JP2015146382A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015146382A5 JP2015146382A5 JP2014018566A JP2014018566A JP2015146382A5 JP 2015146382 A5 JP2015146382 A5 JP 2015146382A5 JP 2014018566 A JP2014018566 A JP 2014018566A JP 2014018566 A JP2014018566 A JP 2014018566A JP 2015146382 A5 JP2015146382 A5 JP 2015146382A5
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply via
- conductor
- via conductor
- center point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 60
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014018566A JP6292908B2 (ja) | 2014-02-03 | 2014-02-03 | プリント回路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014018566A JP6292908B2 (ja) | 2014-02-03 | 2014-02-03 | プリント回路板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015146382A JP2015146382A (ja) | 2015-08-13 |
| JP2015146382A5 true JP2015146382A5 (https=) | 2017-03-09 |
| JP6292908B2 JP6292908B2 (ja) | 2018-03-14 |
Family
ID=53890494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014018566A Active JP6292908B2 (ja) | 2014-02-03 | 2014-02-03 | プリント回路板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6292908B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6777525B2 (ja) * | 2016-12-21 | 2020-10-28 | 日本碍子株式会社 | 電流検出用の耐熱性素子 |
| TWI640229B (zh) | 2017-04-14 | 2018-11-01 | 和碩聯合科技股份有限公司 | 電源信號傳遞結構及其設計方法 |
| JP6984441B2 (ja) | 2018-01-25 | 2021-12-22 | 富士通株式会社 | 基板及び電子装置 |
| JP2019201070A (ja) * | 2018-05-15 | 2019-11-21 | 株式会社デンソーテン | 多層基板及び多層基板を用いて素子に電流を供給する方法 |
| WO2024204500A1 (ja) * | 2023-03-31 | 2024-10-03 | 京セラ株式会社 | 印刷配線板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6153792A (ja) * | 1984-08-23 | 1986-03-17 | 株式会社東芝 | 多層配線基板 |
| JPH02137071U (https=) * | 1989-04-13 | 1990-11-15 | ||
| JPH10294564A (ja) * | 1997-04-17 | 1998-11-04 | Advantest Corp | 多層プリント配線基板 |
| JP3495917B2 (ja) * | 1998-07-15 | 2004-02-09 | 日本特殊陶業株式会社 | 多層配線基板 |
| JP5304185B2 (ja) * | 2008-11-10 | 2013-10-02 | 富士通株式会社 | プリント配線板および電子装置 |
-
2014
- 2014-02-03 JP JP2014018566A patent/JP6292908B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015146382A5 (https=) | ||
| WO2013031535A3 (en) | Target structure and x-ray generating apparatus | |
| JP2015130329A5 (ja) | 蓄電装置及び電子機器 | |
| JP2011119654A5 (https=) | ||
| JP2015502021A5 (https=) | ||
| JP2016059147A5 (ja) | パワーモジュール及び電力変換装置 | |
| EP2770409A3 (en) | Touch panel and manufacturing method thereof | |
| JP2016040993A5 (https=) | ||
| WO2016069570A3 (en) | Circular power connectors | |
| WO2015015319A3 (en) | Architecture of spare wiring structures for improved engineering change orders | |
| JP2016136127A5 (https=) | ||
| JP2012227529A5 (https=) | ||
| JP2015153816A5 (https=) | ||
| JP6272173B2 (ja) | 配線基板 | |
| JP2013219182A5 (ja) | プリント回路板及びプリント配線板 | |
| JP2016529718A5 (https=) | ||
| JP2016012707A5 (https=) | ||
| MX360521B (es) | Tarjeta de circuito impreso, circuito y método para producir un circuito. | |
| JP2016076552A5 (https=) | ||
| JP2014150102A5 (https=) | ||
| GB2532869A (en) | Semiconductor die and package jigsaw submount | |
| JP2015050384A5 (https=) | ||
| JP2011023528A5 (https=) | ||
| WO2018126256A3 (en) | Conductive structure | |
| WO2013128198A3 (en) | Circuit board |