JP6332672B2 - 電池内蔵基板及びその製造方法 - Google Patents

電池内蔵基板及びその製造方法 Download PDF

Info

Publication number
JP6332672B2
JP6332672B2 JP2014084551A JP2014084551A JP6332672B2 JP 6332672 B2 JP6332672 B2 JP 6332672B2 JP 2014084551 A JP2014084551 A JP 2014084551A JP 2014084551 A JP2014084551 A JP 2014084551A JP 6332672 B2 JP6332672 B2 JP 6332672B2
Authority
JP
Japan
Prior art keywords
secondary battery
layer
insulating layer
covering
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014084551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015204263A5 (enExample
JP2015204263A (ja
Inventor
窪田 和之
和之 窪田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014084551A priority Critical patent/JP6332672B2/ja
Priority to US14/685,664 priority patent/US10249859B2/en
Publication of JP2015204263A publication Critical patent/JP2015204263A/ja
Publication of JP2015204263A5 publication Critical patent/JP2015204263A5/ja
Application granted granted Critical
Publication of JP6332672B2 publication Critical patent/JP6332672B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0436Small-sized flat cells or batteries for portable equipment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/102Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/11Primary casings; Jackets or wrappings characterised by their shape or physical structure having a chip structure, e.g. micro-sized batteries integrated on chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/233Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions
    • H01M50/24Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00Primary cells; Manufacture thereof
    • H01M6/40Printed batteries, e.g. thin film batteries
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H10W42/00
    • H10W70/09
    • H10W90/00
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/056Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
    • H01M10/0561Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
    • H01M10/0562Solid materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/058Construction or manufacture
    • H01M10/0585Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10037Printed or non-printed battery
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H10W70/093
    • H10W70/099
    • H10W70/60
    • H10W72/0198
    • H10W72/073
    • H10W72/241
    • H10W72/874
    • H10W72/9413
    • H10W90/722
    • H10W90/724
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Battery Mounting, Suspending (AREA)
JP2014084551A 2014-04-16 2014-04-16 電池内蔵基板及びその製造方法 Active JP6332672B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014084551A JP6332672B2 (ja) 2014-04-16 2014-04-16 電池内蔵基板及びその製造方法
US14/685,664 US10249859B2 (en) 2014-04-16 2015-04-14 Battery built-in board and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014084551A JP6332672B2 (ja) 2014-04-16 2014-04-16 電池内蔵基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015204263A JP2015204263A (ja) 2015-11-16
JP2015204263A5 JP2015204263A5 (enExample) 2017-01-26
JP6332672B2 true JP6332672B2 (ja) 2018-05-30

Family

ID=54322733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014084551A Active JP6332672B2 (ja) 2014-04-16 2014-04-16 電池内蔵基板及びその製造方法

Country Status (2)

Country Link
US (1) US10249859B2 (enExample)
JP (1) JP6332672B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6223725B2 (ja) * 2013-06-12 2017-11-01 新光電気工業株式会社 電池及びその製造方法
KR101778057B1 (ko) 2016-05-26 2017-09-13 목포해양대학교 산학협력단 전해질 기판을 이용한 배터리 집적 패키징 장치 및 방법
JP6708991B2 (ja) * 2016-10-03 2020-06-10 株式会社村田製作所 電池パック、電子機器、電動車両、電動工具および電力貯蔵システム
JP2019016653A (ja) * 2017-07-04 2019-01-31 大日本印刷株式会社 導電基板、電子部品搭載基板および導電基板の製造方法
JP7287596B2 (ja) * 2019-07-22 2023-06-06 日清紡マイクロデバイス株式会社 電子回路装置およびその製造方法、ならびに電子回路装置の試験方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3813402B2 (ja) 2000-01-31 2006-08-23 新光電気工業株式会社 半導体装置の製造方法
EP2434567A3 (en) * 2006-07-18 2012-07-25 Cymbet Corporation Method and apparatus for solid-state microbattery photolithographic manufacture, singulation and passivation
JP4316604B2 (ja) 2006-12-08 2009-08-19 株式会社東芝 電源一体型半導体モジュールおよびその製造方法
WO2009051120A1 (ja) * 2007-10-16 2009-04-23 Sumitomo Bakelite Company Limited 半導体素子搭載基板
CN101589503B (zh) * 2007-11-30 2012-05-30 株式会社村田制作所 电池模块及充电模块
US8420252B2 (en) * 2008-02-27 2013-04-16 Cymbet Corporation Battery layout incorporating full metal edge seal
EP2299515B1 (fr) * 2009-08-28 2013-04-03 STMicroelectronics (Tours) SAS Procédé d'encapsulation d'une batterie de type lithium-ion en couches minces directement sur le substrat
JP2013518394A (ja) * 2010-01-26 2013-05-20 シンベット・コーポレイション 電池アレイ、構造及び方法
KR20150073192A (ko) * 2012-10-15 2015-06-30 사임베트 코퍼레이션 유리 또는 세라믹 기판을 포함하는 박막 전지
JP6144058B2 (ja) 2013-01-31 2017-06-07 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP6223725B2 (ja) * 2013-06-12 2017-11-01 新光電気工業株式会社 電池及びその製造方法

Also Published As

Publication number Publication date
JP2015204263A (ja) 2015-11-16
US10249859B2 (en) 2019-04-02
US20150303424A1 (en) 2015-10-22

Similar Documents

Publication Publication Date Title
KR102620629B1 (ko) 반도체 장치의 제조 방법
JP5808586B2 (ja) インターポーザの製造方法
KR101134123B1 (ko) 반도체 장치
JP6342120B2 (ja) 超薄埋設ダイモジュール及びその製造方法
KR100637287B1 (ko) 반도체장치의 제조방법과 이것을 사용한 전자기기
US9392705B2 (en) Wiring board with through wiring
JP5608605B2 (ja) 配線基板の製造方法
JP5942823B2 (ja) 電子部品装置の製造方法、電子部品装置及び電子装置
US8502367B2 (en) Wafer-level packaging method using composite material as a base
JP6332672B2 (ja) 電池内蔵基板及びその製造方法
JP6606331B2 (ja) 電子装置
US9338886B2 (en) Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
JP2013243345A5 (enExample)
JP2008258383A (ja) 半導体装置及びその製造方法
JP6851239B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP2017038044A (ja) 配線基板及びその製造方法と電子部品装置
JP6144058B2 (ja) 配線基板及び配線基板の製造方法
JP2009252942A (ja) 部品内蔵配線板、部品内蔵配線板の製造方法
JP5281346B2 (ja) 半導体装置及びその製造方法
JP6319013B2 (ja) 電子装置及び電子装置の製造方法
JP5377403B2 (ja) 半導体装置及び回路基板の製造方法
JP4528018B2 (ja) 半導体装置及びその製造方法
JP6515243B2 (ja) 半導体装置の製造方法
JP2005217079A (ja) 半導体素子収納用パッケージおよびその製造方法
HK1211741A1 (en) System and method for manufacturing a fabricated carrier

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161206

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161206

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171019

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171031

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180403

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180418

R150 Certificate of patent or registration of utility model

Ref document number: 6332672

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150