JP6415215B2 - 基板処理装置、半導体装置の製造方法及びプログラム - Google Patents

基板処理装置、半導体装置の製造方法及びプログラム Download PDF

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Publication number
JP6415215B2
JP6415215B2 JP2014196414A JP2014196414A JP6415215B2 JP 6415215 B2 JP6415215 B2 JP 6415215B2 JP 2014196414 A JP2014196414 A JP 2014196414A JP 2014196414 A JP2014196414 A JP 2014196414A JP 6415215 B2 JP6415215 B2 JP 6415215B2
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Prior art keywords
gas
processing
discharge chamber
chamber
processing gas
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Japanese (ja)
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JP2016072260A (ja
JP2016072260A5 (enExample
Inventor
豊田　一行
一行 豊田
純史 梅川
純史 梅川
河畠　誠
誠 河畠
剛吏 柴田
剛吏 柴田
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Kokusai Electric Corp
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Kokusai Electric Corp
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Priority to JP2014196414A priority Critical patent/JP6415215B2/ja
Priority to KR1020150124041A priority patent/KR20160037077A/ko
Priority to US14/844,784 priority patent/US20160093476A1/en
Publication of JP2016072260A publication Critical patent/JP2016072260A/ja
Publication of JP2016072260A5 publication Critical patent/JP2016072260A5/ja
Application granted granted Critical
Publication of JP6415215B2 publication Critical patent/JP6415215B2/ja
Priority to US18/608,204 priority patent/US20240222086A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
JP2014196414A 2014-09-26 2014-09-26 基板処理装置、半導体装置の製造方法及びプログラム Active JP6415215B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014196414A JP6415215B2 (ja) 2014-09-26 2014-09-26 基板処理装置、半導体装置の製造方法及びプログラム
KR1020150124041A KR20160037077A (ko) 2014-09-26 2015-09-02 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램
US14/844,784 US20160093476A1 (en) 2014-09-26 2015-09-03 Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-Transitory Computer-Readable Recording Medium
US18/608,204 US20240222086A1 (en) 2014-09-26 2024-03-18 Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014196414A JP6415215B2 (ja) 2014-09-26 2014-09-26 基板処理装置、半導体装置の製造方法及びプログラム

Publications (3)

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JP2016072260A JP2016072260A (ja) 2016-05-09
JP2016072260A5 JP2016072260A5 (enExample) 2017-06-22
JP6415215B2 true JP6415215B2 (ja) 2018-10-31

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US (2) US20160093476A1 (enExample)
JP (1) JP6415215B2 (enExample)
KR (1) KR20160037077A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6830878B2 (ja) * 2017-09-28 2021-02-17 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置、プログラム
JP7254620B2 (ja) 2018-06-26 2023-04-10 株式会社Kokusai Electric 半導体装置の製造方法、部品の管理方法、基板処理装置及び基板処理プログラム
US11535931B2 (en) 2018-06-26 2022-12-27 Kokusai Electric Corporation Method of manufacturing semiconductor device, method of managing parts, and recording medium
KR20210119489A (ko) * 2019-03-15 2021-10-05 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 방법, 기판 처리 장치 및 프로그램
US11527380B2 (en) * 2020-04-01 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Ion implanter toxic gas delivery system
JP7203070B2 (ja) * 2020-09-23 2023-01-12 株式会社Kokusai Electric 基板処理装置、基板処理方法及び半導体装置の製造方法
JP7284139B2 (ja) 2020-11-27 2023-05-30 株式会社Kokusai Electric 半導体装置の製造方法、プログラム、基板処理装置および基板処理方法

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JPH06124910A (ja) * 1992-08-26 1994-05-06 Fujitsu Ltd 膜の形成方法及び薄膜トランジスタの作成方法及び液晶装置の作成方法及び太陽電池の作成方法
JP2942138B2 (ja) * 1994-03-22 1999-08-30 三菱電機株式会社 プラズマ処理装置及びプラズマ処理方法
JPH10312899A (ja) * 1997-05-15 1998-11-24 Matsushita Electric Ind Co Ltd プラズマ処理方法及びプラズマ処理装置
AR041013A1 (es) * 2002-12-04 2005-04-27 Yt Ingenieria Ltda Aparato dosificador de gas y metodo para dosificar cantidades predeterminadas de gas
US7628860B2 (en) * 2004-04-12 2009-12-08 Mks Instruments, Inc. Pulsed mass flow delivery system and method
JP4516969B2 (ja) * 2004-10-07 2010-08-04 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
US8453600B2 (en) * 2004-12-28 2013-06-04 Hitachi Kokusai Electric Inc. Substrate processing apparatus
US8202367B2 (en) * 2006-03-30 2012-06-19 Mitsui Engineering & Shipbuilding Co., Ltd. Atomic layer growing apparatus
JP4978355B2 (ja) * 2007-07-19 2012-07-18 富士通セミコンダクター株式会社 成膜装置及びそのコーティング方法
JP4977636B2 (ja) * 2008-02-06 2012-07-18 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP5616591B2 (ja) * 2008-06-20 2014-10-29 株式会社日立国際電気 半導体装置の製造方法及び基板処理装置
JP2010027702A (ja) * 2008-07-16 2010-02-04 Hitachi Kokusai Electric Inc 基板処理装置及び薄膜生成方法
JP2010129666A (ja) * 2008-11-26 2010-06-10 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
US8557687B2 (en) * 2009-07-23 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Method for forming microcrystalline semiconductor film and method for manufacturing thin film transistor
JP5520552B2 (ja) * 2009-09-11 2014-06-11 株式会社日立国際電気 半導体装置の製造方法及び基板処理装置
US8486192B2 (en) * 2010-09-30 2013-07-16 Soitec Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
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JP5886531B2 (ja) * 2011-02-24 2016-03-16 東京エレクトロン株式会社 成膜方法および成膜装置
JP5946643B2 (ja) * 2012-01-13 2016-07-06 株式会社日立国際電気 半導体装置の製造方法、クリーニング方法及び基板処理装置
JP5824372B2 (ja) * 2012-01-25 2015-11-25 東京エレクトロン株式会社 処理装置及びプロセス状態の確認方法
JP5547763B2 (ja) * 2012-03-16 2014-07-16 三井造船株式会社 プラズマ生成方法、この方法を用いた薄膜形成方法及びプラズマ生成装置
JP6245643B2 (ja) * 2013-03-28 2017-12-13 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
JP6011420B2 (ja) * 2013-03-29 2016-10-19 東京エレクトロン株式会社 縦型熱処理装置の運転方法、縦型熱処理装置及び記憶媒体

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Publication number Publication date
KR20160037077A (ko) 2016-04-05
US20160093476A1 (en) 2016-03-31
JP2016072260A (ja) 2016-05-09
US20240222086A1 (en) 2024-07-04

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