JP6388976B2 - 材料の精密加工のための方法と装置 - Google Patents
材料の精密加工のための方法と装置 Download PDFInfo
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Classifications
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- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
- A61F9/007—Methods or devices for eye surgery
- A61F9/008—Methods or devices for eye surgery using laser
- A61F9/00825—Methods or devices for eye surgery using laser for photodisruption
- A61F9/00827—Refractive correction, e.g. lenticle
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- A—HUMAN NECESSITIES
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- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
- A61F9/007—Methods or devices for eye surgery
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- A61F9/00825—Methods or devices for eye surgery using laser for photodisruption
- A61F9/00836—Flap cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
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- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
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Description
特に、前記目的は材料特に生体材料の精密加工のための装置によって達成される。この装置は、加工すべき材料内に、10μmよりも小さな直径のキャビテーション泡を生成する。これを実現するために、5μJよりも小さなパルスエネルギーのパルスレーザービームが数ミクロンの焦点直径に集束させられる。焦点直径は好ましくは約3μmであり、パルスエネルギーは好ましくは1μJである。また、この装置は、50 kHzよりも大きなパルス繰り返し数の使用により、非常に高速の加工が可能である、ということを特徴とする。これは、特に屈折に関する角膜手術に対して大きな利点となる。この場合、数秒〜約1分の手術時間が実現されるからである。
モード連結(mode-coupled)発振器の構成においては、ディスクレーザー発振器、ファイバーレーザー発振器、およびロッドレーザー発振器が特に好ましい。増幅器の構成においては、ディスクレーザー増幅器、ファイバーレーザー増幅器、およびロッドレーザー増幅器が特に好ましい。
前記レーザービーム発生源における好ましいレーザー媒質は、ドープした固体材料特に結晶およびガラスである。例としては、YAG、タングステン酸塩、サファイア、およびフッ化物ガラスがある。
本発明による装置の一つの構成においては、ビーム偏向のための手段は走査モードで動作させられる。線源からの加工ビームは、一つの次元に沿って周期的に繰り返される経路上で偏向させることができ、したがってたとえば、いろいろな直径の円形経路またはらせん経路を生成させることができる。加工ビームの経路は、装置を回転させることにより、または他の手段たとえばミラー、レンズ、格子、その他によってビームをある経路上に保つことのできる装置により、生成させることができる。ビーム偏向のための手段は、所定の経路上を動くことができるように支持されたスキャナーたとえば機械的スキャナーを有することができる。本発明においては、偏向システムの自然な経路上で、たとえば回転偏向システムにおける円形経路またはらせん経路上で、レーザーを偏向させる高速偏向システムを使用する。個々の位置に接近し、所定位置に到達するとただちに該位置に対してレーザーパルスを発射し、その際偏向システムがふたたび停止するというのではなく、偏向システムの経路を、停止することなく通過し、パルスの放出が所定の時刻に開始される。この所定の放出は、焦点の経路移動速度によって与えられる所定の繰り返し数でなされる。
