JP6360760B2 - 銅張積層板及び回路基板 - Google Patents

銅張積層板及び回路基板 Download PDF

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Publication number
JP6360760B2
JP6360760B2 JP2014190773A JP2014190773A JP6360760B2 JP 6360760 B2 JP6360760 B2 JP 6360760B2 JP 2014190773 A JP2014190773 A JP 2014190773A JP 2014190773 A JP2014190773 A JP 2014190773A JP 6360760 B2 JP6360760 B2 JP 6360760B2
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JP
Japan
Prior art keywords
copper
clad laminate
copper foil
wiring
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014190773A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016060138A (ja
Inventor
真 大野
真 大野
綾香 田島
綾香 田島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2014190773A priority Critical patent/JP6360760B2/ja
Priority to TW104128735A priority patent/TWI651988B/zh
Priority to CN201510564561.9A priority patent/CN105451436B/zh
Priority to KR1020150130328A priority patent/KR20160034201A/ko
Publication of JP2016060138A publication Critical patent/JP2016060138A/ja
Application granted granted Critical
Publication of JP6360760B2 publication Critical patent/JP6360760B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP2014190773A 2014-09-19 2014-09-19 銅張積層板及び回路基板 Active JP6360760B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014190773A JP6360760B2 (ja) 2014-09-19 2014-09-19 銅張積層板及び回路基板
TW104128735A TWI651988B (zh) 2014-09-19 2015-09-01 覆銅疊層板及電路基板
CN201510564561.9A CN105451436B (zh) 2014-09-19 2015-09-07 覆铜叠层板及电路基板
KR1020150130328A KR20160034201A (ko) 2014-09-19 2015-09-15 구리 피복 적층판 및 회로 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014190773A JP6360760B2 (ja) 2014-09-19 2014-09-19 銅張積層板及び回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018119584A Division JP6578419B2 (ja) 2018-06-25 2018-06-25 銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
JP2016060138A JP2016060138A (ja) 2016-04-25
JP6360760B2 true JP6360760B2 (ja) 2018-07-18

Family

ID=55561092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014190773A Active JP6360760B2 (ja) 2014-09-19 2014-09-19 銅張積層板及び回路基板

Country Status (4)

Country Link
JP (1) JP6360760B2 (zh)
KR (1) KR20160034201A (zh)
CN (1) CN105451436B (zh)
TW (1) TWI651988B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022101499A (ja) 2020-12-24 2022-07-06 日鉄ケミカル＆マテリアル株式会社 両面金属張積層板及び回路基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070023877A1 (en) * 2003-09-10 2007-02-01 Hideo Yamazaki Chip on flex tape with dimension retention pattern
JP2009528933A (ja) * 2006-03-06 2009-08-13 エルジー・ケム・リミテッド 金属積層板およびその製造方法
KR101502653B1 (ko) * 2008-09-26 2015-03-13 스미토모 베이클라이트 가부시키가이샤 적층판, 회로판 및 반도체 장치
JP5689277B2 (ja) * 2009-10-22 2015-03-25 新日鉄住金化学株式会社 フレキシブル回路基板及び多層回路基板
JP5313191B2 (ja) * 2010-02-26 2013-10-09 新日鉄住金化学株式会社 金属張積層板及びその製造方法
TWI439492B (zh) * 2011-09-14 2014-06-01 Mortech Corp 聚醯亞胺膜
JP2014015674A (ja) * 2012-06-11 2014-01-30 Sh Copper Products Corp 圧延銅箔、および銅張積層板
TWI599277B (zh) * 2012-09-28 2017-09-11 新日鐵住金化學股份有限公司 可撓性覆銅積層板
CN103813616A (zh) * 2012-11-13 2014-05-21 昆山雅森电子材料科技有限公司 复合式叠构覆盖膜及具有该覆盖膜的电路板及其制法
JP6320031B2 (ja) * 2012-12-28 2018-05-09 新日鉄住金化学株式会社 フレキシブル銅張積層板
JP2014011451A (ja) * 2013-03-11 2014-01-20 Jx Nippon Mining & Metals Corp 圧延銅箔及びその製造方法、並びに、積層板
JP2016015359A (ja) * 2014-06-30 2016-01-28 新日鉄住金化学株式会社 金属張積層体の寸法安定性の評価方法及び回路基板の製造方法

Also Published As

Publication number Publication date
CN105451436A (zh) 2016-03-30
KR20160034201A (ko) 2016-03-29
JP2016060138A (ja) 2016-04-25
TW201613429A (en) 2016-04-01
TWI651988B (zh) 2019-02-21
CN105451436B (zh) 2019-02-26

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