JP6296961B2 - 配線基板およびそれを用いた発光装置の製造方法 - Google Patents

配線基板およびそれを用いた発光装置の製造方法 Download PDF

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Publication number
JP6296961B2
JP6296961B2 JP2014223475A JP2014223475A JP6296961B2 JP 6296961 B2 JP6296961 B2 JP 6296961B2 JP 2014223475 A JP2014223475 A JP 2014223475A JP 2014223475 A JP2014223475 A JP 2014223475A JP 6296961 B2 JP6296961 B2 JP 6296961B2
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Prior art keywords
porous ceramic
ceramic substrate
wiring
film
substrate
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Japanese (ja)
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JP2016092142A5 (https=
JP2016092142A (ja
Inventor
瑞惠 福島
福島　　瑞惠
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Priority to JP2014223475A priority Critical patent/JP6296961B2/ja
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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Led Device Packages (AREA)
JP2014223475A 2014-10-31 2014-10-31 配線基板およびそれを用いた発光装置の製造方法 Active JP6296961B2 (ja)

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JP2014223475A JP6296961B2 (ja) 2014-10-31 2014-10-31 配線基板およびそれを用いた発光装置の製造方法

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JP2014223475A JP6296961B2 (ja) 2014-10-31 2014-10-31 配線基板およびそれを用いた発光装置の製造方法

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JP2016092142A JP2016092142A (ja) 2016-05-23
JP2016092142A5 JP2016092142A5 (https=) 2017-06-29
JP6296961B2 true JP6296961B2 (ja) 2018-03-20

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020031079A1 (ja) * 2018-08-09 2020-02-13 積水化成品工業株式会社 有機無機複合粒子、その製造方法及びその用途
KR20210028216A (ko) * 2018-08-09 2021-03-11 세키스이가세이힝코교가부시키가이샤 유기 무기 복합 입자, 그 제조 방법 및 그 용도
JP2020026517A (ja) * 2018-08-09 2020-02-20 積水化成品工業株式会社 有機無機複合粒子の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190196A (ja) * 1996-12-26 1998-07-21 Canon Inc 絶縁膜及びその形成方法
DE19930782A1 (de) * 1999-07-03 2001-01-04 Bosch Gmbh Robert Verfahren zum selektiven Beschichten keramischer Oberflächenbereiche
JP2001291943A (ja) * 2000-04-06 2001-10-19 Matsushita Electric Ind Co Ltd 基板への電極パターン形成方法
JP4926481B2 (ja) * 2006-01-26 2012-05-09 共立エレックス株式会社 発光ダイオード用パッケージ及び発光ダイオード
JP2009239017A (ja) * 2008-03-27 2009-10-15 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP4980439B2 (ja) * 2010-03-02 2012-07-18 株式会社トクヤマ メタライズドセラミック基板の製造方法
JP2013251285A (ja) * 2010-09-22 2013-12-12 Sanyo Electric Co Ltd 発光装置用パッケージ及びその製造方法

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