ビーム偏向装置は、通常のスキャナー、または機械的レーザービーム偏向システムたとえば閉ループモードのガルバノミラーその他を有することができる。しかし、所定の経路(たとえば、円形経路)を通過し、それに応じて所定の位置でビーム発生源を作動させることによって作動する機械的スキャナーが好ましい。このようにして、大面積の切断面を割合にゆっくりしたスキャナー運動により十分な繰り返し数で加工することができる。
図1は、本発明のレーザーシステムの実施形態の各要素を示す模式図である。加工装置1は、線源11としてfsレーザービーム発生源を有する。レーザービーム15は、ミラーとビームスプリッター57とによってビーム拡大光学装置21に連絡している。次に、拡大レーザービーム15´はビーム偏向装置たとえばスキャナーによってXY方向に案内され、ビーム集束装置24にいたる。ビーム集束装置24は、Z軸方向に動くことができ、したがってこのビーム集束装置を矢印Zに沿って変位させることによって焦点を変位させることができる。あるいは、可変焦点距離の集束光学システムを使用して、焦点位置をZ軸方向に制御されたやり方で変位させることができる。このようにして、集束レーザースポット16が加工すべき材料90に作用させられ、このとき材料90は固定装置32によって正しい位置に保持される。この例の場合、材料90は加工すべきコンタクトレンズである。スポット16は、固定装置32を材料上または材料内でX´Y´またはZ´方向に変位させることによって位置を変えることもできる。
巨視的切断形状(cm領域)の場合、十分な密度のスポットで切断面のみを覆う(図3bおよび3c)のに、数百万のレーザースポットが必要である。多くの用途(特に、医療用途)においては、作業時間あるいは治療時間をできるだけ短くするのが有利である。本発明においては、レーザー装置の線源は、大繰り返し数でレーザーパルスを送り出すことができる。図4には、個々のレーザーパルスによって加工される個々のスポット16が、スキャナーが連続的に走査できる経路に沿って配置される可能な走査パターンの部分を模式的に示す。線源11の大繰り返し数においてスポット間の十分大きな距離を実現するために、焦点を、三つの走査次元の少なくとも一つにおいて非常に高速で移動させる。したがって、好ましくは、走査アルゴリズムは、偏向ユニットの自然な運動に対応する経路に沿ってスポットが配置されるように、設計される。このとき、他の二つの次元における運動は割合に低速で行うことができる。偏向ユニットの自然な経路は、たとえば、偏向ユニットが一定の回転速度で移動することができる円形経路とすることができる。これは、たとえば、偏向ユニットの光学要素を回転させることによって実行することができる。この場合、円形経路の半径と焦点の深さ(Z方向)とは、ゆっくりと変えうる走査量である。この変形は、回転対称な切断形状を作り出さなければならない場合に、特に適当である。この場合、レーザーの繰り返し数は、円形経路の回転速度を、線源の最大繰り返し数によって、移動すべき最大円形経路(B)における必要なスポット距離dが与えられるように選択した場合に、特に有利に使用できることになる。切断パターン全体にわたる移動時に円形経路(A)の半径が小さくされたときには、それに応じて線源の繰り返し数を小さくして、ふたたび最適スポット距離を実現することができる。繰り返し数のこの調節は、前記のレーザー線源によって容易に実現することができる。回転速度を線源の繰り返し数に合わせることは、技術的にはより難しい。各円形経路(A、B)に対して連続的にこれを実施しなければならない場合には、特にそうである。しかし、作業時間の短縮のために、回転速度を数ステップ間隔で小さな円形経路に合わせるのが有利でありうる。
11 線源
15 レーザービーム
15´ 拡大レーザービーム
16 集束レーザースポット
21 ビーム拡大光学装置
22 ミラー
23 偏向装置
24 ビーム集束装置
27 パイロットレーザー
31 接触ガラス
32 固定装置
40 発振器
41 パルス
43 パルス
57 ビームスプリッター
80 立体接眼レンズ
90 加工すべき材料
100 前面
101 後面
102 横切れ目
103 微小レンズ
104 面状切れ目
105 面状切れ目
106 つぶれた空洞
107 角膜
110 線
111 境界
120 引出し切れ目
121 引出し切れ目
122 切れ目
123 103の部分
124 103の部分
132 微小レンズの小片
133 カニューレ
134 第二のカニューレ
135 洗浄媒質
136 洗浄媒質
A 円形経路
B 円形経路
XY 方向
X´Y´ 方向
(図1)
Z 方向
Z´ 方向
(図3B)
Z 軸
Claims (13)
- 生体組織の精密加工のための装置であって、
