JP6288831B2 - ヒートスプレッダを有する半導体デバイスアセンブリ - Google Patents

ヒートスプレッダを有する半導体デバイスアセンブリ Download PDF

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Publication number
JP6288831B2
JP6288831B2 JP2014034907A JP2014034907A JP6288831B2 JP 6288831 B2 JP6288831 B2 JP 6288831B2 JP 2014034907 A JP2014034907 A JP 2014034907A JP 2014034907 A JP2014034907 A JP 2014034907A JP 6288831 B2 JP6288831 B2 JP 6288831B2
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JP
Japan
Prior art keywords
semiconductor die
pedestal portion
periphery
die
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014034907A
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English (en)
Japanese (ja)
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JP2014179602A (ja
JP2014179602A5 (https=
Inventor
ジェイ．カーペンター バートン
ジェイ．カーペンター バートン
エム．ヒギンズ ザ サード レオ
エム．ヒギンズ ザ サード レオ
ユアン ユアン
ユアン ユアン
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NXP USA Inc
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NXP USA Inc
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Publication of JP2014179602A publication Critical patent/JP2014179602A/ja
Publication of JP2014179602A5 publication Critical patent/JP2014179602A5/ja
Application granted granted Critical
Publication of JP6288831B2 publication Critical patent/JP6288831B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014034907A 2013-03-13 2014-02-26 ヒートスプレッダを有する半導体デバイスアセンブリ Expired - Fee Related JP6288831B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/799,031 2013-03-13
US13/799,031 US8754521B1 (en) 2013-03-13 2013-03-13 Semiconductor device assembly having a heat spreader

Publications (3)

Publication Number Publication Date
JP2014179602A JP2014179602A (ja) 2014-09-25
JP2014179602A5 JP2014179602A5 (https=) 2017-03-30
JP6288831B2 true JP6288831B2 (ja) 2018-03-07

Family

ID=50896797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014034907A Expired - Fee Related JP6288831B2 (ja) 2013-03-13 2014-02-26 ヒートスプレッダを有する半導体デバイスアセンブリ

Country Status (3)

Country Link
US (1) US8754521B1 (https=)
JP (1) JP6288831B2 (https=)
CN (1) CN104051358B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9899290B2 (en) 2016-03-23 2018-02-20 Nxp Usa, Inc. Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant
JP6748501B2 (ja) * 2016-07-14 2020-09-02 ローム株式会社 電子部品およびその製造方法
US11373930B2 (en) 2020-03-31 2022-06-28 Cisco Technology, Inc. Thermal packaging with fan out wafer level processing

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
JPH05211250A (ja) * 1992-01-30 1993-08-20 Nec Corp 樹脂封止型半導体装置
JPH06232294A (ja) * 1993-02-03 1994-08-19 Hitachi Ltd 半導体集積回路装置
JPH06349973A (ja) * 1993-06-14 1994-12-22 Sony Corp 樹脂封止型半導体装置
US6507116B1 (en) 1997-04-24 2003-01-14 International Business Machines Corporation Electronic package and method of forming
US6146921A (en) 1998-09-16 2000-11-14 Intel Corporation Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink
US5982621A (en) * 1998-11-23 1999-11-09 Caesar Technology Inc. Electronic device cooling arrangement
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6963141B2 (en) * 1999-12-31 2005-11-08 Jung-Yu Lee Semiconductor package for efficient heat spreading
JP2001358259A (ja) * 2000-06-15 2001-12-26 Seiko Epson Corp 半導体パッケージ
US20020079572A1 (en) 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US6534859B1 (en) * 2002-04-05 2003-03-18 St. Assembly Test Services Ltd. Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
JP4720372B2 (ja) * 2005-08-24 2011-07-13 富士ゼロックス株式会社 電源装置
KR101698932B1 (ko) * 2010-08-17 2017-01-23 삼성전자 주식회사 반도체 패키지 및 그 제조방법

Also Published As

Publication number Publication date
JP2014179602A (ja) 2014-09-25
CN104051358A (zh) 2014-09-17
US8754521B1 (en) 2014-06-17
CN104051358B (zh) 2018-04-13

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