JP6360174B2 - ３次元ワイヤボンド型インダクタ - Google Patents

３次元ワイヤボンド型インダクタ Download PDF

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Publication number
JP6360174B2
JP6360174B2 JP2016539293A JP2016539293A JP6360174B2 JP 6360174 B2 JP6360174 B2 JP 6360174B2 JP 2016539293 A JP2016539293 A JP 2016539293A JP 2016539293 A JP2016539293 A JP 2016539293A JP 6360174 B2 JP6360174 B2 JP 6360174B2
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JP
Japan
Prior art keywords
inductor
wire
wire loop
substrate
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2016539293A
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English (en)
Japanese (ja)
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JP2017501574A (ja
JP2017501574A5 (https=
Inventor
チェンジエ・ズオ
マリオ・フランシスコ・ヴェレス
ジョンヘ・キム
デイク・ダニエル・キム
チャンハン・ホビー・ユン
Original Assignee
クアルコム，インコーポレイテッド
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Publication of JP2017501574A publication Critical patent/JP2017501574A/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2866—Combination of wires and sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Wire Bonding (AREA)
  • Manufacturing & Machinery (AREA)
JP2016539293A 2013-12-23 2014-12-16 ３次元ワイヤボンド型インダクタ Expired - Fee Related JP6360174B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361920334P 2013-12-23 2013-12-23
US61/920,334 2013-12-23
US14/177,620 US9692386B2 (en) 2013-12-23 2014-02-11 Three-dimensional wire bond inductor
US14/177,620 2014-02-11
PCT/US2014/070517 WO2015100067A1 (en) 2013-12-23 2014-12-16 Three-dimensional wire bond inductor

Publications (3)

Publication Number Publication Date
JP2017501574A JP2017501574A (ja) 2017-01-12
JP2017501574A5 JP2017501574A5 (https=) 2017-09-28
JP6360174B2 true JP6360174B2 (ja) 2018-07-18

Family

ID=53401229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016539293A Expired - Fee Related JP6360174B2 (ja) 2013-12-23 2014-12-16 ３次元ワイヤボンド型インダクタ

Country Status (5)

Country Link
US (1) US9692386B2 (https=)
EP (1) EP3087600A1 (https=)
JP (1) JP6360174B2 (https=)
CN (1) CN105874594B (https=)
WO (1) WO2015100067A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9999121B2 (en) 2016-04-25 2018-06-12 Laird Technologies, Inc. Board level shields with virtual grounding capability
EP3282304B1 (fr) * 2016-08-08 2023-10-04 Essilor International Equipement ophtalmique; procédé d'alimentation d'un équipement ophtalmique
US10236852B2 (en) * 2016-12-09 2019-03-19 Nxp Usa, Inc. Parallel LC resonator and method therefor
CN106876372A (zh) * 2017-02-06 2017-06-20 无锡吉迈微电子有限公司 三维玻璃电感结构和制作工艺
CN109037196A (zh) * 2018-08-28 2018-12-18 湖南格兰德芯微电子有限公司 耦合电感结构
KR102830158B1 (ko) 2022-03-28 2025-07-07 삼성전자주식회사 캐패시터 와이어를 포함하는 칩 캐패시터
CN119731938A (zh) * 2023-02-17 2025-03-28 京东方科技集团股份有限公司 滤波器、集成无源器件、电子器件及显示装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648132A (en) * 1970-04-20 1972-03-07 Illinois Tool Works Multilayer capacitor and process for adjusting the value thereof
JPS5044258U (https=) * 1973-08-22 1975-05-06
JPS53117735A (en) * 1978-01-23 1978-10-14 Alps Electric Co Ltd Method of making thin film lc circuit
US4255728A (en) * 1978-08-24 1981-03-10 Doty Archibald C Jun Parallel resonant electric circuit
JPS60194508A (ja) * 1984-03-16 1985-10-03 Ricoh Co Ltd ワイヤボンデイングにより形成されたインダクタンス
JPH0693589B2 (ja) * 1989-03-23 1994-11-16 株式会社村田製作所 Ｌｃフィルター
JPH04354108A (ja) * 1991-05-31 1992-12-08 Sumitomo Electric Ind Ltd インダクタ素子
JPH05190331A (ja) * 1992-01-16 1993-07-30 Elmec Corp 電磁遅延線用インダクタンス素子およびその製造方法
JPH09106915A (ja) * 1995-10-13 1997-04-22 Matsushita Electric Ind Co Ltd 高周波用インダクタ
JPH1074625A (ja) * 1996-08-30 1998-03-17 Ikeda Takeshi インダクタ素子
JPH10289921A (ja) 1997-04-14 1998-10-27 Matsushita Electric Ind Co Ltd 半導体装置
JP3970393B2 (ja) * 1997-10-16 2007-09-05 富士通株式会社 等化フィルタ及び波形等化制御方法
US6586309B1 (en) * 2000-04-24 2003-07-01 Chartered Semiconductor Manufacturing Ltd. High performance RF inductors and transformers using bonding technique
JP2002164214A (ja) 2000-10-27 2002-06-07 Xerox Corp ボンディングワイヤを使用する非同一面マイクロコイル及びその製造方法
US6424223B1 (en) 2001-01-19 2002-07-23 Eic Corporation MMIC power amplifier with wirebond output matching circuit
JP2002290186A (ja) * 2001-03-26 2002-10-04 Tama Electric Co Ltd 低域通過フィルタ
KR100469248B1 (ko) * 2001-12-24 2005-02-02 엘지전자 주식회사 무선통신 모듈용 마이크로 인덕터
JP4255442B2 (ja) * 2002-09-10 2009-04-15 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー ワイヤ・ボンド・インダクタを有する半導体装置および方法
US7227240B2 (en) 2002-09-10 2007-06-05 Semiconductor Components Industries, L.L.C. Semiconductor device with wire bond inductor and method
JP2005026384A (ja) * 2003-06-30 2005-01-27 Tdk Corp インダクタ素子、それを含む電子部品及び製造方法
JP2006528854A (ja) * 2003-07-23 2006-12-21 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 小型インピーダンス変換回路
US7305223B2 (en) * 2004-12-23 2007-12-04 Freescale Semiconductor, Inc. Radio frequency circuit with integrated on-chip radio frequency signal coupler
US7518463B2 (en) * 2004-12-23 2009-04-14 Agilent Technologies, Inc. Circuit assembly with conical inductor
JP4591689B2 (ja) 2005-04-28 2010-12-01 Ｔｄｋ株式会社 Ｌｃ複合部品の製造方法
US8058951B2 (en) * 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
US7524731B2 (en) 2006-09-29 2009-04-28 Freescale Semiconductor, Inc. Process of forming an electronic device including an inductor
US8111521B2 (en) 2007-08-08 2012-02-07 Intel Corporation Package-based filtering and matching solutions
US20090236701A1 (en) * 2008-03-18 2009-09-24 Nanyang Technological University Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement
CN101794929B (zh) 2009-12-26 2013-01-02 华为技术有限公司 一种提升传输带宽的装置
US20130207745A1 (en) 2012-02-13 2013-08-15 Qualcomm Incorporated 3d rf l-c filters using through glass vias

Also Published As

Publication number Publication date
CN105874594B (zh) 2019-06-04
EP3087600A1 (en) 2016-11-02
US9692386B2 (en) 2017-06-27
US20150180437A1 (en) 2015-06-25
CN105874594A (zh) 2016-08-17
JP2017501574A (ja) 2017-01-12
WO2015100067A1 (en) 2015-07-02

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