JP6383177B2 - 露光装置及びその制御方法、並びにデバイスの製造方法 - Google Patents

露光装置及びその制御方法、並びにデバイスの製造方法 Download PDF

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Publication number
JP6383177B2
JP6383177B2 JP2014099827A JP2014099827A JP6383177B2 JP 6383177 B2 JP6383177 B2 JP 6383177B2 JP 2014099827 A JP2014099827 A JP 2014099827A JP 2014099827 A JP2014099827 A JP 2014099827A JP 6383177 B2 JP6383177 B2 JP 6383177B2
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JP
Japan
Prior art keywords
shot
exposure
stage
target trajectory
upper limit
Prior art date
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Expired - Fee Related
Application number
JP2014099827A
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English (en)
Japanese (ja)
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JP2015216326A5 (enExample
JP2015216326A (ja
Inventor
規和 馬場
規和 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014099827A priority Critical patent/JP6383177B2/ja
Priority to US14/703,967 priority patent/US9372409B2/en
Priority to KR1020150062880A priority patent/KR101818045B1/ko
Publication of JP2015216326A publication Critical patent/JP2015216326A/ja
Publication of JP2015216326A5 publication Critical patent/JP2015216326A5/ja
Application granted granted Critical
Publication of JP6383177B2 publication Critical patent/JP6383177B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2014099827A 2014-05-13 2014-05-13 露光装置及びその制御方法、並びにデバイスの製造方法 Expired - Fee Related JP6383177B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014099827A JP6383177B2 (ja) 2014-05-13 2014-05-13 露光装置及びその制御方法、並びにデバイスの製造方法
US14/703,967 US9372409B2 (en) 2014-05-13 2015-05-05 Exposure apparatus, control method thereof, and device fabrication method
KR1020150062880A KR101818045B1 (ko) 2014-05-13 2015-05-06 노광장치 및 그 제어방법, 및 디바이스의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014099827A JP6383177B2 (ja) 2014-05-13 2014-05-13 露光装置及びその制御方法、並びにデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2015216326A JP2015216326A (ja) 2015-12-03
JP2015216326A5 JP2015216326A5 (enExample) 2017-06-08
JP6383177B2 true JP6383177B2 (ja) 2018-08-29

Family

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Family Applications (1)

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JP2014099827A Expired - Fee Related JP6383177B2 (ja) 2014-05-13 2014-05-13 露光装置及びその制御方法、並びにデバイスの製造方法

Country Status (3)

Country Link
US (1) US9372409B2 (enExample)
JP (1) JP6383177B2 (enExample)
KR (1) KR101818045B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2020782A (en) 2017-05-23 2018-11-28 Asml Netherlands Bv Setpoint generator, lithographic apparatus, lithographic apparatus operating method, and device manufacturing method
CN108470231B (zh) * 2018-01-24 2021-07-16 天津大学 考虑储能系统量化特征的配电网分布式储能选址定容方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0659741A (ja) * 1992-08-07 1994-03-04 Komatsu Ltd 軌道制御装置
JP3377153B2 (ja) * 1996-01-19 2003-02-17 キヤノン株式会社 Ｘｙステージの制御方法および装置
JPH10303126A (ja) * 1997-02-28 1998-11-13 Nikon Corp 移動シーケンスの決定方法
JP2000286177A (ja) * 1999-03-29 2000-10-13 Toshiba Corp ステージ制御方法および制御装置
US6772029B2 (en) * 2000-01-17 2004-08-03 Ebara Corporation Wafer transfer control apparatus and method for transferring wafer
JP2001230183A (ja) * 2000-02-16 2001-08-24 Nikon Corp 走査露光装置、走査露光方法及びデバイス製造方法
US6760641B2 (en) * 2001-08-08 2004-07-06 Asml Holding N.V. Discrete time trajectory planner for lithography system
CN100581969C (zh) * 2001-12-10 2010-01-20 三菱电机株式会社 电梯控制装置
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
US7016019B2 (en) * 2003-12-16 2006-03-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4953923B2 (ja) 2007-05-30 2012-06-13 キヤノン株式会社 露光装置及びデバイス製造方法
US8953141B2 (en) * 2007-12-21 2015-02-10 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with asymmetric acceleration profile of substrate table to maintain meniscus of immersion liquid
JP5012657B2 (ja) * 2008-05-19 2012-08-29 三菱電機株式会社 運動指令生成装置
JP5607316B2 (ja) * 2008-09-05 2014-10-15 キヤノン株式会社 露光装置及びデバイスの製造方法
NL2003835A (en) * 2008-12-22 2010-06-23 Asml Netherlands Bv Lithographic apparatus and control method.
JP2015201526A (ja) 2014-04-07 2015-11-12 キヤノン株式会社 プロファイル生成方法、露光装置およびデバイス製造方法

Also Published As

Publication number Publication date
KR20150130231A (ko) 2015-11-23
US9372409B2 (en) 2016-06-21
JP2015216326A (ja) 2015-12-03
US20150331327A1 (en) 2015-11-19
KR101818045B1 (ko) 2018-01-12

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