JP6320782B2 - アレイ基板 - Google Patents
アレイ基板 Download PDFInfo
- Publication number
- JP6320782B2 JP6320782B2 JP2014021559A JP2014021559A JP6320782B2 JP 6320782 B2 JP6320782 B2 JP 6320782B2 JP 2014021559 A JP2014021559 A JP 2014021559A JP 2014021559 A JP2014021559 A JP 2014021559A JP 6320782 B2 JP6320782 B2 JP 6320782B2
- Authority
- JP
- Japan
- Prior art keywords
- switching element
- connection wiring
- wiring pattern
- display
- array substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/427—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer having different thicknesses of the semiconductor bodies in different TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014021559A JP6320782B2 (ja) | 2014-02-06 | 2014-02-06 | アレイ基板 |
| US14/612,979 US9443914B2 (en) | 2014-02-06 | 2015-02-03 | Array substrate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014021559A JP6320782B2 (ja) | 2014-02-06 | 2014-02-06 | アレイ基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015148722A JP2015148722A (ja) | 2015-08-20 |
| JP2015148722A5 JP2015148722A5 (enExample) | 2017-03-02 |
| JP6320782B2 true JP6320782B2 (ja) | 2018-05-09 |
Family
ID=53755515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014021559A Active JP6320782B2 (ja) | 2014-02-06 | 2014-02-06 | アレイ基板 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9443914B2 (enExample) |
| JP (1) | JP6320782B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070725A (zh) * | 2015-07-21 | 2015-11-18 | 深圳市华星光电技术有限公司 | 一种平板显示器中的面板结构及制作方法 |
| KR102512715B1 (ko) * | 2015-09-15 | 2023-03-23 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 및 이의 제조 방법 |
| JP6621284B2 (ja) | 2015-09-28 | 2019-12-18 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102483956B1 (ko) * | 2016-03-31 | 2023-01-03 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| KR102523427B1 (ko) * | 2016-04-15 | 2023-04-20 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조 방법 |
| JP6965412B2 (ja) * | 2016-11-30 | 2021-11-10 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP6740108B2 (ja) * | 2016-11-30 | 2020-08-12 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP2020155280A (ja) | 2019-03-19 | 2020-09-24 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置及び電子機器 |
| KR102885847B1 (ko) * | 2019-09-11 | 2025-11-13 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3302625B2 (ja) * | 1997-08-07 | 2002-07-15 | シャープ株式会社 | 液晶表示装置 |
| JP4761782B2 (ja) * | 2005-01-27 | 2011-08-31 | 東芝モバイルディスプレイ株式会社 | 液晶表示装置及びその製造方法 |
| JP4697524B2 (ja) * | 2005-03-30 | 2011-06-08 | ソニー株式会社 | アクティブマトリクス型液晶表示装置 |
| JP2007093685A (ja) * | 2005-09-27 | 2007-04-12 | Sanyo Epson Imaging Devices Corp | 電気光学装置及び電子機器 |
| US8493543B2 (en) | 2008-10-17 | 2013-07-23 | Sony Corporation | Liquid crystal display device |
| JP5271661B2 (ja) * | 2008-10-17 | 2013-08-21 | 株式会社ジャパンディスプレイウェスト | 液晶表示装置 |
| TWI431606B (zh) * | 2010-12-31 | 2014-03-21 | Au Optronics Corp | 立體顯示器及其驅動方法 |
| JP6004560B2 (ja) * | 2011-10-06 | 2016-10-12 | 株式会社ジャパンディスプレイ | 表示装置 |
-
2014
- 2014-02-06 JP JP2014021559A patent/JP6320782B2/ja active Active
-
2015
- 2015-02-03 US US14/612,979 patent/US9443914B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9443914B2 (en) | 2016-09-13 |
| JP2015148722A (ja) | 2015-08-20 |
| US20150221705A1 (en) | 2015-08-06 |
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