JP6407960B2 - スパッタリング装置 - Google Patents
スパッタリング装置 Download PDFInfo
- Publication number
- JP6407960B2 JP6407960B2 JP2016503826A JP2016503826A JP6407960B2 JP 6407960 B2 JP6407960 B2 JP 6407960B2 JP 2016503826 A JP2016503826 A JP 2016503826A JP 2016503826 A JP2016503826 A JP 2016503826A JP 6407960 B2 JP6407960 B2 JP 6407960B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding body
- sputtering apparatus
- target
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
Description
2 ターゲット
3 基板
4 保持体
42 基板押さえ
43 ストッパ突起
Claims (7)
- ターゲット及び第1面とその裏面である第2面とを有する基板が内に配置されるべき処理室と、
前記処理室内にて前記基板の前記第1面が前記ターゲットに対向するように前記基板の前記第2面を保持するための保持体と、
前記基板の前記第1面の周縁部を覆いかつ押さえるための基板押さえであって、前記処理室内での前記ターゲットのスパッタリングによって前記第1面に形成される金属膜の成膜領域の外縁を規定する、基板押さえと、
前記基板押さえ及び前記保持体の上に不要な金属膜が形成されることを妨げるように、前記成膜領域を覆うことなく前記保持体を前記基板押さえを含めて覆う防着板と、
前記防着板が前記基板押さえに接触することを妨げるように、前記防着板が前記保持体に正対している領域にて該防着板及び該保持体の一方から他方に向けて突設されているストッパ突起と
を備えており、
前記基板は矩形形状を有しており、前記ストッパ突起は、前記基板の一辺の中央部、及び前記一辺の両側の角部近傍に適切な高さで設けてある
ことを特徴とするスパッタリング装置。 - 前記ストッパ突起は、前記防着板及び保持体より低硬度の材料製であることを特徴とする請求項1に記載のスパッタリング装置。
- 前記ストッパ突起の先端は、先細形状としてあることを特徴とする請求項1又は請求項2に記載のスパッタリング装置。
- 複数の前記処理室を直線状に並設し、並設方向に沿って前記基板及び保持体を搬送し、前記複数の処理室に順次搬出入するインライン型として構成してあることを特徴とする請求項1から請求項3のいずれか1つに記載のスパッタリング装置。
- 複数の前記処理室を放射状に並設し、並設域の中央に設けた搬出入手段の動作により前記処理室の夫々に前記基板を順次搬出入する枚葉型として構成してあることを特徴とする請求項1から請求項3のいずれか1つに記載のスパッタリング装置。
- 前記基板を収めるための凹所が前記保持体に形成されている、請求項1から請求項5のいずれか1つに記載のスパッタリング装置。
- 前記基板の前記裏面を支えるための凸部が前記凹所に形成されている、請求項6に記載のスパッタリング装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/053923 WO2015125241A1 (ja) | 2014-02-19 | 2014-02-19 | スパッタリング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015125241A1 JPWO2015125241A1 (ja) | 2017-03-30 |
JP6407960B2 true JP6407960B2 (ja) | 2018-10-17 |
Family
ID=53877776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016503826A Expired - Fee Related JP6407960B2 (ja) | 2014-02-19 | 2014-02-19 | スパッタリング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10170288B2 (ja) |
JP (1) | JP6407960B2 (ja) |
CN (1) | CN105980595B (ja) |
WO (1) | WO2015125241A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11842887B2 (en) | 2017-06-29 | 2023-12-12 | Ulvac, Inc. | Film formation apparatus |
US11414747B2 (en) | 2018-06-26 | 2022-08-16 | Tokyo Electron Limited | Sputtering device |
JP7246148B2 (ja) * | 2018-06-26 | 2023-03-27 | 東京エレクトロン株式会社 | スパッタ装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60135571A (ja) * | 1983-12-21 | 1985-07-18 | Shimadzu Corp | スパツタリングにおけるタ−ゲツト取付方法 |
US5518593A (en) * | 1994-04-29 | 1996-05-21 | Applied Komatsu Technology, Inc. | Shield configuration for vacuum chamber |
JP3901754B2 (ja) * | 1995-08-22 | 2007-04-04 | 株式会社アルバック | 基板保持装置、スパッタリング装置、基板交換方法、スパッタリング方法 |
US5843520A (en) * | 1997-01-13 | 1998-12-01 | Vanguard International Semiconductor Corporation | Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers |
US5922133A (en) * | 1997-09-12 | 1999-07-13 | Applied Materials, Inc. | Multiple edge deposition exclusion rings |
TW461923B (en) * | 1998-02-17 | 2001-11-01 | Sharp Kk | Movable sputtering film forming apparatus |
JP3566528B2 (ja) * | 1998-02-26 | 2004-09-15 | シャープ株式会社 | スパッタ膜の製造装置およびスパッタ膜の製造方法 |
US6146504A (en) * | 1998-05-21 | 2000-11-14 | Applied Materials, Inc. | Substrate support and lift apparatus and method |
JP2000169961A (ja) * | 1998-12-02 | 2000-06-20 | Matsushita Electric Ind Co Ltd | スパッタ装置 |
JP4673478B2 (ja) * | 2000-10-05 | 2011-04-20 | キヤノンアネルバ株式会社 | バイアススパッタリング装置及びバイアススパッタリング方法 |
US6589382B2 (en) * | 2001-11-26 | 2003-07-08 | Eastman Kodak Company | Aligning mask segments to provide a stitched mask for producing OLED devices |
JP4098283B2 (ja) * | 2004-07-30 | 2008-06-11 | 株式会社アルバック | スパッタリング装置 |
JP4881335B2 (ja) * | 2008-02-26 | 2012-02-22 | 日本放送協会 | スパッタ装置 |
JP2010003647A (ja) * | 2008-06-23 | 2010-01-07 | Sumco Corp | イオン注入装置 |
JP5362112B2 (ja) * | 2010-06-17 | 2013-12-11 | 株式会社アルバック | スパッタ成膜装置及び防着部材 |
WO2012147298A1 (ja) * | 2011-04-28 | 2012-11-01 | キヤノンアネルバ株式会社 | 成膜装置 |
JP2013104128A (ja) * | 2011-11-16 | 2013-05-30 | Sharp Corp | 防着板、スパッタリング装置および薄膜太陽電池の製造装置 |
JP5617011B2 (ja) * | 2013-06-05 | 2014-10-29 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
-
2014
- 2014-02-19 US US15/114,360 patent/US10170288B2/en active Active
- 2014-02-19 CN CN201480075134.8A patent/CN105980595B/zh active Active
- 2014-02-19 WO PCT/JP2014/053923 patent/WO2015125241A1/ja active Application Filing
- 2014-02-19 JP JP2016503826A patent/JP6407960B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105980595A (zh) | 2016-09-28 |
CN105980595B (zh) | 2019-05-10 |
WO2015125241A1 (ja) | 2015-08-27 |
US10170288B2 (en) | 2019-01-01 |
JPWO2015125241A1 (ja) | 2017-03-30 |
US20170018412A1 (en) | 2017-01-19 |
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