JP6292908B2 - プリント回路板 - Google Patents

プリント回路板 Download PDF

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Publication number
JP6292908B2
JP6292908B2 JP2014018566A JP2014018566A JP6292908B2 JP 6292908 B2 JP6292908 B2 JP 6292908B2 JP 2014018566 A JP2014018566 A JP 2014018566A JP 2014018566 A JP2014018566 A JP 2014018566A JP 6292908 B2 JP6292908 B2 JP 6292908B2
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Japan
Prior art keywords
power supply
supply via
conductor
center point
via conductors
Prior art date
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JP2014018566A
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English (en)
Japanese (ja)
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JP2015146382A5 (https=
JP2015146382A (ja
Inventor
星　聡
聡 星
展輝 山下
展輝 山下
裕典 村井
裕典 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014018566A priority Critical patent/JP6292908B2/ja
Publication of JP2015146382A publication Critical patent/JP2015146382A/ja
Publication of JP2015146382A5 publication Critical patent/JP2015146382A5/ja
Application granted granted Critical
Publication of JP6292908B2 publication Critical patent/JP6292908B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2014018566A 2014-02-03 2014-02-03 プリント回路板 Active JP6292908B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014018566A JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014018566A JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Publications (3)

Publication Number Publication Date
JP2015146382A JP2015146382A (ja) 2015-08-13
JP2015146382A5 JP2015146382A5 (https=) 2017-03-09
JP6292908B2 true JP6292908B2 (ja) 2018-03-14

Family

ID=53890494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014018566A Active JP6292908B2 (ja) 2014-02-03 2014-02-03 プリント回路板

Country Status (1)

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JP (1) JP6292908B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6777525B2 (ja) * 2016-12-21 2020-10-28 日本碍子株式会社 電流検出用の耐熱性素子
TWI640229B (zh) 2017-04-14 2018-11-01 和碩聯合科技股份有限公司 電源信號傳遞結構及其設計方法
JP6984441B2 (ja) 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
JP2019201070A (ja) * 2018-05-15 2019-11-21 株式会社デンソーテン 多層基板及び多層基板を用いて素子に電流を供給する方法
WO2024204500A1 (ja) * 2023-03-31 2024-10-03 京セラ株式会社 印刷配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6153792A (ja) * 1984-08-23 1986-03-17 株式会社東芝 多層配線基板
JPH02137071U (https=) * 1989-04-13 1990-11-15
JPH10294564A (ja) * 1997-04-17 1998-11-04 Advantest Corp 多層プリント配線基板
JP3495917B2 (ja) * 1998-07-15 2004-02-09 日本特殊陶業株式会社 多層配線基板
JP5304185B2 (ja) * 2008-11-10 2013-10-02 富士通株式会社 プリント配線板および電子装置

Also Published As

Publication number Publication date
JP2015146382A (ja) 2015-08-13

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