JP6395597B2 - ダイシング用粘着テープおよび半導体チップの製造方法 - Google Patents

ダイシング用粘着テープおよび半導体チップの製造方法 Download PDF

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Publication number
JP6395597B2
JP6395597B2 JP2014263574A JP2014263574A JP6395597B2 JP 6395597 B2 JP6395597 B2 JP 6395597B2 JP 2014263574 A JP2014263574 A JP 2014263574A JP 2014263574 A JP2014263574 A JP 2014263574A JP 6395597 B2 JP6395597 B2 JP 6395597B2
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Japan
Prior art keywords
pressure
sensitive adhesive
adhesive tape
element substrate
semiconductor element
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JP2014263574A
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English (en)
Japanese (ja)
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JP2016122812A (ja
Inventor
晃良 増田
晃良 増田
梨夏 高城
梨夏 高城
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Maxell Holdings Ltd
Original Assignee
Maxell Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Maxell Holdings Ltd filed Critical Maxell Holdings Ltd
Priority to JP2014263574A priority Critical patent/JP6395597B2/ja
Priority to TW104139182A priority patent/TWI655682B/zh
Priority to KR1020150184810A priority patent/KR102440961B1/ko
Priority to CN201510977427.1A priority patent/CN105733462A/zh
Publication of JP2016122812A publication Critical patent/JP2016122812A/ja
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Publication of JP6395597B2 publication Critical patent/JP6395597B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2014263574A 2014-12-25 2014-12-25 ダイシング用粘着テープおよび半導体チップの製造方法 Active JP6395597B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014263574A JP6395597B2 (ja) 2014-12-25 2014-12-25 ダイシング用粘着テープおよび半導体チップの製造方法
TW104139182A TWI655682B (zh) 2014-12-25 2015-11-25 切割用黏著膠帶及半導體晶片的製造方法
KR1020150184810A KR102440961B1 (ko) 2014-12-25 2015-12-23 다이싱용 점착 테이프 및 반도체칩의 제조 방법
CN201510977427.1A CN105733462A (zh) 2014-12-25 2015-12-23 切割用粘着胶带和半导体芯片的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014263574A JP6395597B2 (ja) 2014-12-25 2014-12-25 ダイシング用粘着テープおよび半導体チップの製造方法

Publications (2)

Publication Number Publication Date
JP2016122812A JP2016122812A (ja) 2016-07-07
JP6395597B2 true JP6395597B2 (ja) 2018-09-26

Family

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JP2014263574A Active JP6395597B2 (ja) 2014-12-25 2014-12-25 ダイシング用粘着テープおよび半導体チップの製造方法

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Country Link
JP (1) JP6395597B2 (ko)
KR (1) KR102440961B1 (ko)
CN (1) CN105733462A (ko)
TW (1) TWI655682B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799618B (zh) 2018-09-03 2023-04-21 日商麥克賽爾股份有限公司 切割用黏著帶及半導體晶片之製造方法
KR20220116184A (ko) 2019-12-19 2022-08-22 맥셀 주식회사 다이싱용 점착 테이프 및 반도체칩의 제조 방법
JPWO2021124724A1 (ko) 2019-12-20 2021-06-24

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093503A (ja) 2003-09-12 2005-04-07 Hitachi Cable Ltd ダイシング方法
TWI384046B (zh) * 2005-10-20 2013-02-01 Shinetsu Chemical Co An adhesive composition and a sheet having an adhesive layer made of an adhesive
US20110212328A1 (en) * 2007-08-27 2011-09-01 Lintec Corporation Releasable adhesive sheet and method for protecting incompletely cured coating film
JP5718005B2 (ja) * 2010-09-14 2015-05-13 日東電工株式会社 半導体装置製造用耐熱性粘着テープ及びそのテープを用いた半導体装置の製造方法。
JP2012119395A (ja) * 2010-11-29 2012-06-21 Furukawa Electric Co Ltd:The 半導体デバイスダイシング用粘着テープ及び半導体デバイスチップの製造方法
JP2012151761A (ja) * 2011-01-20 2012-08-09 Nitto Denko Corp 固体撮像デバイス用表面保護用粘着テープ
JP2012169573A (ja) * 2011-02-17 2012-09-06 Furukawa Electric Co Ltd:The ダイシングダイボンドシートおよびｌｅｄ用サファイヤ基板の加工方法
JP2013038408A (ja) 2011-07-14 2013-02-21 Nitto Denko Corp 半導体ウェハ固定用粘着テープ、半導体チップの製造方法及び接着フィルム付き粘着テープ
JP6150415B2 (ja) * 2011-09-27 2017-06-21 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
CN103421433A (zh) * 2012-05-14 2013-12-04 日立麦克赛尔株式会社 塑料透镜成型用粘着带及塑料透镜成型方法
JP6236277B2 (ja) * 2012-11-30 2017-11-22 マクセルホールディングス株式会社 プラスチックレンズ成型用粘着テープおよびプラスチックレンズ成型品の成型方法
JP6222941B2 (ja) * 2013-02-21 2017-11-01 日東電工株式会社 アンダーフィルシート、裏面研削用テープ一体型アンダーフィルシート、ダイシングテープ一体型アンダーフィルシート及び半導体装置の製造方法
JP6168553B2 (ja) * 2013-08-30 2017-07-26 日立マクセル株式会社 ダイシング用粘着テープおよび半導体チップの製造方法

Also Published As

Publication number Publication date
KR102440961B1 (ko) 2022-09-07
TWI655682B (zh) 2019-04-01
TW201635356A (zh) 2016-10-01
KR20160078908A (ko) 2016-07-05
JP2016122812A (ja) 2016-07-07
CN105733462A (zh) 2016-07-06

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