JP6320782B2 - アレイ基板 - Google Patents

アレイ基板 Download PDF

Info

Publication number
JP6320782B2
JP6320782B2 JP2014021559A JP2014021559A JP6320782B2 JP 6320782 B2 JP6320782 B2 JP 6320782B2 JP 2014021559 A JP2014021559 A JP 2014021559A JP 2014021559 A JP2014021559 A JP 2014021559A JP 6320782 B2 JP6320782 B2 JP 6320782B2
Authority
JP
Japan
Prior art keywords
switching element
connection wiring
wiring pattern
display
array substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014021559A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015148722A5 (enExample
JP2015148722A (ja
Inventor
勇一 天野
勇一 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2014021559A priority Critical patent/JP6320782B2/ja
Priority to US14/612,979 priority patent/US9443914B2/en
Publication of JP2015148722A publication Critical patent/JP2015148722A/ja
Publication of JP2015148722A5 publication Critical patent/JP2015148722A5/ja
Application granted granted Critical
Publication of JP6320782B2 publication Critical patent/JP6320782B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0221Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/427Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer having different thicknesses of the semiconductor bodies in different TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/88Dummy elements, i.e. elements having non-functional features
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/123Connection of the pixel electrodes to the thin film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
JP2014021559A 2014-02-06 2014-02-06 アレイ基板 Active JP6320782B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014021559A JP6320782B2 (ja) 2014-02-06 2014-02-06 アレイ基板
US14/612,979 US9443914B2 (en) 2014-02-06 2015-02-03 Array substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014021559A JP6320782B2 (ja) 2014-02-06 2014-02-06 アレイ基板

Publications (3)

Publication Number Publication Date
JP2015148722A JP2015148722A (ja) 2015-08-20
JP2015148722A5 JP2015148722A5 (enExample) 2017-03-02
JP6320782B2 true JP6320782B2 (ja) 2018-05-09

Family

ID=53755515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014021559A Active JP6320782B2 (ja) 2014-02-06 2014-02-06 アレイ基板

Country Status (2)

Country Link
US (1) US9443914B2 (enExample)
JP (1) JP6320782B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105070725A (zh) * 2015-07-21 2015-11-18 深圳市华星光电技术有限公司 一种平板显示器中的面板结构及制作方法
KR102512715B1 (ko) * 2015-09-15 2023-03-23 삼성디스플레이 주식회사 플렉서블 표시장치 및 이의 제조 방법
JP6621284B2 (ja) 2015-09-28 2019-12-18 株式会社ジャパンディスプレイ 表示装置
KR102483956B1 (ko) * 2016-03-31 2023-01-03 삼성디스플레이 주식회사 디스플레이 장치
KR102523427B1 (ko) * 2016-04-15 2023-04-20 삼성디스플레이 주식회사 표시 패널 및 이의 제조 방법
JP6965412B2 (ja) * 2016-11-30 2021-11-10 株式会社ジャパンディスプレイ 表示装置
JP6740108B2 (ja) * 2016-11-30 2020-08-12 株式会社ジャパンディスプレイ 表示装置
JP2020155280A (ja) 2019-03-19 2020-09-24 ソニーセミコンダクタソリューションズ株式会社 表示装置及び電子機器
KR102885847B1 (ko) * 2019-09-11 2025-11-13 삼성디스플레이 주식회사 디스플레이 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3302625B2 (ja) * 1997-08-07 2002-07-15 シャープ株式会社 液晶表示装置
JP4761782B2 (ja) * 2005-01-27 2011-08-31 東芝モバイルディスプレイ株式会社 液晶表示装置及びその製造方法
JP4697524B2 (ja) * 2005-03-30 2011-06-08 ソニー株式会社 アクティブマトリクス型液晶表示装置
JP2007093685A (ja) * 2005-09-27 2007-04-12 Sanyo Epson Imaging Devices Corp 電気光学装置及び電子機器
US8493543B2 (en) 2008-10-17 2013-07-23 Sony Corporation Liquid crystal display device
JP5271661B2 (ja) * 2008-10-17 2013-08-21 株式会社ジャパンディスプレイウェスト 液晶表示装置
TWI431606B (zh) * 2010-12-31 2014-03-21 Au Optronics Corp 立體顯示器及其驅動方法
JP6004560B2 (ja) * 2011-10-06 2016-10-12 株式会社ジャパンディスプレイ 表示装置

Also Published As

Publication number Publication date
US9443914B2 (en) 2016-09-13
JP2015148722A (ja) 2015-08-20
US20150221705A1 (en) 2015-08-06

Similar Documents

Publication Publication Date Title
JP6320782B2 (ja) アレイ基板
US11714309B2 (en) Display device
JP5723007B2 (ja) アクティブマトリクス基板及びそれを備えた表示パネル
CN104335111B (zh) 液晶显示装置
JP5239368B2 (ja) アレイ基板および表示装置
JP5548488B2 (ja) 液晶表示パネル
JP6804256B2 (ja) 液晶表示パネルおよび液晶表示装置
TWI615749B (zh) 具有位置輸入功能之顯示裝置
JP5834133B2 (ja) アクティブマトリクス基板及びそれを備えた表示パネル
KR20100075063A (ko) 표시 패널 및 이의 제조 방법
JP2016057344A (ja) 表示装置
JP2011013618A (ja) 液晶表示装置
KR20110130854A (ko) 액정 표시 장치 및 그의 제조 방법
TW201541616A (zh) 液晶顯示裝置及其製造方法
US20170219899A1 (en) Active matrix substrate, liquid crystal panel, and method for manufacturing active matrix substrate
JP5706838B2 (ja) アクティブマトリクス基板及びそれを備えた表示パネル
JP2001092378A (ja) アクティブマトリクス基板
KR20130018056A (ko) 액정표시장치
JP2021139937A (ja) 表示装置
JP2010097114A (ja) 液晶表示装置
JP2023064656A (ja) アクティブマトリクス基板、表示パネル、及び表示装置
JP6180492B2 (ja) 液晶表示装置
JP2016075721A (ja) 液晶表示装置
JP2019174831A (ja) 液晶表示装置
JP2019078799A (ja) 液晶表示装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170127

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171219

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180306

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180404

R150 Certificate of patent or registration of utility model

Ref document number: 6320782

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350