CN105027674B - 适于电容驱动的简单led封装 - Google Patents

适于电容驱动的简单led封装 Download PDF

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Publication number
CN105027674B
CN105027674B CN201480011058.4A CN201480011058A CN105027674B CN 105027674 B CN105027674 B CN 105027674B CN 201480011058 A CN201480011058 A CN 201480011058A CN 105027674 B CN105027674 B CN 105027674B
Authority
CN
China
Prior art keywords
led
component according
led component
leds
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480011058.4A
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English (en)
Chinese (zh)
Other versions
CN105027674A (zh
Inventor
J·W·威坎普
M·A·德桑贝
E·R·雅各布斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN105027674A publication Critical patent/CN105027674A/zh
Application granted granted Critical
Publication of CN105027674B publication Critical patent/CN105027674B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN201480011058.4A 2013-02-28 2014-02-14 适于电容驱动的简单led封装 Expired - Fee Related CN105027674B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361770413P 2013-02-28 2013-02-28
US61/770,413 2013-02-28
PCT/IB2014/058986 WO2014132164A2 (en) 2013-02-28 2014-02-14 Simple led package suitable for capacitive driving

Publications (2)

Publication Number Publication Date
CN105027674A CN105027674A (zh) 2015-11-04
CN105027674B true CN105027674B (zh) 2017-11-17

Family

ID=50193558

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480011058.4A Expired - Fee Related CN105027674B (zh) 2013-02-28 2014-02-14 适于电容驱动的简单led封装

Country Status (6)

Country Link
US (1) US9281299B2 (enExample)
EP (1) EP2962531B1 (enExample)
JP (1) JP6419089B2 (enExample)
CN (1) CN105027674B (enExample)
RU (1) RU2663814C2 (enExample)
WO (1) WO2014132164A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114010A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements
BR112018012650A2 (pt) 2015-12-23 2018-12-04 Koninklijke Philips Nv disposição de carga, disposição de potência elétrica, sistema, estrutura marinha e uso de uma disposição de carga
WO2017108641A1 (en) 2015-12-23 2017-06-29 Koninklijke Philips N.V. Marine structure
CA3009270C (en) 2015-12-23 2024-06-11 Koninklijke Philips N.V. Load arrangement and electrical power arrangement for powering a load
CA3032714A1 (en) * 2016-10-07 2018-04-12 Grote Industries, Llc Thin film sheet including power lines, lights, and sensors
CN110690329B (zh) * 2019-10-16 2021-06-29 福州大学 一种单端电学接触、单端载流子注入的μLED发光与显示器件及其制备方法
CN110690328B (zh) * 2019-10-16 2021-05-18 福州大学 一种基于波长下转换的无电学接触μLED发光器件

Citations (4)

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US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
CN1836332A (zh) * 2003-08-12 2006-09-20 皇家飞利浦电子股份有限公司 用于交流驱动有机二极管的电路装置
CN1943276A (zh) * 2004-02-25 2007-04-04 迈克尔·米斯金 Ac发光二极管以及ac led驱动方法和装置
CN102067724A (zh) * 2008-06-17 2011-05-18 皇家飞利浦电子股份有限公司 适合于交流驱动的发光器件

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JP3249582B2 (ja) 1992-07-24 2002-01-21 シャープ株式会社 発光装置
US6630689B2 (en) 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
TWI223460B (en) 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
TW200702824A (en) * 2005-06-02 2007-01-16 Koninkl Philips Electronics Nv LED assembly and module
US7498252B2 (en) 2006-09-29 2009-03-03 Intel Corporation Dual layer dielectric stack for microelectronics having thick metal lines
US20090140279A1 (en) 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
WO2010017655A1 (zh) 2008-08-12 2010-02-18 海立尔股份有限公司 具有埋入式电容的发光二极管座体结构
US20110234114A1 (en) * 2008-12-05 2011-09-29 Lynk Labs, Inc. Ac led lighting element and ac led lighting system methods and apparatus
CN101894901B (zh) 2009-04-08 2013-11-20 硅谷光擎 用于多个发光二极管的封装
CN102044600A (zh) 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JP5375544B2 (ja) * 2009-11-19 2013-12-25 日亜化学工業株式会社 半導体発光装置及びその製造方法
TWM401207U (en) 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
US8797285B2 (en) 2011-04-18 2014-08-05 Atmel Corporation Panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1836332A (zh) * 2003-08-12 2006-09-20 皇家飞利浦电子股份有限公司 用于交流驱动有机二极管的电路装置
CN1943276A (zh) * 2004-02-25 2007-04-04 迈克尔·米斯金 Ac发光二极管以及ac led驱动方法和装置
US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
CN102067724A (zh) * 2008-06-17 2011-05-18 皇家飞利浦电子股份有限公司 适合于交流驱动的发光器件

Also Published As

Publication number Publication date
US20150380390A1 (en) 2015-12-31
RU2015140801A (ru) 2017-03-31
EP2962531A2 (en) 2016-01-06
WO2014132164A2 (en) 2014-09-04
JP2016510170A (ja) 2016-04-04
CN105027674A (zh) 2015-11-04
JP6419089B2 (ja) 2018-11-07
RU2663814C2 (ru) 2018-08-10
EP2962531B1 (en) 2017-08-30
US9281299B2 (en) 2016-03-08
WO2014132164A3 (en) 2014-11-20

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Effective date of registration: 20170310

Address after: The city of Eindhoven in Holland

Applicant after: KONINKL PHILIPS NV

Address before: The city of Eindhoven in Holland

Applicant before: Koninkl Philips Electronics NV

GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Eindhoven

Patentee after: Signify Holdings Ltd.

Address before: The city of Eindhoven in Holland

Patentee before: PHILIPS LIGHTING HOLDING B.V.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171117

Termination date: 20210214