExample)
CN (1) CN105027674B (enExample)
RU (1) RU2663814C2 (enExample)
WO (1) WO2014132164A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114010A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements
KR102659113B1 (ko) 2015-12-23 2024-04-23 코닌클리케 필립스 엔.브이. 해양 구조체
TR201910536T4 (tr) 2015-12-23 2019-08-21 Koninklijke Philips Nv Bir yüke güç sağlanmasına yönelik yük düzenlemesi ve elektrik gücü düzenlemesi.
AU2016375292B2 (en) 2015-12-23 2021-09-23 Koninklijke Philips N.V. Load arrangement and electrical power arrangement for powering a load
WO2018067678A1 (en) * 2016-10-07 2018-04-12 Grote Industries, Llc Thin film sheet including power lines, lights, and sensors
CN110690328B (zh) * 2019-10-16 2021-05-18 福州大学 一种基于波长下转换的无电学接触μLED发光器件
CN110690329B (zh) * 2019-10-16 2021-06-29 福州大学 一种单端电学接触、单端载流子注入的μLED发光与显示器件及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249582B2 (ja) 1992-07-24 2002-01-21 シャープ株式会社 発光装置
US6630689B2 (en) 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
JP2007502534A (ja) * 2003-08-12 2007-02-08 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 有機ダイオードの交流駆動用回路配置
TWI223460B (en) 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
EP1731003B1 (en) * 2004-02-25 2011-03-30 Michael Miskin Ac light emitting diode and ac led drive methods and apparatus
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
TW200702824A (en) * 2005-06-02 2007-01-16 Koninkl Philips Electronics Nv LED assembly and module
US7498252B2 (en) 2006-09-29 2009-03-03 Intel Corporation Dual layer dielectric stack for microelectronics having thick metal lines
US20090140279A1 (en) 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
EP2292077B1 (en) 2008-06-17 2017-08-09 Philips Lighting Holding B.V. Light emitting device adapted for ac drive
WO2010017655A1 (zh) 2008-08-12 2010-02-18 海立尔股份有限公司 具有埋入式电容的发光二极管座体结构
US20110234114A1 (en) * 2008-12-05 2011-09-29 Lynk Labs, Inc. Ac led lighting element and ac led lighting system methods and apparatus
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
CN102044600A (zh) 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JP5375544B2 (ja) * 2009-11-19 2013-12-25 日亜化学工業株式会社 半導体発光装置及びその製造方法
TWM401207U (en) 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
US8797285B2 (en) 2011-04-18 2014-08-05 Atmel Corporation Panel

Also Published As

Publication number Publication date
US20150380390A1 (en) 2015-12-31
WO2014132164A3 (en) 2014-11-20
RU2663814C2 (ru) 2018-08-10
EP2962531A2 (en) 2016-01-06
WO2014132164A2 (en) 2014-09-04
US9281299B2 (en) 2016-03-08
RU2015140801A (ru) 2017-03-31
CN105027674B (zh) 2017-11-17
JP2016510170A (ja) 2016-04-04
CN105027674A (zh) 2015-11-04
EP2962531B1 (en) 2017-08-30

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