JP6298109B2 - 基板処理装置及びアライメント方法 - Google Patents

基板処理装置及びアライメント方法 Download PDF

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Publication number
JP6298109B2
JP6298109B2 JP2016136251A JP2016136251A JP6298109B2 JP 6298109 B2 JP6298109 B2 JP 6298109B2 JP 2016136251 A JP2016136251 A JP 2016136251A JP 2016136251 A JP2016136251 A JP 2016136251A JP 6298109 B2 JP6298109 B2 JP 6298109B2
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Japan
Prior art keywords
substrate
movement
alignment
processing
movement information
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JP2016136251A
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English (en)
Japanese (ja)
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JP2018003143A (ja
Inventor
康信 小林
康信 小林
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Canon Tokki Corp
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Canon Tokki Corp
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Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2016136251A priority Critical patent/JP6298109B2/ja
Priority to KR1020170086161A priority patent/KR102006067B1/ko
Priority to CN201710549222.2A priority patent/CN107591346B/zh
Priority to CN202111089795.4A priority patent/CN113808975B/zh
Publication of JP2018003143A publication Critical patent/JP2018003143A/ja
Application granted granted Critical
Publication of JP6298109B2 publication Critical patent/JP6298109B2/ja
Priority to KR1020190089809A priority patent/KR102061456B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP2016136251A 2016-07-08 2016-07-08 基板処理装置及びアライメント方法 Active JP6298109B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016136251A JP6298109B2 (ja) 2016-07-08 2016-07-08 基板処理装置及びアライメント方法
KR1020170086161A KR102006067B1 (ko) 2016-07-08 2017-07-06 기판 처리 장치 및 얼라인먼트 방법
CN201710549222.2A CN107591346B (zh) 2016-07-08 2017-07-07 基板处理装置及对准方法
CN202111089795.4A CN113808975B (zh) 2016-07-08 2017-07-07 基板处理装置及对准方法
KR1020190089809A KR102061456B1 (ko) 2016-07-08 2019-07-24 기판 처리 장치 및 얼라인먼트 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016136251A JP6298109B2 (ja) 2016-07-08 2016-07-08 基板処理装置及びアライメント方法

Publications (2)

Publication Number Publication Date
JP2018003143A JP2018003143A (ja) 2018-01-11
JP6298109B2 true JP6298109B2 (ja) 2018-03-20

Family

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Family Applications (1)

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JP2016136251A Active JP6298109B2 (ja) 2016-07-08 2016-07-08 基板処理装置及びアライメント方法

Country Status (3)

Country Link
JP (1) JP6298109B2 (zh)
KR (2) KR102006067B1 (zh)
CN (2) CN113808975B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379072B2 (ja) * 2019-01-11 2023-11-14 キヤノントッキ株式会社 成膜装置、電子デバイスの製造装置、成膜方法及び電子デバイスの製造装置
JP7259476B2 (ja) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
JP7262703B2 (ja) * 2019-06-11 2023-04-24 日本電気硝子株式会社 ガラスロールの製造方法
CN111092039B (zh) * 2019-12-30 2022-04-15 武汉大学 一种晶片传输系统
JP7446169B2 (ja) * 2020-06-26 2024-03-08 キヤノントッキ株式会社 基板搬送装置、基板処理システム、基板搬送方法、電子デバイスの製造方法、プログラム及び記憶媒体
CN111926306B (zh) * 2020-09-22 2020-12-22 上海陛通半导体能源科技股份有限公司 基于多工艺腔传送的沉积设备及晶圆沉积方法
JP7177128B2 (ja) * 2020-09-30 2022-11-22 キヤノントッキ株式会社 成膜装置、検知装置、検知方法、及び電子デバイスの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4239572B2 (ja) * 2002-11-27 2009-03-18 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び処理システム
JP4849825B2 (ja) * 2005-05-18 2012-01-11 東京エレクトロン株式会社 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体
KR100772843B1 (ko) * 2006-02-13 2007-11-02 삼성전자주식회사 웨이퍼 얼라인 장치 및 방법
JP4961895B2 (ja) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 ウェハ搬送装置、ウェハ搬送方法及び記憶媒体
JP2008173744A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
JP5064835B2 (ja) * 2007-02-28 2012-10-31 株式会社アルバック 基板搬送装置
JP5005428B2 (ja) * 2007-05-31 2012-08-22 株式会社アルバック 基板搬送方法、及び基板搬送装置
JP5390753B2 (ja) * 2007-06-04 2014-01-15 株式会社アルバック 基板搬送方法、及び基板搬送装置
JP2009194046A (ja) * 2008-02-13 2009-08-27 Hitachi High-Tech Control Systems Corp 基板搬送装置および基板の偏心補正方法
US8185242B2 (en) * 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
KR101517020B1 (ko) 2008-05-15 2015-05-04 삼성디스플레이 주식회사 유기전계발광표시장치의 제조장치 및 제조방법
JP5208800B2 (ja) * 2009-02-17 2013-06-12 東京エレクトロン株式会社 基板処理システム及び基板搬送方法
JP5773613B2 (ja) * 2010-10-25 2015-09-02 東京エレクトロン株式会社 異常原因分析方法及び異常分析プログラム
JP5851099B2 (ja) * 2011-01-21 2016-02-03 株式会社日立ハイテクノロジーズ 真空処理装置の運転方法
JP5600703B2 (ja) * 2012-03-30 2014-10-01 東京エレクトロン株式会社 搬送装置及び搬送方法
JP6118044B2 (ja) * 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN113808975A (zh) 2021-12-17
KR102061456B1 (ko) 2019-12-31
JP2018003143A (ja) 2018-01-11
KR20180006326A (ko) 2018-01-17
KR102006067B1 (ko) 2019-07-31
KR20190089822A (ko) 2019-07-31
CN107591346B (zh) 2022-02-11
CN113808975B (zh) 2023-05-16
CN107591346A (zh) 2018-01-16

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