パルス長50 fs〜1 psおよびパルス周波数500 kHz以上を有するパルスレーザと、
ビーム整形および/またはビーム制御および/またはビーム偏向および/またはビーム集
束のためのビーム装置とを備え、
前記ビーム装置は、実質的にレンズ形の組織の切断部分を形成するとともに、組織の表面と組織の前記切断部分との間に少なくとも1つの横切れ目を形成すべくレーザーパルスを組織上または組織内に集束し、かつ焦点を3次元誘導し、前記レンズ形の組織の切断部分の直径よりも小さな最大幅を有する扇形状を有する前記少なくとも1つの横切れ目が、前記レンズ形の組織の切断部分を前記少なくとも1つの横切れ目を介して取り出すために組織上に90度未満の少なくとも1つの横切れ目の円弧によって形成されている、生体組織の精密加工のための装置。 - 各レーザーパルスのエネルギーが100 nJ〜5 μJより下であることを特徴とする請求項
1に記載の生体組織の精密加工のための装置。 - 前記ビーム装置がプログラム可能であることを特徴とする請求項1に記載の生体組織の精密加工のための装置。
- さらに、保持装置が、加工すべき生体組織の位置決めおよび/または固定のために備えられていることを特徴とする請求項1から3のいずれか1項に記載の生体組織の精密加工のための装置。
- 線源からの加工ビームを、あらかじめ決定できる時系列により、あらかじめ決定できる幾何的形状で、ビーム装置によって、生体組織に対してまたは生体組織内に作用させることができることを特徴とする請求項1から4のいずれか1項に記載の生体組織の精密加工のための装置。
- パルス加工ビームを、ビーム偏向装置によって生体組織に作用させることができ、このとき繰り返し数を変えることができることを特徴とする請求項5に記載の生体組織の精密加工のための装置。
- レーザーがファイバーレーザーであることを特徴とする請求項1から6のいずれか1項に記載の生体組織の精密加工のための装置。
- レーザーがディスクレーザーであることを特徴とする請求項1から7のいずれか1項に記載の生体組織の精密加工のための装置。
- レーザーがファイバーレーザー発振器とディスクレーザー増幅器との組合せであることを特徴とする請求項1から6のいずれか1項に記載の生体組織の精密加工のための装置。
- 前記パルスレーザは、レーザーパルス間の時間間隔を焦点の位置に応じて変えられるように構成されている、請求項1から9のいずれか1項に記載の生体組織の精密加工のための装置。
- 前記ビーム装置は、前記焦点が誘導される速度を焦点の位置に応じて変えられるように構成されている、請求項1から10のいずれか1項に記載の生体組織の精密加工のための装置。
- 前記パルスレーザは、1 MHz〜100 MHzのパルス周波数を有する、請求項1から11のいずれか1項に記載の生体組織の精密加工のための装置。
- 前記少なくとも1つの横切れ目は、角膜のフラップを形成することなく、組織上に90度未満の少なくとも1つの横切れ目の円弧によって形成されている、請求項1から12のいずれか1項に記載の生体組織の精密加工のための装置。
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US7351241B2 (en) | 2008-04-01 |
JP2013063336A (ja) | 2013-04-11 |
EP1628606B2 (de) | 2020-01-01 |
JP6204435B2 (ja) | 2017-09-27 |
EP1628606B1 (de) | 2011-07-13 |
ES2365220T3 (es) | 2011-09-26 |
JP2007527731A (ja) | 2007-10-04 |
ATE515998T1 (de) | 2011-07-15 |
US8171937B2 (en) | 2012-05-08 |
JP6105295B2 (ja) | 2017-03-29 |
US10898381B2 (en) | 2021-01-26 |
US20170020733A1 (en) | 2017-01-26 |
EP1628606A1 (de) | 2006-03-01 |
ES2365220T5 (es) | 2020-08-06 |
US9320650B2 (en) | 2016-04-26 |
EP2805697A1 (de) | 2014-11-26 |
US20040243111A1 (en) | 2004-12-02 |
EP2298254B1 (de) | 2014-07-16 |
US20180110655A1 (en) | 2018-04-26 |
EP2298254A1 (de) | 2011-03-23 |
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