JP6416219B2 - レーザー装置を冷却するための冷却装置及び冷却装置を備えたレーザーシステム - Google Patents

レーザー装置を冷却するための冷却装置及び冷却装置を備えたレーザーシステム Download PDF

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Publication number
JP6416219B2
JP6416219B2 JP2016511054A JP2016511054A JP6416219B2 JP 6416219 B2 JP6416219 B2 JP 6416219B2 JP 2016511054 A JP2016511054 A JP 2016511054A JP 2016511054 A JP2016511054 A JP 2016511054A JP 6416219 B2 JP6416219 B2 JP 6416219B2
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JP
Japan
Prior art keywords
cooling device
cooling
hole
coolant supply
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016511054A
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English (en)
Japanese (ja)
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JP2016522989A (ja
Inventor
ポルマン−レッチュ，イェンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
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Koninklijke Philips NV
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Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of JP2016522989A publication Critical patent/JP2016522989A/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Lasers (AREA)
  • Lasers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016511054A 2013-05-02 2014-04-30 レーザー装置を冷却するための冷却装置及び冷却装置を備えたレーザーシステム Expired - Fee Related JP6416219B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13166176.1 2013-05-02
EP13166176 2013-05-02
PCT/EP2014/058828 WO2014177616A1 (en) 2013-05-02 2014-04-30 Cooling device for cooling a laser arrangement and laser system comprising cooling devices

Publications (2)

Publication Number Publication Date
JP2016522989A JP2016522989A (ja) 2016-08-04
JP6416219B2 true JP6416219B2 (ja) 2018-10-31

Family

ID=48288844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016511054A Expired - Fee Related JP6416219B2 (ja) 2013-05-02 2014-04-30 レーザー装置を冷却するための冷却装置及び冷却装置を備えたレーザーシステム

Country Status (7)

Country Link
US (1) US9559490B2 (de)
EP (1) EP2992577B1 (de)
JP (1) JP6416219B2 (de)
CN (1) CN105164873A (de)
BR (1) BR112015027296A2 (de)
RU (1) RU2657120C2 (de)
WO (1) WO2014177616A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUB20159676A1 (it) * 2015-12-24 2017-06-24 Mecc Al S R L A Socio Unico Dispositivo a dissipatore termico con circuito per un fluido di raffreddamento
US20200381894A1 (en) * 2019-05-31 2020-12-03 Trumpf Photonics, Inc. Uniform Cooling of Laser Diode

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311530A (en) * 1990-09-14 1994-05-10 Advanced Optoelectronics, Inc. Semiconductor laser array
RU2019015C1 (ru) * 1991-06-03 1994-08-30 Научно-исследовательский институт "Полюс" Комбинированная система охлаждения для лазерных медицинских установок
FR2741208B1 (fr) 1995-11-13 1997-12-05 Commissariat Energie Atomique Assemblage de barrettes de diodes laser refroidies
US5835345A (en) 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
JP3816194B2 (ja) * 1996-11-22 2006-08-30 ファナック株式会社 冷却装置、光源装置、面発光装置、およびその製造方法
DE19710783C2 (de) 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
DE29716405U1 (de) 1997-09-12 1999-01-21 Inter-Mercador GmbH & Co. KG, Import Export, 28307 Bremen Wärmeübertragungskörper und -vorrichtung, insbesondere zum Kühlen von elektronischen Bauteilen
US6386278B1 (en) 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
JP3518434B2 (ja) 1999-08-11 2004-04-12 株式会社日立製作所 マルチチップモジュールの冷却装置
US6566824B2 (en) * 2001-10-16 2003-05-20 Teledyne Lighting And Display Products, Inc. Flexible lighting segment
US20050016895A1 (en) 2003-07-24 2005-01-27 Glenn David R. Travel case for transporting insulin
US7058101B2 (en) * 2003-09-20 2006-06-06 Spectra Physics, Inc. Stepped manifold array of microchannel heat sinks
JP4934954B2 (ja) 2003-10-15 2012-05-23 日亜化学工業株式会社 ヒートシンク及びヒートシンクを備えた半導体装置
CN100472823C (zh) * 2003-10-15 2009-03-25 日亚化学工业株式会社 发光装置
JP2005217211A (ja) 2004-01-30 2005-08-11 Tecnisco Ltd 半導体用冷却器及び半導体用冷却器積層体
US7353859B2 (en) 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7656915B2 (en) 2006-07-26 2010-02-02 Northrop Grumman Space & Missions Systems Corp. Microchannel cooler for high efficiency laser diode heat extraction
US8495890B2 (en) * 2007-01-22 2013-07-30 Johnson Controls Technology Company Cooling member
EP1959528B1 (de) * 2007-02-13 2017-04-12 Laserline Gesellschaft für Entwicklung und Vertrieb von Diodenlasern mbH Diodenlaseranordnung sowie Verfahren zum Herstellen einer solchen Anordnung
WO2008132056A1 (de) * 2007-04-26 2008-11-06 Ceramtec Ag Kühldose für bauelemente oder schaltungen
JP4407764B2 (ja) * 2007-08-10 2010-02-03 パナソニック電工株式会社 ヒートシンクおよびヒートシンクを備えた半導体装置
US8418751B2 (en) 2008-05-13 2013-04-16 International Business Machines Corporation Stacked and redundant chip coolers
TWI524839B (zh) 2008-07-18 2016-03-01 強生控制科技公司 接地系統、功率半導體裝置及可變速度式驅動器
US8929071B2 (en) * 2008-12-22 2015-01-06 General Electric Company Low cost manufacturing of micro-channel heatsink
CN201374498Y (zh) 2009-01-16 2009-12-30 北京工业大学 一种长寿命半导体激光器微通道热沉
CN202678552U (zh) * 2012-07-31 2013-01-16 广东欧珀移动通信有限公司 一种pcb板对板连接结构

Also Published As

Publication number Publication date
CN105164873A (zh) 2015-12-16
WO2014177616A1 (en) 2014-11-06
US20160118768A1 (en) 2016-04-28
JP2016522989A (ja) 2016-08-04
RU2015151394A (ru) 2017-06-06
EP2992577B1 (de) 2019-01-09
EP2992577A1 (de) 2016-03-09
US9559490B2 (en) 2017-01-31
BR112015027296A2 (pt) 2017-07-25
RU2657120C2 (ru) 2018-06-08

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