JP6332672B2 - 電池内蔵基板及びその製造方法 - Google Patents
電池内蔵基板及びその製造方法 Download PDFInfo
- Publication number
- JP6332672B2 JP6332672B2 JP2014084551A JP2014084551A JP6332672B2 JP 6332672 B2 JP6332672 B2 JP 6332672B2 JP 2014084551 A JP2014084551 A JP 2014084551A JP 2014084551 A JP2014084551 A JP 2014084551A JP 6332672 B2 JP6332672 B2 JP 6332672B2
- Authority
- JP
- Japan
- Prior art keywords
- secondary battery
- layer
- insulating layer
- covering
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0436—Small-sized flat cells or batteries for portable equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
- H01M50/11—Primary casings; Jackets or wrappings characterised by their shape or physical structure having a chip structure, e.g. micro-sized batteries integrated on chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/233—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions
- H01M50/24—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
- H01M6/40—Printed batteries, e.g. thin film batteries
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H10W42/00—
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- H10W70/09—
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- H10W90/00—
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
- H01M10/0562—Solid materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
- H01M10/0585—Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
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- H10W70/093—
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- H10W70/099—
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- H10W70/60—
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- H10W72/0198—
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- H10W72/073—
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- H10W72/241—
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- H10W72/874—
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- H10W72/9413—
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- H10W90/722—
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- H10W90/724—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Battery Mounting, Suspending (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014084551A JP6332672B2 (ja) | 2014-04-16 | 2014-04-16 | 電池内蔵基板及びその製造方法 |
| US14/685,664 US10249859B2 (en) | 2014-04-16 | 2015-04-14 | Battery built-in board and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014084551A JP6332672B2 (ja) | 2014-04-16 | 2014-04-16 | 電池内蔵基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015204263A JP2015204263A (ja) | 2015-11-16 |
| JP2015204263A5 JP2015204263A5 (enExample) | 2017-01-26 |
| JP6332672B2 true JP6332672B2 (ja) | 2018-05-30 |
Family
ID=54322733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014084551A Active JP6332672B2 (ja) | 2014-04-16 | 2014-04-16 | 電池内蔵基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10249859B2 (enExample) |
| JP (1) | JP6332672B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6223725B2 (ja) * | 2013-06-12 | 2017-11-01 | 新光電気工業株式会社 | 電池及びその製造方法 |
| KR101778057B1 (ko) | 2016-05-26 | 2017-09-13 | 목포해양대학교 산학협력단 | 전해질 기판을 이용한 배터리 집적 패키징 장치 및 방법 |
| JP6708991B2 (ja) * | 2016-10-03 | 2020-06-10 | 株式会社村田製作所 | 電池パック、電子機器、電動車両、電動工具および電力貯蔵システム |
| JP2019016653A (ja) * | 2017-07-04 | 2019-01-31 | 大日本印刷株式会社 | 導電基板、電子部品搭載基板および導電基板の製造方法 |
| JP7287596B2 (ja) * | 2019-07-22 | 2023-06-06 | 日清紡マイクロデバイス株式会社 | 電子回路装置およびその製造方法、ならびに電子回路装置の試験方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3813402B2 (ja) | 2000-01-31 | 2006-08-23 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| EP2434567A3 (en) * | 2006-07-18 | 2012-07-25 | Cymbet Corporation | Method and apparatus for solid-state microbattery photolithographic manufacture, singulation and passivation |
| JP4316604B2 (ja) | 2006-12-08 | 2009-08-19 | 株式会社東芝 | 電源一体型半導体モジュールおよびその製造方法 |
| WO2009051120A1 (ja) * | 2007-10-16 | 2009-04-23 | Sumitomo Bakelite Company Limited | 半導体素子搭載基板 |
| CN101589503B (zh) * | 2007-11-30 | 2012-05-30 | 株式会社村田制作所 | 电池模块及充电模块 |
| US8420252B2 (en) * | 2008-02-27 | 2013-04-16 | Cymbet Corporation | Battery layout incorporating full metal edge seal |
| EP2299515B1 (fr) * | 2009-08-28 | 2013-04-03 | STMicroelectronics (Tours) SAS | Procédé d'encapsulation d'une batterie de type lithium-ion en couches minces directement sur le substrat |
| JP2013518394A (ja) * | 2010-01-26 | 2013-05-20 | シンベット・コーポレイション | 電池アレイ、構造及び方法 |
| KR20150073192A (ko) * | 2012-10-15 | 2015-06-30 | 사임베트 코퍼레이션 | 유리 또는 세라믹 기판을 포함하는 박막 전지 |
| JP6144058B2 (ja) | 2013-01-31 | 2017-06-07 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JP6223725B2 (ja) * | 2013-06-12 | 2017-11-01 | 新光電気工業株式会社 | 電池及びその製造方法 |
-
2014
- 2014-04-16 JP JP2014084551A patent/JP6332672B2/ja active Active
-
2015
- 2015-04-14 US US14/685,664 patent/US10249859B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015204263A (ja) | 2015-11-16 |
| US10249859B2 (en) | 2019-04-02 |
| US20150303424A1 (en) | 2015-10-22 |
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