JP6332672B2 - 電池内蔵基板及びその製造方法 - Google Patents
電池内蔵基板及びその製造方法 Download PDFInfo
- Publication number
- JP6332672B2 JP6332672B2 JP2014084551A JP2014084551A JP6332672B2 JP 6332672 B2 JP6332672 B2 JP 6332672B2 JP 2014084551 A JP2014084551 A JP 2014084551A JP 2014084551 A JP2014084551 A JP 2014084551A JP 6332672 B2 JP6332672 B2 JP 6332672B2
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- Prior art keywords
- secondary battery
- layer
- insulating layer
- covering
- insulating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
二次電池部品5は被覆絶縁部40及び接続電極30が上側を向いた状態で第2絶縁層62に埋設されている。このようにして、二次電池部品5は第1絶縁層52と第2絶縁層62との間に埋設されている。
Claims (8)
- 二次電池と、
前記二次電池を被覆する被覆絶縁部と、
前記被覆絶縁部に埋設され、前記被覆絶縁部から露出する接続電極とを備えた二次電池部品と、
前記二次電池部品が載置された第1絶縁層と、
前記第1絶縁層の上に形成され、前記二次電池部品を覆う第2絶縁層と、
前記二次電池部品の接続電極の上の前記第2絶縁層に形成されたビアホールと、
前記第2絶縁層の上に形成され、前記ビアホール内のビア導体を介して前記接続電極に接続される第1配線層と
を有し、
前記被覆絶縁部の剛性は、前記第1絶縁層及び前記第2絶縁層の剛性よりも低いことを特徴とする電池内蔵基板。 - 前記被覆絶縁部の上面と前記接続電極の上面とは同一面となっていることを特徴とする請求項1に記載の電池内蔵基板。
- 前記第1絶縁層の下面に形成された第2配線層と、
前記第1絶縁層及び前記第2絶縁層を貫通して形成された貫通孔とを有し、
前記第1配線層と前記第2配線層とが前記貫通孔に形成された貫通導体を介して接続されていることを特徴とする請求項1又は2に記載の電池内蔵基板。 - 前記第1配線層及び前記第2配線層の少なくとも一方に接続された電子部品を有することを特徴とする請求項3に記載の電池内蔵基板。
- 二次電池と、
前記二次電池を被覆する被覆絶縁部と、
前記被覆絶縁部に埋設され、前記被覆絶縁部から露出する接続電極とを備えた二次電池部品を用意する工程と、
第1絶縁層の上に、前記被覆絶縁部を上側にして二次電池部品を載置する工程と、
前記第1絶縁層の上に、前記二次電池部品を覆う第2絶縁層を形成する工程と、
前記二次電池部品の接続電極の上の前記第2絶縁層にビアホールを形成する工程と、
前記第2絶縁層の上に、前記ビアホール内のビア導体を介して前記二次電池部品の接続電極に接続される第1配線層を形成する工程と
を有し、
前記被覆絶縁部の剛性は、前記第1絶縁層及び前記第2絶縁層の剛性よりも低いことを特徴とする電池内蔵基板の製造方法。 - 前記ビアホールを形成する工程において、前記第1絶縁層及び前記第2絶縁層を貫通する貫通孔を同時に形成し、
前記第1配線層を形成する工程は、前記貫通孔に形成される貫通導体を介して前記第1配線層に接続される第2配線層を前記第1絶縁層の下面に形成することを含むこと特徴とする請求項5に記載の電池内蔵基板の製造方法。 - 前記二次電池部品を用意する工程は、
前記二次電池の接続部に金属バンプを形成する工程と、
前記金属バンプの先端側が前記被覆絶縁部から突出するように、前記二次電池の上に前記被覆絶縁部を形成する工程と、
前記金属バンプの先端側を平坦化して前記接続電極を得る工程とを含むことを特徴とする請求項5又は6に記載の電池内蔵基板の製造方法。 - 前記第1配線層及び前記第2配線層を形成する工程の後に、
前記第1配線層及び前記第2配線層の少なくともいずれかに電子部品を接続する工程を有することを特徴とする請求項6に記載の電池内蔵基板の製造方法。
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