JP6328679B2 - フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 - Google Patents
フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 Download PDFInfo
- Publication number
- JP6328679B2 JP6328679B2 JP2016063234A JP2016063234A JP6328679B2 JP 6328679 B2 JP6328679 B2 JP 6328679B2 JP 2016063234 A JP2016063234 A JP 2016063234A JP 2016063234 A JP2016063234 A JP 2016063234A JP 6328679 B2 JP6328679 B2 JP 6328679B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- flexible printed
- printed circuit
- copper
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 147
- 239000011889 copper foil Substances 0.000 title claims description 124
- 239000013078 crystal Substances 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 17
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 4
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 description 56
- 238000005097 cold rolling Methods 0.000 description 19
- 239000010408 film Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000001953 recrystallisation Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 238000000137 annealing Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000007670 refining Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016063234A JP6328679B2 (ja) | 2016-03-28 | 2016-03-28 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| TW106104023A TWI637071B (zh) | 2016-03-28 | 2017-02-08 | 可撓性印刷基板用銅箔、使用其之包銅層板、可撓性印刷基板、及電子機器 |
| KR1020170030413A KR102049636B1 (ko) | 2016-03-28 | 2017-03-10 | 플렉시블 프린트 기판용 동박, 그것을 사용한 구리 피복 적층체, 플렉시블 프린트 기판, 및 전자 기기 |
| CN201710192763.4A CN107241856B (zh) | 2016-03-28 | 2017-03-28 | 柔性印刷基板用铜箔、柔性印刷基板及电子设备 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016063234A JP6328679B2 (ja) | 2016-03-28 | 2016-03-28 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017179390A JP2017179390A (ja) | 2017-10-05 |
| JP6328679B2 true JP6328679B2 (ja) | 2018-05-23 |
Family
ID=59983417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016063234A Active JP6328679B2 (ja) | 2016-03-28 | 2016-03-28 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6328679B2 (zh) |
| KR (1) | KR102049636B1 (zh) |
| CN (1) | CN107241856B (zh) |
| TW (1) | TWI637071B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6793138B2 (ja) * | 2018-01-22 | 2020-12-02 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| JP6774457B2 (ja) * | 2018-05-16 | 2020-10-21 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
| JP7186141B2 (ja) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔 |
| JP7158434B2 (ja) * | 2020-05-14 | 2022-10-21 | Ｊｘ金属株式会社 | 銅合金インゴット、銅合金箔、および銅合金インゴットの製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4162087B2 (ja) * | 2003-08-22 | 2008-10-08 | 日鉱金属株式会社 | 高屈曲性圧延銅箔及びその製造方法 |
| JP4401180B2 (ja) * | 2004-01-30 | 2010-01-20 | 日鉱金属株式会社 | 圧延銅箔及びその製造方法、並びに積層基板 |
| JP4916154B2 (ja) * | 2005-10-12 | 2012-04-11 | Ｊｘ日鉱日石金属株式会社 | 回路用銅又は銅合金箔 |
| JP4428715B2 (ja) * | 2006-09-29 | 2010-03-10 | 日鉱金属株式会社 | 銅合金箔 |
| JP5356714B2 (ja) * | 2008-03-31 | 2013-12-04 | Ｊｘ日鉱日石金属株式会社 | エッチング性に優れたフレキシブルプリント基板用銅合金箔及びそれを用いたフレキシブルプリント基板 |
| JP5282675B2 (ja) * | 2009-06-23 | 2013-09-04 | 日立電線株式会社 | プリント配線板用銅箔およびその製造方法 |
| JP5705311B2 (ja) * | 2011-05-13 | 2015-04-22 | Jx日鉱日石金属株式会社 | 銅箔複合体及びそれに使用される銅箔、並びに成形体及びその製造方法 |
| JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
| KR101716988B1 (ko) * | 2012-09-10 | 2017-03-15 | 제이엑스금속주식회사 | 표면 처리 동박 및 그것을 사용한 적층판 |
| JP5362921B1 (ja) * | 2012-11-09 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板 |
| JP6377329B2 (ja) * | 2012-09-11 | 2018-08-22 | Ｊｘ金属株式会社 | キャリア付銅箔、銅張積層板の製造方法、及び、プリント配線板の製造方法 |
| JP2014077182A (ja) | 2012-10-12 | 2014-05-01 | Sh Copper Products Corp | 圧延銅箔 |
| TWI556951B (zh) * | 2012-11-09 | 2016-11-11 | Jx Nippon Mining & Metals Corp | Surface treatment of copper foil and the use of its laminated board |
| JP6497881B2 (ja) * | 2013-10-04 | 2019-04-10 | Ｊｘ金属株式会社 | 圧延銅箔、それを用いた銅張積層板、プリント配線板、電子機器、回路接続部材の製造方法及び回路接続部材 |
| CN104511479B (zh) * | 2013-10-04 | 2017-01-11 | Jx日矿日石金属株式会社 | 轧制铜箔 |
| JP6294376B2 (ja) * | 2016-02-05 | 2018-03-14 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
-
2016
- 2016-03-28 JP JP2016063234A patent/JP6328679B2/ja active Active
-
2017
- 2017-02-08 TW TW106104023A patent/TWI637071B/zh active
- 2017-03-10 KR KR1020170030413A patent/KR102049636B1/ko active IP Right Grant
- 2017-03-28 CN CN201710192763.4A patent/CN107241856B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102049636B1 (ko) | 2019-11-28 |
| JP2017179390A (ja) | 2017-10-05 |
| TW201802255A (zh) | 2018-01-16 |
| CN107241856B (zh) | 2019-07-05 |
| TWI637071B (zh) | 2018-10-01 |
| CN107241856A (zh) | 2017-10-10 |
| KR20170113104A (ko) | 2017-10-12 |
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