RU2663814C2 - Простой светодиодный модуль, пригодный для емкостного возбуждения - Google Patents

Простой светодиодный модуль, пригодный для емкостного возбуждения Download PDF

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Publication number
RU2663814C2
RU2663814C2 RU2015140801A RU2015140801A RU2663814C2 RU 2663814 C2 RU2663814 C2 RU 2663814C2 RU 2015140801 A RU2015140801 A RU 2015140801A RU 2015140801 A RU2015140801 A RU 2015140801A RU 2663814 C2 RU2663814 C2 RU 2663814C2
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RU
Russia
Prior art keywords
led
leds
assembly according
led assembly
layers
Prior art date
Application number
RU2015140801A
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English (en)
Russian (ru)
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RU2015140801A (ru
Inventor
Йоханнес Вильхельмус ВЕКАМП
САМБЕР Марк Андре ДЕ
Эгбертус Рейнир ЯКОБС
Original Assignee
Филипс Лайтинг Холдинг Б.В.
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Application filed by Филипс Лайтинг Холдинг Б.В. filed Critical Филипс Лайтинг Холдинг Б.В.
Publication of RU2015140801A publication Critical patent/RU2015140801A/ru
Application granted granted Critical
Publication of RU2663814C2 publication Critical patent/RU2663814C2/ru

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
RU2015140801A 2013-02-28 2014-02-14 Простой светодиодный модуль, пригодный для емкостного возбуждения RU2663814C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361770413P 2013-02-28 2013-02-28
US61/770,413 2013-02-28
PCT/IB2014/058986 WO2014132164A2 (en) 2013-02-28 2014-02-14 Simple led package suitable for capacitive driving

Publications (2)

Publication Number Publication Date
RU2015140801A RU2015140801A (ru) 2017-03-31
RU2663814C2 true RU2663814C2 (ru) 2018-08-10

Family

ID=50193558

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2015140801A RU2663814C2 (ru) 2013-02-28 2014-02-14 Простой светодиодный модуль, пригодный для емкостного возбуждения

Country Status (6)

Country Link
US (1) US9281299B2 (enExample)
EP (1) EP2962531B1 (enExample)
JP (1) JP6419089B2 (enExample)
CN (1) CN105027674B (enExample)
RU (1) RU2663814C2 (enExample)
WO (1) WO2014132164A2 (enExample)

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DE102015114010A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements
TR201910536T4 (tr) 2015-12-23 2019-08-21 Koninklijke Philips Nv Bir yüke güç sağlanmasına yönelik yük düzenlemesi ve elektrik gücü düzenlemesi.
MX2018007714A (es) 2015-12-23 2018-08-15 Koninklijke Philips Nv Estructura marina.
EP3531801B1 (en) 2015-12-23 2020-10-14 Koninklijke Philips N.V. Electrical power arrangement for powering a load and corresponding method
CA3032714A1 (en) * 2016-10-07 2018-04-12 Grote Industries, Llc Thin film sheet including power lines, lights, and sensors
CN110690328B (zh) * 2019-10-16 2021-05-18 福州大学 一种基于波长下转换的无电学接触μLED发光器件
CN110690329B (zh) * 2019-10-16 2021-06-29 福州大学 一种单端电学接触、单端载流子注入的μLED发光与显示器件及其制备方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
US20050251698A1 (en) * 2004-05-10 2005-11-10 Manuel Lynch Cuttable illuminated panel
US20080218095A1 (en) * 2005-06-02 2008-09-11 Koninklijke Philips Electronics, N.V. Led Assembly and Module
US20110084624A1 (en) * 2008-06-17 2011-04-14 Tim Dekker Light emitting device adapted for ac drive

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JP3249582B2 (ja) 1992-07-24 2002-01-21 シャープ株式会社 発光装置
US6630689B2 (en) 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
WO2005015640A1 (en) * 2003-08-12 2005-02-17 Philips Intellectual Property & Standards Gmbh Circuit arrangement for ac driving of organic diodes
TWI223460B (en) 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
CN102032486A (zh) * 2004-02-25 2011-04-27 迈克尔·米斯金 Ac发光二极管以及ac led驱动方法和装置
US7498252B2 (en) 2006-09-29 2009-03-03 Intel Corporation Dual layer dielectric stack for microelectronics having thick metal lines
US20090140279A1 (en) 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
WO2010017655A1 (zh) 2008-08-12 2010-02-18 海立尔股份有限公司 具有埋入式电容的发光二极管座体结构
EP2373921A1 (en) * 2008-12-05 2011-10-12 Lynk Labs, Inc. Ac led lighting element and ac led lighting system methods and apparatus
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
CN102044600A (zh) 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JP5375544B2 (ja) * 2009-11-19 2013-12-25 日亜化学工業株式会社 半導体発光装置及びその製造方法
TWM401207U (en) 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
US8797285B2 (en) 2011-04-18 2014-08-05 Atmel Corporation Panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050212406A1 (en) * 2004-03-29 2005-09-29 Daniels John J Photo-radiation source
US20050251698A1 (en) * 2004-05-10 2005-11-10 Manuel Lynch Cuttable illuminated panel
US20080218095A1 (en) * 2005-06-02 2008-09-11 Koninklijke Philips Electronics, N.V. Led Assembly and Module
US20110084624A1 (en) * 2008-06-17 2011-04-14 Tim Dekker Light emitting device adapted for ac drive

Also Published As

Publication number Publication date
EP2962531A2 (en) 2016-01-06
CN105027674A (zh) 2015-11-04
WO2014132164A2 (en) 2014-09-04
WO2014132164A3 (en) 2014-11-20
RU2015140801A (ru) 2017-03-31
US20150380390A1 (en) 2015-12-31
JP6419089B2 (ja) 2018-11-07
JP2016510170A (ja) 2016-04-04
EP2962531B1 (en) 2017-08-30
CN105027674B (zh) 2017-11-17
US9281299B2 (en) 2016-03-08

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20210215