JP6342566B1 - 部品保持装置及び部品接合システム - Google Patents

部品保持装置及び部品接合システム Download PDF

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Publication number
JP6342566B1
JP6342566B1 JP2017220805A JP2017220805A JP6342566B1 JP 6342566 B1 JP6342566 B1 JP 6342566B1 JP 2017220805 A JP2017220805 A JP 2017220805A JP 2017220805 A JP2017220805 A JP 2017220805A JP 6342566 B1 JP6342566 B1 JP 6342566B1
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Japan
Prior art keywords
holding device
component holding
cover
arrangement case
movable
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JP2017220805A
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English (en)
Japanese (ja)
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JP2019089114A (ja
Inventor
白鳥　俊幸
俊幸 白鳥
亨 川崎
亨 川崎
須賀　唯知
唯知 須賀
Original Assignee
アルファーデザイン株式会社
須賀　唯知
唯知 須賀
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Application filed by アルファーデザイン株式会社, 須賀　唯知, 唯知 須賀 filed Critical アルファーデザイン株式会社
Priority to JP2017220805A priority Critical patent/JP6342566B1/ja
Application granted granted Critical
Publication of JP6342566B1 publication Critical patent/JP6342566B1/ja
Priority to CN201810971646.2A priority patent/CN109801856B/zh
Publication of JP2019089114A publication Critical patent/JP2019089114A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2017220805A 2017-11-16 2017-11-16 部品保持装置及び部品接合システム Active JP6342566B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017220805A JP6342566B1 (ja) 2017-11-16 2017-11-16 部品保持装置及び部品接合システム
CN201810971646.2A CN109801856B (zh) 2017-11-16 2018-08-24 元件保持装置及元件接合系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017220805A JP6342566B1 (ja) 2017-11-16 2017-11-16 部品保持装置及び部品接合システム

Publications (2)

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JP6342566B1 true JP6342566B1 (ja) 2018-06-13
JP2019089114A JP2019089114A (ja) 2019-06-13

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ID=62556004

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JP2017220805A Active JP6342566B1 (ja) 2017-11-16 2017-11-16 部品保持装置及び部品接合システム

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JP (1) JP6342566B1 (zh)
CN (1) CN109801856B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020213502A1 (ja) * 2019-04-15 2021-05-20 株式会社新川 実装装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259203A (ja) * 1992-03-13 1993-10-08 Nippon Telegr & Teleph Corp <Ntt> 光学素子のボンディング装置及びこの装置を用いたボンディング方法
WO2014024343A1 (ja) * 2012-08-08 2014-02-13 パナソニック株式会社 実装方法
JP2015060902A (ja) * 2013-09-18 2015-03-30 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
WO2016157461A1 (ja) * 2015-03-31 2016-10-06 新電元工業株式会社 接合装置、接合方法及び加圧ユニット

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5091296B2 (ja) * 2010-10-18 2012-12-05 東京エレクトロン株式会社 接合装置
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259203A (ja) * 1992-03-13 1993-10-08 Nippon Telegr & Teleph Corp <Ntt> 光学素子のボンディング装置及びこの装置を用いたボンディング方法
WO2014024343A1 (ja) * 2012-08-08 2014-02-13 パナソニック株式会社 実装方法
JP2015060902A (ja) * 2013-09-18 2015-03-30 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
WO2016157461A1 (ja) * 2015-03-31 2016-10-06 新電元工業株式会社 接合装置、接合方法及び加圧ユニット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020213502A1 (ja) * 2019-04-15 2021-05-20 株式会社新川 実装装置
JP7132647B2 (ja) 2019-04-15 2022-09-07 株式会社新川 実装装置
KR102503964B1 (ko) * 2019-04-15 2023-02-28 가부시키가이샤 신가와 실장 장치

Also Published As

Publication number Publication date
CN109801856A (zh) 2019-05-24
JP2019089114A (ja) 2019-06-13
CN109801856B (zh) 2023-06-20

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