JP2015195237A5 - - Google Patents

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Publication number
JP2015195237A5
JP2015195237A5 JP2014071282A JP2014071282A JP2015195237A5 JP 2015195237 A5 JP2015195237 A5 JP 2015195237A5 JP 2014071282 A JP2014071282 A JP 2014071282A JP 2014071282 A JP2014071282 A JP 2014071282A JP 2015195237 A5 JP2015195237 A5 JP 2015195237A5
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JP
Japan
Prior art keywords
conductive layer
dielectric
lead terminal
electronic component
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014071282A
Other languages
English (en)
Japanese (ja)
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JP2015195237A (ja
JP6375584B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014071282A priority Critical patent/JP6375584B2/ja
Priority claimed from JP2014071282A external-priority patent/JP6375584B2/ja
Priority to US14/673,328 priority patent/US9437509B2/en
Publication of JP2015195237A publication Critical patent/JP2015195237A/ja
Publication of JP2015195237A5 publication Critical patent/JP2015195237A5/ja
Application granted granted Critical
Publication of JP6375584B2 publication Critical patent/JP6375584B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014071282A 2014-03-31 2014-03-31 電子部品搭載用パッケージ Active JP6375584B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014071282A JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ
US14/673,328 US9437509B2 (en) 2014-03-31 2015-03-30 Package for electronic components suppressing multipactor discharge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014071282A JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ

Publications (3)

Publication Number Publication Date
JP2015195237A JP2015195237A (ja) 2015-11-05
JP2015195237A5 true JP2015195237A5 (enExample) 2017-06-01
JP6375584B2 JP6375584B2 (ja) 2018-08-22

Family

ID=54192477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014071282A Active JP6375584B2 (ja) 2014-03-31 2014-03-31 電子部品搭載用パッケージ

Country Status (2)

Country Link
US (1) US9437509B2 (enExample)
JP (1) JP6375584B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137682A1 (ja) * 2018-12-26 2020-07-02 住友電工デバイス・イノベーション株式会社 光半導体装置
CN112614900B (zh) * 2020-11-27 2022-08-30 中国电子科技集团公司第十三研究所 一种光导开关封装结构

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571250A (en) * 1980-06-03 1982-01-06 Nec Corp Equipping structure of outside lead
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
US4649229A (en) * 1985-08-12 1987-03-10 Aegis, Inc. All metal flat package for microcircuitry
JP3009788B2 (ja) * 1991-11-15 2000-02-14 日本特殊陶業株式会社 集積回路用パッケージ
US5528079A (en) * 1991-12-23 1996-06-18 Gi Corporation Hermetic surface mount package for a two terminal semiconductor device
JP2854460B2 (ja) * 1992-05-28 1999-02-03 京セラ株式会社 半導体素子収納用パッケージ
JPH0613513A (ja) 1992-06-26 1994-01-21 Fujitsu Ltd マイクロ波半導体装置
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5700724A (en) * 1994-08-02 1997-12-23 Philips Electronic North America Corporation Hermetically sealed package for a high power hybrid circuit
US5750926A (en) * 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US5792984A (en) * 1996-07-01 1998-08-11 Cts Corporation Molded aluminum nitride packages
JP4058172B2 (ja) * 1997-12-02 2008-03-05 株式会社住友金属エレクトロデバイス 光半導体素子収納用パッケージ
US6204448B1 (en) * 1998-12-04 2001-03-20 Kyocera America, Inc. High frequency microwave packaging having a dielectric gap
JP4494587B2 (ja) * 2000-05-11 2010-06-30 古河電気工業株式会社 光半導体素子用パッケージおよび前記パッケージを用いた光半導体素子モジュール
JP2003249584A (ja) * 2002-02-25 2003-09-05 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
JP4480598B2 (ja) * 2004-02-26 2010-06-16 京セラ株式会社 電子部品収納用パッケージおよび電子装置
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
JP4817924B2 (ja) * 2006-03-29 2011-11-16 株式会社東芝 半導体パッケージ
JP2009076499A (ja) * 2007-09-18 2009-04-09 Toshiba Corp リード付基板、半導体パッケージ、及びリード付基板の製造方法
FR2949939A1 (fr) * 2009-09-04 2011-03-11 Thales Sa Traversee d'une paroi d'un boitier
JP5812671B2 (ja) * 2011-04-28 2015-11-17 京セラ株式会社 素子収納用パッケージおよびこれを備えた半導体装置

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