JP6307791B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6307791B2
JP6307791B2 JP2013036820A JP2013036820A JP6307791B2 JP 6307791 B2 JP6307791 B2 JP 6307791B2 JP 2013036820 A JP2013036820 A JP 2013036820A JP 2013036820 A JP2013036820 A JP 2013036820A JP 6307791 B2 JP6307791 B2 JP 6307791B2
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light receiving
substrate
semiconductor device
receiving elements
elements
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Japanese (ja)
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JP2014165417A5 (enrdf_load_stackoverflow
JP2014165417A (ja
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菅谷　功
功 菅谷
史郎 綱井
史郎 綱井
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Nikon Corp
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Nikon Corp
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JP2013036820A 2013-02-27 2013-02-27 半導体装置 Active JP6307791B2 (ja)

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JP2013036820A JP6307791B2 (ja) 2013-02-27 2013-02-27 半導体装置

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JP2013036820A JP6307791B2 (ja) 2013-02-27 2013-02-27 半導体装置

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JP2014165417A JP2014165417A (ja) 2014-09-08
JP2014165417A5 JP2014165417A5 (enrdf_load_stackoverflow) 2017-03-30
JP6307791B2 true JP6307791B2 (ja) 2018-04-11

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10665623B2 (en) * 2015-02-27 2020-05-26 Sony Corporation Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatus
CN107615481B (zh) * 2015-05-18 2020-07-21 索尼公司 半导体装置和成像装置
US10020336B2 (en) 2015-12-28 2018-07-10 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device using three dimentional (3D) integration
CN107179575B (zh) 2016-03-09 2022-05-24 松下知识产权经营株式会社 光检测装置及光检测系统
JP6761974B2 (ja) * 2016-03-09 2020-09-30 パナソニックＩｐマネジメント株式会社 光検出装置および光検出システム
JP2018117027A (ja) * 2017-01-18 2018-07-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子装置、および、固体撮像素子の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181985A (ja) * 1995-12-22 1997-07-11 Sony Corp Ｃｃｄ型撮像素子及びその製造方法
JP4349232B2 (ja) * 2004-07-30 2009-10-21 ソニー株式会社 半導体モジュール及びｍｏｓ型固体撮像装置
KR100610481B1 (ko) * 2004-12-30 2006-08-08 매그나칩 반도체 유한회사 수광영역을 넓힌 이미지센서 및 그 제조 방법
JP2008227253A (ja) * 2007-03-14 2008-09-25 Fujifilm Corp 裏面照射型固体撮像素子
JP5517800B2 (ja) * 2010-07-09 2014-06-11 キヤノン株式会社 固体撮像装置用の部材および固体撮像装置の製造方法
JP5500007B2 (ja) * 2010-09-03 2014-05-21 ソニー株式会社 固体撮像素子およびカメラシステム
JP5835963B2 (ja) * 2011-06-24 2015-12-24 オリンパス株式会社 固体撮像装置、撮像装置、および信号読み出し方法
JP5791982B2 (ja) * 2011-07-06 2015-10-07 オリンパス株式会社 固体撮像装置、撮像装置、および信号読み出し方法

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