JP6387695B2 - 脆性材料基板のブレイク装置 - Google Patents

脆性材料基板のブレイク装置 Download PDF

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Publication number
JP6387695B2
JP6387695B2 JP2014121940A JP2014121940A JP6387695B2 JP 6387695 B2 JP6387695 B2 JP 6387695B2 JP 2014121940 A JP2014121940 A JP 2014121940A JP 2014121940 A JP2014121940 A JP 2014121940A JP 6387695 B2 JP6387695 B2 JP 6387695B2
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JP
Japan
Prior art keywords
break
brittle material
material substrate
break bar
scribe line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014121940A
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English (en)
Japanese (ja)
Other versions
JP2016003146A (ja
Inventor
直 得永
直 得永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2014121940A priority Critical patent/JP6387695B2/ja
Priority to TW104101931A priority patent/TWI644872B/zh
Priority to KR1020150021341A priority patent/KR102321538B1/ko
Priority to CN201510243828.4A priority patent/CN105271680B/zh
Publication of JP2016003146A publication Critical patent/JP2016003146A/ja
Application granted granted Critical
Publication of JP6387695B2 publication Critical patent/JP6387695B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2014121940A 2014-06-13 2014-06-13 脆性材料基板のブレイク装置 Expired - Fee Related JP6387695B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014121940A JP6387695B2 (ja) 2014-06-13 2014-06-13 脆性材料基板のブレイク装置
TW104101931A TWI644872B (zh) 2014-06-13 2015-01-21 Cracking device for brittle material substrate
KR1020150021341A KR102321538B1 (ko) 2014-06-13 2015-02-12 취성재료 기판의 브레이크 장치
CN201510243828.4A CN105271680B (zh) 2014-06-13 2015-05-13 脆性材料基板的裂断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014121940A JP6387695B2 (ja) 2014-06-13 2014-06-13 脆性材料基板のブレイク装置

Publications (2)

Publication Number Publication Date
JP2016003146A JP2016003146A (ja) 2016-01-12
JP6387695B2 true JP6387695B2 (ja) 2018-09-12

Family

ID=55082482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014121940A Expired - Fee Related JP6387695B2 (ja) 2014-06-13 2014-06-13 脆性材料基板のブレイク装置

Country Status (4)

Country Link
JP (1) JP6387695B2 (ko)
KR (1) KR102321538B1 (ko)
CN (1) CN105271680B (ko)
TW (1) TWI644872B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018069614A (ja) * 2016-10-31 2018-05-10 三星ダイヤモンド工業株式会社 基板分断装置
JP6851067B2 (ja) * 2016-11-22 2021-03-31 三星ダイヤモンド工業株式会社 基板分断装置
JP7015047B2 (ja) * 2017-11-30 2022-02-02 三星ダイヤモンド工業株式会社 基板加工装置
CN115368006A (zh) * 2022-09-06 2022-11-22 彩虹（合肥）液晶玻璃有限公司 一种液压掰断装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3787489B2 (ja) 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
JP3792508B2 (ja) 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 貼り合わせ脆性基板の分断方法
JP4088114B2 (ja) * 2002-07-25 2008-05-21 株式会社シライテック 折割装置
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
KR101303542B1 (ko) * 2008-02-11 2013-09-03 엘지디스플레이 주식회사 평판표시패널 절단장치
CN103282317B (zh) * 2011-12-22 2015-12-16 三星钻石工业股份有限公司 脆性材料基板的割断方法
JP2014125419A (ja) * 2012-12-27 2014-07-07 Asahi Glass Co Ltd ガラス板製造装置、および、ガラス板製造方法

Also Published As

Publication number Publication date
CN105271680A (zh) 2016-01-27
JP2016003146A (ja) 2016-01-12
KR102321538B1 (ko) 2021-11-05
CN105271680B (zh) 2019-10-25
TW201546003A (zh) 2015-12-16
TWI644872B (zh) 2018-12-21
KR20150143274A (ko) 2015-12-23

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