JP6396633B2 - 回路基板 - Google Patents

回路基板 Download PDF

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Publication number
JP6396633B2
JP6396633B2 JP2012030939A JP2012030939A JP6396633B2 JP 6396633 B2 JP6396633 B2 JP 6396633B2 JP 2012030939 A JP2012030939 A JP 2012030939A JP 2012030939 A JP2012030939 A JP 2012030939A JP 6396633 B2 JP6396633 B2 JP 6396633B2
Authority
JP
Japan
Prior art keywords
land
connection terminal
width
circuit board
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012030939A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013168517A (ja
JP2013168517A5 (enExample
Inventor
元彦 大谷
元彦 大谷
宣公 森内
宣公 森内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saturn Licensing LLC
Original Assignee
Saturn Licensing LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saturn Licensing LLC filed Critical Saturn Licensing LLC
Priority to JP2012030939A priority Critical patent/JP6396633B2/ja
Priority to US13/717,901 priority patent/US9113564B2/en
Priority to KR1020130013731A priority patent/KR20130094235A/ko
Priority to CN201310050910.6A priority patent/CN103260346B/zh
Publication of JP2013168517A publication Critical patent/JP2013168517A/ja
Publication of JP2013168517A5 publication Critical patent/JP2013168517A5/ja
Application granted granted Critical
Publication of JP6396633B2 publication Critical patent/JP6396633B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2012030939A 2012-02-15 2012-02-15 回路基板 Active JP6396633B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012030939A JP6396633B2 (ja) 2012-02-15 2012-02-15 回路基板
US13/717,901 US9113564B2 (en) 2012-02-15 2012-12-18 Circuit board
KR1020130013731A KR20130094235A (ko) 2012-02-15 2013-02-07 회로 기판
CN201310050910.6A CN103260346B (zh) 2012-02-15 2013-02-08 电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012030939A JP6396633B2 (ja) 2012-02-15 2012-02-15 回路基板

Publications (3)

Publication Number Publication Date
JP2013168517A JP2013168517A (ja) 2013-08-29
JP2013168517A5 JP2013168517A5 (enExample) 2015-03-12
JP6396633B2 true JP6396633B2 (ja) 2018-09-26

Family

ID=48944678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012030939A Active JP6396633B2 (ja) 2012-02-15 2012-02-15 回路基板

Country Status (4)

Country Link
US (1) US9113564B2 (enExample)
JP (1) JP6396633B2 (enExample)
KR (1) KR20130094235A (enExample)
CN (1) CN103260346B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板
US11195269B2 (en) * 2015-03-27 2021-12-07 Texas Instruments Incorporated Exposed pad integrated circuit package
JP2016192352A (ja) * 2015-03-31 2016-11-10 株式会社オートネットワーク技術研究所 ワイヤーハーネス及びワイヤーハーネスの製造方法
CN106455350A (zh) * 2016-09-29 2017-02-22 广东小天才科技有限公司 一种元器件的更换方法
US11569155B2 (en) * 2021-06-09 2023-01-31 Western Digital Technologies, Inc. Substrate bonding pad having a multi-surface trace interface
US11839031B2 (en) * 2022-04-06 2023-12-05 Western Digital Technologies, Inc. Micro solder joint and stencil aperture design

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217388A (ja) * 1990-12-19 1992-08-07 Mitsubishi Electric Corp 印刷配線板
US5303122A (en) * 1991-10-31 1994-04-12 Ford Motor Company Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JPH0718475U (ja) * 1993-09-09 1995-03-31 日本ビクター株式会社 印刷配線板
JPH07106745A (ja) * 1993-09-30 1995-04-21 Ibiden Co Ltd プリント配線板及びパッドへの半田皮膜形成方法
KR100304649B1 (ko) * 1999-02-02 2001-09-13 윤종용 집적회로 패키지의 리드핀 납땜 검사방법 및 검사장치
JP3948376B2 (ja) * 2002-09-05 2007-07-25 株式会社デンソー 電子装置の製造方法
JP2007281122A (ja) * 2006-04-05 2007-10-25 Denso Corp モールドパッケージの実装構造
JP2009141170A (ja) * 2007-12-07 2009-06-25 Fujitsu Component Ltd 基板のパッド構造
CN101568224B (zh) * 2008-04-22 2012-01-25 鸿富锦精密工业（深圳）有限公司 电路板及具有该电路板的电子装置
CN101656217B (zh) * 2008-08-18 2011-03-23 中芯国际集成电路制造(上海)有限公司 系统级封装的方法
JP5649788B2 (ja) * 2009-01-21 2015-01-07 富士通株式会社 プリント板、プリント板実装構造、およびプリント板実装方法
CN102314009A (zh) * 2011-09-09 2012-01-11 深圳市华星光电技术有限公司 液晶显示模组及液晶显示面板

Also Published As

Publication number Publication date
KR20130094235A (ko) 2013-08-23
US9113564B2 (en) 2015-08-18
JP2013168517A (ja) 2013-08-29
CN103260346B (zh) 2018-04-10
CN103260346A (zh) 2013-08-21
US20130206456A1 (en) 2013-08-15

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