JP6375584B2 - 電子部品搭載用パッケージ - Google Patents

電子部品搭載用パッケージ Download PDF

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Publication number
JP6375584B2
JP6375584B2 JP2014071282A JP2014071282A JP6375584B2 JP 6375584 B2 JP6375584 B2 JP 6375584B2 JP 2014071282 A JP2014071282 A JP 2014071282A JP 2014071282 A JP2014071282 A JP 2014071282A JP 6375584 B2 JP6375584 B2 JP 6375584B2
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JP
Japan
Prior art keywords
electronic component
lead terminal
dielectric
conductive layer
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014071282A
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English (en)
Japanese (ja)
Other versions
JP2015195237A5 (enExample
JP2015195237A (ja
Inventor
研 大沢
研 大沢
春俊 三枝
春俊 三枝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
Original Assignee
Sumitomo Electric Device Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Priority to JP2014071282A priority Critical patent/JP6375584B2/ja
Priority to US14/673,328 priority patent/US9437509B2/en
Publication of JP2015195237A publication Critical patent/JP2015195237A/ja
Publication of JP2015195237A5 publication Critical patent/JP2015195237A5/ja
Application granted granted Critical
Publication of JP6375584B2 publication Critical patent/JP6375584B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2014071282A 2014-03-31 2014-03-31 電子部品搭載用パッケージ Active JP6375584B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014071282A JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ
US14/673,328 US9437509B2 (en) 2014-03-31 2015-03-30 Package for electronic components suppressing multipactor discharge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014071282A JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ

Publications (3)

Publication Number Publication Date
JP2015195237A JP2015195237A (ja) 2015-11-05
JP2015195237A5 JP2015195237A5 (enExample) 2017-06-01
JP6375584B2 true JP6375584B2 (ja) 2018-08-22

Family

ID=54192477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014071282A Active JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ

Country Status (2)

Country Link
US (1) US9437509B2 (enExample)
JP (1) JP6375584B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137682A1 (ja) * 2018-12-26 2020-07-02 住友電工デバイス・イノベーション株式会社 光半導体装置
CN112614900B (zh) * 2020-11-27 2022-08-30 中国电子科技集团公司第十三研究所 一种光导开关封装结构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571250A (en) * 1980-06-03 1982-01-06 Nec Corp Equipping structure of outside lead
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry
JP3009788B2 (ja) * 1991-11-15 2000-02-14 日本特殊陶業株式会社 集積回路用パッケージ
US5528079A (en) * 1991-12-23 1996-06-18 Gi Corporation Hermetic surface mount package for a two terminal semiconductor device
JP2854460B2 (ja) * 1992-05-28 1999-02-03 京セラ株式会社 半導体素子収納用パッケージ
JPH0613513A (ja) 1992-06-26 1994-01-21 Fujitsu Ltd マイクロ波半導体装置
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5700724A (en) * 1994-08-02 1997-12-23 Philips Electronic North America Corporation Hermetically sealed package for a high power hybrid circuit
US5750926A (en) * 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
JP4058172B2 (ja) * 1997-12-02 2008-03-05 株式会社住友金属エレクトロデバイス 光半導体素子収納用パッケージ
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap
JP4494587B2 (ja) * 2000-05-11 2010-06-30 古河電気工業株式会社 光半導体素子用パッケージおよび前記パッケージを用いた光半導体素子モジュール
JP2003249584A (ja) * 2002-02-25 2003-09-05 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
JP4480598B2 (ja) * 2004-02-26 2010-06-16 京セラ株式会社 電子部品収納用パッケージおよび電子装置
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
JP4817924B2 (ja) * 2006-03-29 2011-11-16 株式会社東芝 半導体パッケージ
JP2009076499A (ja) * 2007-09-18 2009-04-09 Toshiba Corp リード付基板、半導体パッケージ、及びリード付基板の製造方法
FR2949939A1 (fr) * 2009-09-04 2011-03-11 Thales Sa Traversee d'une paroi d'un boitier
JP5812671B2 (ja) * 2011-04-28 2015-11-17 京セラ株式会社 素子収納用パッケージおよびこれを備えた半導体装置

Also Published As

Publication number Publication date
US9437509B2 (en) 2016-09-06
US20150282357A1 (en) 2015-10-01
JP2015195237A (ja) 2015-11-05

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